GB980558A - A semi-conductor device - Google Patents

A semi-conductor device

Info

Publication number
GB980558A
GB980558A GB27119/62A GB2711962A GB980558A GB 980558 A GB980558 A GB 980558A GB 27119/62 A GB27119/62 A GB 27119/62A GB 2711962 A GB2711962 A GB 2711962A GB 980558 A GB980558 A GB 980558A
Authority
GB
United Kingdom
Prior art keywords
plate
semi
base
pin
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27119/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB980558A publication Critical patent/GB980558A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

980,558. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. July 13, 1962 [July 21, 1961], No. 27119/62. Heading H1K. A semi-conductor device includes a semiconductor element enclosed in a gas-tight housing and held in electrical and thermal contact with a base portion of the housing by spring means. As shown, semi-conductor body 7 with alloyed-in electrodes 6, 8 of aluminium and goldantimony, respectively, has a plate 4 of molybdenum, tantalum or tungsten alloyed to electrode 6. Electrical contact is made with the device by base-plate 1, 3 and pin 9 which has a plate 9a, similar to plate 4, soldered to its head. A sleeve 24 is provided within a cylinder 11 and two sets of dished springs 27 to 30 and 20 to 22, respectively, press plate 4 on to base 1 and pin 9 on to electrode 8, an insulating disc 18 being provided to isolate pin 9 from the housing. Cylinder 11 is welded to iron ring 2 soldered to the base 1. Pin 9 is gripped at its upper end by spring clip 15 mounted in body 14 soldered to sleeve 13 which is insulated from cylinder 11 by a " pressure-glass " seal 12. Layers 5, 8a of silver or other ductile metal may be placed between plate 4 and base 1, and between plate 9a and electrode 8. Further connections may be made to the semi-conductor element and the conductors may be attached to sleeve-like bodies insulated from the metal housing.
GB27119/62A 1961-07-21 1962-07-13 A semi-conductor device Expired GB980558A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0074927 1961-07-21

Publications (1)

Publication Number Publication Date
GB980558A true GB980558A (en) 1965-01-13

Family

ID=7504996

Family Applications (1)

Application Number Title Priority Date Filing Date
GB27119/62A Expired GB980558A (en) 1961-07-21 1962-07-13 A semi-conductor device

Country Status (3)

Country Link
CH (1) CH396222A (en)
DE (1) DE1439092A1 (en)
GB (1) GB980558A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395321A (en) * 1966-07-11 1968-07-30 Int Rectifier Corp Compression bonded semiconductor device assembly
EP1286393A2 (en) * 2001-06-28 2003-02-26 F & K Delvotec Bondtechnik GmbH Circuit housing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395321A (en) * 1966-07-11 1968-07-30 Int Rectifier Corp Compression bonded semiconductor device assembly
EP1286393A2 (en) * 2001-06-28 2003-02-26 F & K Delvotec Bondtechnik GmbH Circuit housing
EP1286393A3 (en) * 2001-06-28 2004-03-03 F & K Delvotec Bondtechnik GmbH Circuit housing
US6891730B2 (en) * 2001-06-28 2005-05-10 F & K Delvotec Bondtechnik Gmbh Circuit housing

Also Published As

Publication number Publication date
CH396222A (en) 1965-07-31
DE1439092A1 (en) 1968-11-28

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