GB1362942A - Semiconductor components - Google Patents

Abstract

1362942 Semi-conductor devices SIEMENS AG 29 Jan 1973 [3 May 1972] 4359/73 Heading H1K An enclosure for a semi-conductor element comprises two parts (Figs. 1, 2) each comprising an, e.g. ceramic insulant ring 1 to the upper face of which is applied annular lamina 6 of, e.g. glass fibre fabric saturated with a thermally hardenable, e.g. epoxy adhesive solid at room temperature, overlain by a dished cover-plate 2 of, e.g. silver plated copper. Annular plate 3 extending outwardly of the circumference of the ring, of metal having coefficient of thermal expansion approximating thereto is applied to the lower face of the ring over a lamina 7 similar to 6, and the assembly is pressed together at a temperature of, e.g. 200‹ C. to melt and harden the adhesive, the adherent surfaces being previously roughened. A semi-conductor body 12, of e.g. Si with Au and Mo electrodes 13 and 14 is inserted into the interior of the opposite halves with interposition of an, e.g. Cu terminal electrode 18, and the circumferentially extending edges of the annular plates are welded together, e.g. by annular induction electrodes 15, 16. Alternatively the housing halves may be interconnected by flanging the plate edges together. The cover-plates may alternatively have a solid centre section flush with their edges. The device may be applied to a disc thyristor with its centre electrode connected to the periphery of the annular plates. Reference has been directed by the Comptroller to Specification 1,121,080.