GB980558A - A semi-conductor device - Google Patents
A semi-conductor deviceInfo
- Publication number
- GB980558A GB980558A GB27119/62A GB2711962A GB980558A GB 980558 A GB980558 A GB 980558A GB 27119/62 A GB27119/62 A GB 27119/62A GB 2711962 A GB2711962 A GB 2711962A GB 980558 A GB980558 A GB 980558A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- semi
- base
- pin
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
980,558. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. July 13, 1962 [July 21, 1961], No. 27119/62. Heading H1K. A semi-conductor device includes a semiconductor element enclosed in a gas-tight housing and held in electrical and thermal contact with a base portion of the housing by spring means. As shown, semi-conductor body 7 with alloyed-in electrodes 6, 8 of aluminium and goldantimony, respectively, has a plate 4 of molybdenum, tantalum or tungsten alloyed to electrode 6. Electrical contact is made with the device by base-plate 1, 3 and pin 9 which has a plate 9a, similar to plate 4, soldered to its head. A sleeve 24 is provided within a cylinder 11 and two sets of dished springs 27 to 30 and 20 to 22, respectively, press plate 4 on to base 1 and pin 9 on to electrode 8, an insulating disc 18 being provided to isolate pin 9 from the housing. Cylinder 11 is welded to iron ring 2 soldered to the base 1. Pin 9 is gripped at its upper end by spring clip 15 mounted in body 14 soldered to sleeve 13 which is insulated from cylinder 11 by a " pressure-glass " seal 12. Layers 5, 8a of silver or other ductile metal may be placed between plate 4 and base 1, and between plate 9a and electrode 8. Further connections may be made to the semi-conductor element and the conductors may be attached to sleeve-like bodies insulated from the metal housing.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0074927 | 1961-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB980558A true GB980558A (en) | 1965-01-13 |
Family
ID=7504996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB27119/62A Expired GB980558A (en) | 1961-07-21 | 1962-07-13 | A semi-conductor device |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH396222A (en) |
DE (1) | DE1439092A1 (en) |
GB (1) | GB980558A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3395321A (en) * | 1966-07-11 | 1968-07-30 | Int Rectifier Corp | Compression bonded semiconductor device assembly |
EP1286393A2 (en) * | 2001-06-28 | 2003-02-26 | F & K Delvotec Bondtechnik GmbH | Circuit housing |
-
1961
- 1961-07-21 DE DE19611439092 patent/DE1439092A1/en active Pending
-
1962
- 1962-06-26 CH CH767062A patent/CH396222A/en unknown
- 1962-07-13 GB GB27119/62A patent/GB980558A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3395321A (en) * | 1966-07-11 | 1968-07-30 | Int Rectifier Corp | Compression bonded semiconductor device assembly |
EP1286393A2 (en) * | 2001-06-28 | 2003-02-26 | F & K Delvotec Bondtechnik GmbH | Circuit housing |
EP1286393A3 (en) * | 2001-06-28 | 2004-03-03 | F & K Delvotec Bondtechnik GmbH | Circuit housing |
US6891730B2 (en) * | 2001-06-28 | 2005-05-10 | F & K Delvotec Bondtechnik Gmbh | Circuit housing |
Also Published As
Publication number | Publication date |
---|---|
CH396222A (en) | 1965-07-31 |
DE1439092A1 (en) | 1968-11-28 |
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