ES2188393A1 - Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles - Google Patents

Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles

Info

Publication number
ES2188393A1
ES2188393A1 ES200101982A ES200101982A ES2188393A1 ES 2188393 A1 ES2188393 A1 ES 2188393A1 ES 200101982 A ES200101982 A ES 200101982A ES 200101982 A ES200101982 A ES 200101982A ES 2188393 A1 ES2188393 A1 ES 2188393A1
Authority
ES
Spain
Prior art keywords
partition
socket
resin
main part
away
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200101982A
Other languages
Spanish (es)
Other versions
ES2188393B1 (en
Inventor
Georges-Louis Ledi
Corinne Volle
Laurent Thery
Dominique Sebille
Brice Lecole
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Publication of ES2188393A1 publication Critical patent/ES2188393A1/en
Application granted granted Critical
Publication of ES2188393B1 publication Critical patent/ES2188393B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01087Francium [Fr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Synchronous Machinery (AREA)

Abstract

The power diode comprises a base (1) with a massive main part (10) extended axially into a socket (2) having on its free upper extremity a fastening plane (3) for a semiconductor element (101) placed below a connection element (100) and encapsulated by an electrically insulating resin (103) such as epoxy resin reinforced with fibreglass. The socket is surrounded by a partition (5) projecting from the main part (10) and forming a groove (4) which decouples the socket from the partition. The partition is with anchoring means in the form of a free extremity (51) projecting perpendicular to the partition and away from the socket, and both the groove (4) and the ring space exterior to the partition are filled with the resin in the process of encapsulation. The bottom of the groove (4) affects the main part (10), and the partition (5) extends axially to above the fastening plane (3) of the socket (2). The partition (5) has a skirting (50) in axial direction and the free extremity (51) extends in the direction perpendicular to the skirting and away from the socket. A ring layer (102) of electrically insulating material such as polyimide, which is more flexible than the resin, surrounds the semiconductor element (101) and is inserted radially between the element and the resin. In the first variant of the device, the partition is inclined with respect to the axial direction and away from the main part. In the second variant of the device, the partition is inclined and projects to a lower height than that of the fastening plane.
ES200101982A 2000-08-31 2001-08-29 POWER DIODE SPECIALLY INTENDED TO EQUIP THE RECTIFIER BRIDGE OF A ROTATING ELECTRIC MACHINE, OF THE TYPE OF AN ALTERNATOR FOR MOTOR VEHICLE. Expired - Fee Related ES2188393B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0011155A FR2813441B1 (en) 2000-08-31 2000-08-31 POWER DIODE FOR EQUIPPING THE RECTIFIER BRIDGE OF A ROTATING ELECTRIC MACHINE SUCH AS AN ALTERNATOR FOR A MOTOR VEHICLE
FR0011155 2000-08-31

Publications (2)

Publication Number Publication Date
ES2188393A1 true ES2188393A1 (en) 2003-06-16
ES2188393B1 ES2188393B1 (en) 2004-10-16

Family

ID=8853877

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200101982A Expired - Fee Related ES2188393B1 (en) 2000-08-31 2001-08-29 POWER DIODE SPECIALLY INTENDED TO EQUIP THE RECTIFIER BRIDGE OF A ROTATING ELECTRIC MACHINE, OF THE TYPE OF AN ALTERNATOR FOR MOTOR VEHICLE.

Country Status (2)

Country Link
ES (1) ES2188393B1 (en)
FR (1) FR2813441B1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3441813A (en) * 1966-12-21 1969-04-29 Japan Storage Battery Co Ltd Hermetically encapsulated barrier layer rectifier
US3717523A (en) * 1970-08-26 1973-02-20 Siemens Ag Method of gas-tight sealing of semiconductor components
US3743896A (en) * 1969-09-02 1973-07-03 Siemens Ag Semiconductor component structure for good thermal conductivity
FR2446541A1 (en) * 1979-01-12 1980-08-08 Sev Alternateurs Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin
US5005069A (en) * 1990-04-30 1991-04-02 Motorola Inc. Rectifier and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475662A (en) * 1967-11-22 1969-10-28 Westinghouse Electric Corp Hermetically sealed electrical device
FR2138070A1 (en) * 1971-05-14 1972-12-29 Lucas Industries Ltd
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
DE4341269A1 (en) * 1993-12-03 1995-06-22 Bosch Gmbh Robert Rectifier diode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3441813A (en) * 1966-12-21 1969-04-29 Japan Storage Battery Co Ltd Hermetically encapsulated barrier layer rectifier
US3743896A (en) * 1969-09-02 1973-07-03 Siemens Ag Semiconductor component structure for good thermal conductivity
US3717523A (en) * 1970-08-26 1973-02-20 Siemens Ag Method of gas-tight sealing of semiconductor components
FR2446541A1 (en) * 1979-01-12 1980-08-08 Sev Alternateurs Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin
US5005069A (en) * 1990-04-30 1991-04-02 Motorola Inc. Rectifier and method

Also Published As

Publication number Publication date
FR2813441A1 (en) 2002-03-01
FR2813441B1 (en) 2005-01-14
ES2188393B1 (en) 2004-10-16

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