ES2188393A1 - Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles - Google Patents
Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehiclesInfo
- Publication number
- ES2188393A1 ES2188393A1 ES200101982A ES200101982A ES2188393A1 ES 2188393 A1 ES2188393 A1 ES 2188393A1 ES 200101982 A ES200101982 A ES 200101982A ES 200101982 A ES200101982 A ES 200101982A ES 2188393 A1 ES2188393 A1 ES 2188393A1
- Authority
- ES
- Spain
- Prior art keywords
- partition
- socket
- resin
- main part
- away
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 abstract 9
- 229920005989 resin Polymers 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 4
- 210000003414 extremity Anatomy 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 238000004873 anchoring Methods 0.000 abstract 1
- 239000012777 electrically insulating material Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000011152 fibreglass Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 210000001364 upper extremity Anatomy 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Synchronous Machinery (AREA)
Abstract
The power diode comprises a base (1) with a massive main part (10) extended axially into a socket (2) having on its free upper extremity a fastening plane (3) for a semiconductor element (101) placed below a connection element (100) and encapsulated by an electrically insulating resin (103) such as epoxy resin reinforced with fibreglass. The socket is surrounded by a partition (5) projecting from the main part (10) and forming a groove (4) which decouples the socket from the partition. The partition is with anchoring means in the form of a free extremity (51) projecting perpendicular to the partition and away from the socket, and both the groove (4) and the ring space exterior to the partition are filled with the resin in the process of encapsulation. The bottom of the groove (4) affects the main part (10), and the partition (5) extends axially to above the fastening plane (3) of the socket (2). The partition (5) has a skirting (50) in axial direction and the free extremity (51) extends in the direction perpendicular to the skirting and away from the socket. A ring layer (102) of electrically insulating material such as polyimide, which is more flexible than the resin, surrounds the semiconductor element (101) and is inserted radially between the element and the resin. In the first variant of the device, the partition is inclined with respect to the axial direction and away from the main part. In the second variant of the device, the partition is inclined and projects to a lower height than that of the fastening plane.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0011155A FR2813441B1 (en) | 2000-08-31 | 2000-08-31 | POWER DIODE FOR EQUIPPING THE RECTIFIER BRIDGE OF A ROTATING ELECTRIC MACHINE SUCH AS AN ALTERNATOR FOR A MOTOR VEHICLE |
FR0011155 | 2000-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2188393A1 true ES2188393A1 (en) | 2003-06-16 |
ES2188393B1 ES2188393B1 (en) | 2004-10-16 |
Family
ID=8853877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES200101982A Expired - Fee Related ES2188393B1 (en) | 2000-08-31 | 2001-08-29 | POWER DIODE SPECIALLY INTENDED TO EQUIP THE RECTIFIER BRIDGE OF A ROTATING ELECTRIC MACHINE, OF THE TYPE OF AN ALTERNATOR FOR MOTOR VEHICLE. |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES2188393B1 (en) |
FR (1) | FR2813441B1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB975573A (en) * | 1961-05-26 | 1964-11-18 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
US3441813A (en) * | 1966-12-21 | 1969-04-29 | Japan Storage Battery Co Ltd | Hermetically encapsulated barrier layer rectifier |
US3717523A (en) * | 1970-08-26 | 1973-02-20 | Siemens Ag | Method of gas-tight sealing of semiconductor components |
US3743896A (en) * | 1969-09-02 | 1973-07-03 | Siemens Ag | Semiconductor component structure for good thermal conductivity |
FR2446541A1 (en) * | 1979-01-12 | 1980-08-08 | Sev Alternateurs | Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin |
US5005069A (en) * | 1990-04-30 | 1991-04-02 | Motorola Inc. | Rectifier and method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3475662A (en) * | 1967-11-22 | 1969-10-28 | Westinghouse Electric Corp | Hermetically sealed electrical device |
FR2138070A1 (en) * | 1971-05-14 | 1972-12-29 | Lucas Industries Ltd | |
US4303935A (en) * | 1977-12-13 | 1981-12-01 | Robert Bosch Gmbh | Semiconductor apparatus with electrically insulated heat sink |
DE4341269A1 (en) * | 1993-12-03 | 1995-06-22 | Bosch Gmbh Robert | Rectifier diode |
-
2000
- 2000-08-31 FR FR0011155A patent/FR2813441B1/en not_active Expired - Lifetime
-
2001
- 2001-08-29 ES ES200101982A patent/ES2188393B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB975573A (en) * | 1961-05-26 | 1964-11-18 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
US3441813A (en) * | 1966-12-21 | 1969-04-29 | Japan Storage Battery Co Ltd | Hermetically encapsulated barrier layer rectifier |
US3743896A (en) * | 1969-09-02 | 1973-07-03 | Siemens Ag | Semiconductor component structure for good thermal conductivity |
US3717523A (en) * | 1970-08-26 | 1973-02-20 | Siemens Ag | Method of gas-tight sealing of semiconductor components |
FR2446541A1 (en) * | 1979-01-12 | 1980-08-08 | Sev Alternateurs | Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin |
US5005069A (en) * | 1990-04-30 | 1991-04-02 | Motorola Inc. | Rectifier and method |
Also Published As
Publication number | Publication date |
---|---|
FR2813441A1 (en) | 2002-03-01 |
FR2813441B1 (en) | 2005-01-14 |
ES2188393B1 (en) | 2004-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104795357B (en) | The method of manufacturing semiconductor devices | |
EP0791961A3 (en) | Power semiconductor module | |
CN103515340B (en) | Power module encapsulation and the method being used for manufacturing power module encapsulation | |
US7399660B2 (en) | Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same | |
FR2591801B1 (en) | ENCAPSULATION BOX OF AN ELECTRONIC CIRCUIT | |
EP0987758A3 (en) | Semiconducter device and method of producing the same | |
EP1032042A3 (en) | Semiconductor module, power converter using the same and manufacturing method thereof | |
ATE376707T1 (en) | ENCAPSULATION OF A DEVICE | |
CN101714542A (en) | Circuit device | |
CN104796008B (en) | Semiconductor device | |
GB1428605A (en) | Voltage-regulators for three-phase generators | |
TW429562B (en) | A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor | |
TW369710B (en) | Semiconductor apparatus and its producing method | |
DE69409003D1 (en) | CONNECTING DEVICE FOR POLES OF ELECTRICAL ACCUMULATORS | |
ES2188393A1 (en) | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles | |
CN103928447A (en) | Large-power full-airtight semiconductor module packaging structure | |
JPH03107356A (en) | Rectifier of three-phase a.c. generator in vehicle | |
TW200627558A (en) | High withstand voltage semiconductor device covered with resin, and its manufacturing method | |
US20180219462A1 (en) | Electric machine with press-fit electronics package | |
CN105957837B (en) | Encapsulating structure and packaging method for three-dimensional systematic encapsulation | |
TWI710138B (en) | Power device for rectifier | |
WO2006048930A1 (en) | Voltage controller of ac generator for vehicle | |
CN105977221A (en) | Airtight packaging structure and packaging method | |
ES2187365A1 (en) | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles | |
CN106024729A (en) | Printed circuit board including leadframe with inserted packaged semiconductor chips |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EC2A | Search report published |
Date of ref document: 20030616 Kind code of ref document: A1 |
|
FG2A | Definitive protection |
Ref document number: 2188393B1 Country of ref document: ES |
|
FD2A | Announcement of lapse in spain |
Effective date: 20180807 |