GB975573A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB975573A
GB975573A GB19115/61A GB1911561A GB975573A GB 975573 A GB975573 A GB 975573A GB 19115/61 A GB19115/61 A GB 19115/61A GB 1911561 A GB1911561 A GB 1911561A GB 975573 A GB975573 A GB 975573A
Authority
GB
United Kingdom
Prior art keywords
wafer
semi
base
disc
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19115/61A
Inventor
Frederick John Raymond
Frank Youlton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB19115/61A priority Critical patent/GB975573A/en
Priority to DEJ10547U priority patent/DE1865182U/en
Publication of GB975573A publication Critical patent/GB975573A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

975,573. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. May 26, 1961, No. 19115/61. Heading H1K. In a semi-conductor device, a semi-conductor element is conductively secured on one face of a generally flat base member, the opposite face of which forms a mounting surface for the device, and within a solid mass of potting material mechanically keyed to the base member by engagement with an undercut portion or portions thereof. As shown, a power rectifier comprises a diffused junction Si wafer 1 s oldered preferably with pure Pb, between a rod 2 and a disc 3 which, to permit etching with a HNO 3 - HF mixture, comprise, e.g. Au-plated Cu, or Ag. A protective coating 4, e.g. of silicone varnish, is applied to the exposed parts of the wafer 1, and disc 3 is fluxlessly soldered, e.g. with a Pb-In alloy, to a dovetail pedestal 5 on a Cu base 6 which has a threaded stem 7 for mounting on a chassis. A terminal 8 is secured to rod 2 by crimping at 9, and a mass of insulating potting material 10, e.g. epoxy resin, is moulded around the wafer, being keyed to the assembly at the pedestal undercut 11 and at 9. In a modification, the pedestal 5 is replaced by a dovetail ring integral with base 6 and surrounding the disc 3 which is soldered to the base. A flexible continuous wire with a solid head for attachment to the wafer may replace rod 2 and terminal 8 ;such a wire is indented to key with the potting material. Semi-conductor devices having two or more lead wires may he similarly encapsulated.
GB19115/61A 1961-05-26 1961-05-26 Improvements in or relating to semiconductor devices Expired GB975573A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB19115/61A GB975573A (en) 1961-05-26 1961-05-26 Improvements in or relating to semiconductor devices
DEJ10547U DE1865182U (en) 1961-05-26 1962-05-19 ELECTRIC SEMICONDUCTOR DEVICE.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB19115/61A GB975573A (en) 1961-05-26 1961-05-26 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB975573A true GB975573A (en) 1964-11-18

Family

ID=10124013

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19115/61A Expired GB975573A (en) 1961-05-26 1961-05-26 Improvements in or relating to semiconductor devices

Country Status (2)

Country Link
DE (1) DE1865182U (en)
GB (1) GB975573A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443168A (en) * 1966-06-03 1969-05-06 Westinghouse Electric Corp Resin encapsulated,compression bonded,disc-type semiconductor device
US3475662A (en) * 1967-11-22 1969-10-28 Westinghouse Electric Corp Hermetically sealed electrical device
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
US3743896A (en) * 1969-09-02 1973-07-03 Siemens Ag Semiconductor component structure for good thermal conductivity
FR2446541A1 (en) * 1979-01-12 1980-08-08 Sev Alternateurs Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin
FR2453500A1 (en) * 1979-04-04 1980-10-31 Sev Alternateurs Semiconductor rectifier for motor vehicle alternator - has diodes soldered to sockets on support plate, with extended contact cross=section
FR2454699A2 (en) * 1979-01-12 1980-11-14 Sev Alternateurs Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base
DE2942261A1 (en) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Encapsulated semiconductor device on support plate - has semiconductor element soldered between perforated plate and supply electrode and is encapsulated
EP0577966A1 (en) * 1992-07-06 1994-01-12 Motorola, Inc. Reduced stress plastic package
EP1087439A2 (en) * 1999-09-27 2001-03-28 Philips Corporate Intellectual Property GmbH Rectifier assembly for an alternator of a motor vehicle
FR2813441A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
FR2813442A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
WO2005086473A1 (en) * 2004-03-03 2005-09-15 Robert Bosch Gmbh Camera
WO2019110096A1 (en) * 2017-12-06 2019-06-13 Osram Opto Semiconductors Gmbh Lead frame, method for manufacturing a lead frame and semiconductor device with a lead frame

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443168A (en) * 1966-06-03 1969-05-06 Westinghouse Electric Corp Resin encapsulated,compression bonded,disc-type semiconductor device
US3475662A (en) * 1967-11-22 1969-10-28 Westinghouse Electric Corp Hermetically sealed electrical device
US3743896A (en) * 1969-09-02 1973-07-03 Siemens Ag Semiconductor component structure for good thermal conductivity
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
FR2446541A1 (en) * 1979-01-12 1980-08-08 Sev Alternateurs Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin
FR2454699A2 (en) * 1979-01-12 1980-11-14 Sev Alternateurs Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base
FR2453500A1 (en) * 1979-04-04 1980-10-31 Sev Alternateurs Semiconductor rectifier for motor vehicle alternator - has diodes soldered to sockets on support plate, with extended contact cross=section
DE2942261A1 (en) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Encapsulated semiconductor device on support plate - has semiconductor element soldered between perforated plate and supply electrode and is encapsulated
EP0577966A1 (en) * 1992-07-06 1994-01-12 Motorola, Inc. Reduced stress plastic package
EP1087439A2 (en) * 1999-09-27 2001-03-28 Philips Corporate Intellectual Property GmbH Rectifier assembly for an alternator of a motor vehicle
EP1087439A3 (en) * 1999-09-27 2004-09-08 International Rectifier Corporation Rectifier assembly for an alternator of a motor vehicle
FR2813441A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
FR2813442A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
ES2187365A1 (en) * 2000-08-31 2003-06-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
ES2188393A1 (en) * 2000-08-31 2003-06-16 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
WO2005086473A1 (en) * 2004-03-03 2005-09-15 Robert Bosch Gmbh Camera
WO2019110096A1 (en) * 2017-12-06 2019-06-13 Osram Opto Semiconductors Gmbh Lead frame, method for manufacturing a lead frame and semiconductor device with a lead frame

Also Published As

Publication number Publication date
DE1865182U (en) 1963-01-10

Similar Documents

Publication Publication Date Title
GB975573A (en) Improvements in or relating to semiconductor devices
US4117508A (en) Pressurizable semiconductor pellet assembly
GB1004020A (en) Improvements in or relating to the mounting of electrical components
GB1173737A (en) Hermetically Sealed Electrical Device
NL6405157A (en)
GB1507755A (en) Rectifier arrangements
ES358071A1 (en) Semiconductor having soft soldered connections thereto
GB1330528A (en) Mounting device for semiconductor wafers for use in the manu facture of semiconductor devices
GB1273175A (en) Semi-conductor devices
GB1020151A (en) Electrical semiconductor device
GB1182707A (en) Semiconductor Rectifier Circuit Assembly
JPS5721847A (en) Semiconductor device
GB956934A (en) Sealed semiconductor devices and mounting means therefor
GB855381A (en) Semiconductor device
GB1100737A (en) Semiconductor device junction stabilization
GB1000023A (en) Semi-conductor devices
GB926423A (en) Improvements in or relating to semiconductor rectifiers
JPS6464347A (en) Semiconductor integrated circuit
JPS57157550A (en) Semiconductor device
GB870599A (en) Improvements in or relating to semi-conductor crystal rectifiers and methods of manufacture thereof
GB1181297A (en) Semiconductor Devices having Pressure Contacts Employed therein
EP0052054A1 (en) Packaged semiconductor device which provides for enhanced power dissipation
GB1018876A (en) Semiconductor device header
JPS5461471A (en) Semiconductor device
GB1156345A (en) A Multiple Electrical Contact Assembly for Compression Bonded Semiconductor Devices