GB1191232A - Semiconductor Devices and Their Manufacture - Google Patents

Semiconductor Devices and Their Manufacture

Info

Publication number
GB1191232A
GB1191232A GB722768A GB722768A GB1191232A GB 1191232 A GB1191232 A GB 1191232A GB 722768 A GB722768 A GB 722768A GB 722768 A GB722768 A GB 722768A GB 1191232 A GB1191232 A GB 1191232A
Authority
GB
United Kingdom
Prior art keywords
ring
diaphragms
contacts
insulating material
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB722768A
Inventor
Henry Arthur Collier
Robert Milford Wadsworth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB722768A priority Critical patent/GB1191232A/en
Publication of GB1191232A publication Critical patent/GB1191232A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Abstract

1,191,232. Semi-conductor devices. WESTINGHOUSE BRAKE ENGLISH ELECTRIC SEMICONDUCTORS Ltd. 14 Feb., 1969 [14 Feb., 1968], No. 7227/68. Heading H1K. In the manufacture of an encapsulated semiconductor device of the type in which the semiconductor element is gripped between two electrodes within a housing having two resilient diaphragms connected by insulating material at their outer peripheries, the parts except for this insulating material are located relative to one another prior to its provision by a ring of heat-resistant electrically insulating compound which encircles the element and grips the contacts (and, optionally, the element itself) but leaves the peripheries of the diaphragms protruding. The insulating material, which may be a cast block or two joined rings, each attached to one of the diaphragms, is then provided. The thyristor shown has annular diaphragms 6, 7 soldered to contacts 1, 2. In variants the diaphragms could be complete discs of larger diameter than the contacts, or the diaphragms could be formed integrally with their respective contacts. The ring 10 of silicone rubber compound grips the contacts and the semi-conductor element 3 (which is carried on the lower contact 2 by a silver disc 4). The ring is provided with an internal shoulder 15 which holds a gate terminal 5, 19 against an insulating ring which abuts the upper contact 1. The gate terminal extends through a slot in the ring and, beyond the ring, may have a long narrow portion to give a good seal in the cast insulating material 9 and also may be provided with a hole through which the insulating material extends to keep the contact in position.
GB722768A 1968-02-14 1968-02-14 Semiconductor Devices and Their Manufacture Expired GB1191232A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB722768A GB1191232A (en) 1968-02-14 1968-02-14 Semiconductor Devices and Their Manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB722768A GB1191232A (en) 1968-02-14 1968-02-14 Semiconductor Devices and Their Manufacture

Publications (1)

Publication Number Publication Date
GB1191232A true GB1191232A (en) 1970-05-13

Family

ID=9829079

Family Applications (1)

Application Number Title Priority Date Filing Date
GB722768A Expired GB1191232A (en) 1968-02-14 1968-02-14 Semiconductor Devices and Their Manufacture

Country Status (1)

Country Link
GB (1) GB1191232A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2419587A1 (en) * 1978-03-10 1979-10-05 Licentia Gmbh HIGH POWER DISCOID SEMICONDUCTOR COMPONENT IN PLASTIC ENCAPSULATION
WO1980000116A1 (en) * 1978-06-12 1980-01-24 Bbc Brown Boveri & Cie Mounting semi-conductor elements with insulating envelope

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2419587A1 (en) * 1978-03-10 1979-10-05 Licentia Gmbh HIGH POWER DISCOID SEMICONDUCTOR COMPONENT IN PLASTIC ENCAPSULATION
WO1980000116A1 (en) * 1978-06-12 1980-01-24 Bbc Brown Boveri & Cie Mounting semi-conductor elements with insulating envelope

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee