GB1077656A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1077656A
GB1077656A GB4331064A GB4331064A GB1077656A GB 1077656 A GB1077656 A GB 1077656A GB 4331064 A GB4331064 A GB 4331064A GB 4331064 A GB4331064 A GB 4331064A GB 1077656 A GB1077656 A GB 1077656A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
washers
metal foil
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4331064A
Inventor
Denis Fishman
Donald Valentine Stevenson
Frank Philip Mordecai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB4331064A priority Critical patent/GB1077656A/en
Priority to DE19651515899 priority patent/DE1515899A1/en
Publication of GB1077656A publication Critical patent/GB1077656A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,077,656. Semi-conductor device. STANDARD TELEPHONES & CABLES Ltd. Oct. 23, 1964, No. 43310/64. Heading H1K. Pressure contacts between the component parts of a semi-conductor device are made by inserting a metal foil between the contacting surfaces of the parts, heating the device in vacuo, applying and maintaining a pressure across the surfaces and allowing the device to cool. A semi-conductor body (1) of Si or Ge has two supporting discs (2) of material of corresponding thermal expansion, e,g. W or Mo, joined thereto by solder (3). The semiconductor may have P and/or N-type layers therein or these layers may be introduced by the solder. The lower supporting disc rests on a copper sink 6 but has interposed therebetween a metal foil (9) of low ductility, e.g. Ag. Above the upper supporting disc is another metal foil (7) and a copper electrode 4 having a connecting lead 5 bonded thereto. An insulating sleeve 13 is placed over lead 5 together with retaining washers 11 and 12 and spring washers 10. A screw-threaded collar 14 having holes for lugs 22 in its upper surface is mounted above the washers. The mounting apparatus is pumped out at 20 and heat applied by hotplate 16, a ram 19 is used to give a predetermined pressure on the semi-conductor device. The cap 17 is then rotated and its lugs 22 rotate the collar 14 which tightens down on to the washer 12. The pressurized semi-conductor assembly may then be hermetically sealed in another housing. The contacts between the supporting discs and the semi-conductor body may also be made the same way instead of soldering. An ordinary spring may be used in place of the spring washers. The device is allowed to cool in N 2 and then hermetically sealed in a second housing.
GB4331064A 1964-10-23 1964-10-23 Improvements in or relating to semiconductor devices Expired GB1077656A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB4331064A GB1077656A (en) 1964-10-23 1964-10-23 Improvements in or relating to semiconductor devices
DE19651515899 DE1515899A1 (en) 1964-10-23 1965-10-19 Process for producing pressure contacts between the individual parts of an electrical arrangement and device for carrying out the process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4331064A GB1077656A (en) 1964-10-23 1964-10-23 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1077656A true GB1077656A (en) 1967-08-02

Family

ID=10428201

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4331064A Expired GB1077656A (en) 1964-10-23 1964-10-23 Improvements in or relating to semiconductor devices

Country Status (2)

Country Link
DE (1) DE1515899A1 (en)
GB (1) GB1077656A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111048472A (en) * 2020-01-07 2020-04-21 芜湖乐知智能科技有限公司 Vacuum packaging structure with coating for infrared detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111048472A (en) * 2020-01-07 2020-04-21 芜湖乐知智能科技有限公司 Vacuum packaging structure with coating for infrared detector

Also Published As

Publication number Publication date
DE1515899A1 (en) 1969-12-11

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