GB8928492D0 - Housings for semiconductor devices - Google Patents

Housings for semiconductor devices

Info

Publication number
GB8928492D0
GB8928492D0 GB898928492A GB8928492A GB8928492D0 GB 8928492 D0 GB8928492 D0 GB 8928492D0 GB 898928492 A GB898928492 A GB 898928492A GB 8928492 A GB8928492 A GB 8928492A GB 8928492 D0 GB8928492 D0 GB 8928492D0
Authority
GB
United Kingdom
Prior art keywords
housings
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB898928492A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Westinghouse Brake and Signal Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd, Westinghouse Brake and Signal Holdings Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB898928492A priority Critical patent/GB8928492D0/en
Publication of GB8928492D0 publication Critical patent/GB8928492D0/en
Priority to GB9027122A priority patent/GB2239127B/en
Priority to DE9016960U priority patent/DE9016960U1/en
Priority to IT02240190A priority patent/IT1244184B/en
Priority to JP400785U priority patent/JPH0744050U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Bipolar Transistors (AREA)
GB898928492A 1989-12-18 1989-12-18 Housings for semiconductor devices Pending GB8928492D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB898928492A GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices
GB9027122A GB2239127B (en) 1989-12-18 1990-12-14 Housings for semiconductor devices
DE9016960U DE9016960U1 (en) 1989-12-18 1990-12-15 Housing for a semiconductor device
IT02240190A IT1244184B (en) 1989-12-18 1990-12-17 HOUSING STRUCTURE FOR SEMICONDUCTOR DEVICES
JP400785U JPH0744050U (en) 1989-12-18 1990-12-17 Housing for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898928492A GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices

Publications (1)

Publication Number Publication Date
GB8928492D0 true GB8928492D0 (en) 1990-02-21

Family

ID=10668090

Family Applications (2)

Application Number Title Priority Date Filing Date
GB898928492A Pending GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices
GB9027122A Expired - Fee Related GB2239127B (en) 1989-12-18 1990-12-14 Housings for semiconductor devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB9027122A Expired - Fee Related GB2239127B (en) 1989-12-18 1990-12-14 Housings for semiconductor devices

Country Status (4)

Country Link
JP (1) JPH0744050U (en)
DE (1) DE9016960U1 (en)
GB (2) GB8928492D0 (en)
IT (1) IT1244184B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469304B2 (en) * 1994-04-12 2003-11-25 三菱電機株式会社 Semiconductor device
JP5709491B2 (en) * 2010-11-30 2015-04-30 京セラクリスタルデバイス株式会社 Manufacturing method of electronic device
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2941688A (en) * 1957-12-31 1960-06-21 Tung Sol Electric Inc Encapsulation of electronic component and method of making the same
GB1038686A (en) * 1964-06-04 1966-08-10 Westinghouse Brake & Signal Improvements relating to the encapsulation of semi-conductor devices
GB1176519A (en) * 1967-11-28 1970-01-07 Westinghouse Brake & Signal Semiconductor Devices and the Manufacture Thereof
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
FR2182791B1 (en) * 1972-05-03 1977-12-30 Siemens Ag
JPH065686B2 (en) * 1985-09-04 1994-01-19 株式会社日立製作所 Pressure contact type semiconductor device

Also Published As

Publication number Publication date
GB9027122D0 (en) 1991-02-06
IT9022401A0 (en) 1990-12-17
JPH0744050U (en) 1995-10-24
IT9022401A1 (en) 1991-06-19
GB2239127A (en) 1991-06-19
IT1244184B (en) 1994-07-08
GB2239127B (en) 1993-07-07
DE9016960U1 (en) 1991-04-04

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