GB708054A - Improvements in or relating to mounting arrangements for devices employing semi-conductor rectifiers - Google Patents
Improvements in or relating to mounting arrangements for devices employing semi-conductor rectifiersInfo
- Publication number
- GB708054A GB708054A GB1473650A GB1473650A GB708054A GB 708054 A GB708054 A GB 708054A GB 1473650 A GB1473650 A GB 1473650A GB 1473650 A GB1473650 A GB 1473650A GB 708054 A GB708054 A GB 708054A
- Authority
- GB
- United Kingdom
- Prior art keywords
- araldite
- discs
- group
- wires
- crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Thermistors And Varistors (AREA)
Abstract
708,054. Semi-conductor devices. STANDARD TELEPHONES & CABLES, Ltd: June 8, 1951, Nos. 14736/50 and 20501/50. Class 37. The point contact electrode and semi-conductor body in a crystal rectifier device are embedded in a block of insulating thermosetting compound of the type claimed in one or more of the Specifications 518,057, 579,698, [both in Group IV], 629,111, 630,647, and 630,663, [all in Group IV(a)]. The insulating material is known as "Araldite" (Registered Trade Mark) adhesive resin or "Araldite" casting resin. In Fig. I, metal wires 3 and 4 penetrating ceramic discs 1 and 2, are fixed respectively to a tungsten, phosphor bronze or platinum alloy wire 7 and a germanium crystal 6. 'Araldite' casting resin is moulded around the whole, embedding the electrodes and forming a solid body or casing II. The assembly is then heated to harden the material. The ceramic discs may be replaced by metal discs, or the two wires may be formed with heads and no discs used, as shown in Fig. 5 . Identifying caps may be added. In Fig. 7 , an aluminium or nickel cup 23 is used to contain the 'Araldife' material. A disc or button contruction may also be used in which the two lead wires emerge from the same side of the disc. In Fig. 12, one lead wire 32 is provided with a spade portion to hold the crystal, and metal rings 35 and 3 6 are secured to the two lead wires to support the solid body 37 of 'Araldite' adhesive resin which is moulded around these elements, and then heated. The invention may also be applied to transistors. Specification 632,419, [Group XL(c)], also is referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2050150 | 1950-08-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB708054A true GB708054A (en) | 1954-04-28 |
Family
ID=10146929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1473650A Expired GB708054A (en) | 1950-08-18 | 1950-06-13 | Improvements in or relating to mounting arrangements for devices employing semi-conductor rectifiers |
Country Status (2)
Country | Link |
---|---|
BE (1) | BE503924A (en) |
GB (1) | GB708054A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1083439B (en) * | 1958-02-21 | 1960-06-15 | Siemens Ag | Process for manufacturing encapsulated semiconductor devices |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1021491B (en) * | 1953-12-21 | 1957-12-27 | Licentia Gmbh | Method for producing an electrically asymmetrically conductive semiconductor arrangement |
DE1039648B (en) * | 1955-04-30 | 1958-09-25 | Siemens Ag | Surface rectifier or transistor |
-
0
- BE BE503924D patent/BE503924A/xx unknown
-
1950
- 1950-06-13 GB GB1473650A patent/GB708054A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1083439B (en) * | 1958-02-21 | 1960-06-15 | Siemens Ag | Process for manufacturing encapsulated semiconductor devices |
DE1083439C2 (en) * | 1958-02-21 | 1960-12-08 | Siemens Ag | Process for the production of encapsulated semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
BE503924A (en) |
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