ES410341A1 - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
ES410341A1
ES410341A1 ES410341A ES410341A ES410341A1 ES 410341 A1 ES410341 A1 ES 410341A1 ES 410341 A ES410341 A ES 410341A ES 410341 A ES410341 A ES 410341A ES 410341 A1 ES410341 A1 ES 410341A1
Authority
ES
Spain
Prior art keywords
insulating material
rings
semiconductor element
joining
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES410341A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722221673 external-priority patent/DE2221673C3/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES410341A1 publication Critical patent/ES410341A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

Procedure for the manufacture of a construction semiconductor element with a disk-shaped casing, which includes a semiconductor element, consisting of two rings of insulating material presenting two front surfaces, and two annular metallic disks protruding from the edge of the rings of insulating material, by joining a front surface of each ring of insulating material with one of the cover plates and joining the other front face with one of the metal discs, by inserting the semiconductor element into a hole formed by one of the material rings insulator and one of the cover plates and by mechanical union of the metal discs on the outer edge, characterized in that at least one sheet is inserted between one of the front faces of the rings of insulating material and a cover plate annular, containing a hardenable glue, solid at room temperature and because the ring of insulating material, the sheet and The lid plate compresses each other to a temperature, at which the glue becomes liquid. (Machine-translation by Google Translate, not legally binding)
ES410341A 1972-05-03 1973-01-04 Semiconductor components Expired ES410341A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722221673 DE2221673C3 (en) 1972-05-03 Method for manufacturing a semiconductor component

Publications (1)

Publication Number Publication Date
ES410341A1 true ES410341A1 (en) 1976-01-01

Family

ID=5843952

Family Applications (1)

Application Number Title Priority Date Filing Date
ES410341A Expired ES410341A1 (en) 1972-05-03 1973-01-04 Semiconductor components

Country Status (10)

Country Link
JP (2) JPS4956587A (en)
AT (1) AT339374B (en)
BE (1) BE799037A (en)
CA (1) CA989523A (en)
CH (1) CH548669A (en)
ES (1) ES410341A1 (en)
FR (1) FR2182791B1 (en)
GB (1) GB1362942A (en)
IT (1) IT984159B (en)
NL (1) NL7306175A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8928492D0 (en) * 1989-12-18 1990-02-21 Westinghouse Brake & Signal Housings for semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264049A (en) * 1960-04-29
JPS5128505B2 (en) * 1972-02-03 1976-08-19
JPS5128505A (en) * 1974-09-04 1976-03-10 Nippon Steel Corp YOKORO

Also Published As

Publication number Publication date
DE2221673A1 (en) 1973-11-15
DE2221673B2 (en) 1977-04-14
JPS4956587A (en) 1974-06-01
NL7306175A (en) 1973-11-06
FR2182791B1 (en) 1977-12-30
CA989523A (en) 1976-05-18
BE799037A (en) 1973-11-05
CH548669A (en) 1974-04-30
JPS5778648U (en) 1982-05-15
AT339374B (en) 1977-10-10
GB1362942A (en) 1974-08-07
FR2182791A1 (en) 1973-12-14
IT984159B (en) 1974-11-20
ATA1062072A (en) 1977-02-15

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