IT984159B - PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT - Google Patents

PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT

Info

Publication number
IT984159B
IT984159B IT2347873A IT2347873A IT984159B IT 984159 B IT984159 B IT 984159B IT 2347873 A IT2347873 A IT 2347873A IT 2347873 A IT2347873 A IT 2347873A IT 984159 B IT984159 B IT 984159B
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
semiconductor component
semiconductor
component
Prior art date
Application number
IT2347873A
Other languages
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722221673 external-priority patent/DE2221673C3/en
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT984159B publication Critical patent/IT984159B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
IT2347873A 1972-05-03 1973-04-27 PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT IT984159B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722221673 DE2221673C3 (en) 1972-05-03 Method for manufacturing a semiconductor component

Publications (1)

Publication Number Publication Date
IT984159B true IT984159B (en) 1974-11-20

Family

ID=5843952

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2347873A IT984159B (en) 1972-05-03 1973-04-27 PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT

Country Status (10)

Country Link
JP (2) JPS4956587A (en)
AT (1) AT339374B (en)
BE (1) BE799037A (en)
CA (1) CA989523A (en)
CH (1) CH548669A (en)
ES (1) ES410341A1 (en)
FR (1) FR2182791B1 (en)
GB (1) GB1362942A (en)
IT (1) IT984159B (en)
NL (1) NL7306175A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8928492D0 (en) * 1989-12-18 1990-02-21 Westinghouse Brake & Signal Housings for semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264049A (en) * 1960-04-29
JPS5128505B2 (en) * 1972-02-03 1976-08-19
JPS5128505A (en) * 1974-09-04 1976-03-10 Nippon Steel Corp YOKORO

Also Published As

Publication number Publication date
DE2221673B2 (en) 1977-04-14
FR2182791A1 (en) 1973-12-14
BE799037A (en) 1973-11-05
ATA1062072A (en) 1977-02-15
JPS5778648U (en) 1982-05-15
CH548669A (en) 1974-04-30
FR2182791B1 (en) 1977-12-30
NL7306175A (en) 1973-11-06
AT339374B (en) 1977-10-10
ES410341A1 (en) 1976-01-01
CA989523A (en) 1976-05-18
GB1362942A (en) 1974-08-07
DE2221673A1 (en) 1973-11-15
JPS4956587A (en) 1974-06-01

Similar Documents

Publication Publication Date Title
SE398319B (en) DEVICE MANUFACTURING DEVICE
IT955649B (en) METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
IT1037478B (en) PROCEDURE FOR MANUFACTURING SEMICONDUCTOR DEVICE
NO141480C (en) PROCEDURE FOR THE MANUFACTURING OF A EJECTOR DEVICE
IT940727B (en) PROCEDURE FOR MANUFACTURING A THERMOELECTRIC GENERATOR
IT998995B (en) PROCEDURE FOR MANUFACTURING AN INDUCTIVE ELECTRICAL COMPONENT
IT963303B (en) SEMICONDUCTOR LASER
IT969896B (en) PROCEDURE FOR MANUFACTURING ZEAXANTINE
IT1024956B (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTONE DEVICE
IT1033295B (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR DEVICE
DK143072C (en) PROCEDURE FOR MANUFACTURING A REMAGNETIZABLE DESIGN PART
IT969931B (en) BEAM LEAD SEMICONDUCTOR COMPONENT
AT376844B (en) SEMICONDUCTOR COMPONENT
IT941388B (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
NO149734C (en) PROCEDURE FOR MANUFACTURING UREA
IT989389B (en) PROCEDURE FOR MANUFACTURING A SLOT SCREEN
IT1060578B (en) PROCEDURE FOR MANUFACTURING SEMICONDUCTOR ELEMENTS
IT1039921B (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR DEVICE
IT991647B (en) PROCEDURE FOR MANUFACTURING A DRY FILTER
IT982341B (en) SEMICONDUCTOR COMPONENT
DK152384C (en) PROCEDURE FOR MANUFACTURING ISOMALTIT
IT994704B (en) PROCEDURE FOR THE MANUFACTURE OF A DEVICE INCLUDING A SEMICONDUCTOR
IT972620B (en) SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT
IT963314B (en) METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
IT984159B (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR COMPONENT