GB910249A - Method of manufacturing hermetically sealed exposure devices - Google Patents
Method of manufacturing hermetically sealed exposure devicesInfo
- Publication number
- GB910249A GB910249A GB1847161A GB1847161A GB910249A GB 910249 A GB910249 A GB 910249A GB 1847161 A GB1847161 A GB 1847161A GB 1847161 A GB1847161 A GB 1847161A GB 910249 A GB910249 A GB 910249A
- Authority
- GB
- United Kingdom
- Prior art keywords
- flange
- copper
- soldered
- flanges
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Particle Accelerators (AREA)
Abstract
910,249. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. May 19, 1961, No. 18471/61. Class 37. [Also in Group XXII] In making an hermetically sealed enclosure for a semiconductor device with a base and a cap, each having a flange of cold - weldable material, only one of the flanges is backed with a permanently attached collar of non- deformable material and pressure is applied between the collar and the other flange to cold - pressure weld the flanges. A copper base 4 with a peripheral flange 6, of a semi - conductor rectifier, is force-fitted on the splines 2 of a steel hexagonal collar 1 so that the upper surface of a ridge 3 thereon contacts the underside of the flange. A silicon element 8 soldered between molybdenum discs 9, 10 is soldered in a well 7 in the base 4 and a flexible lead wire 12 with melted solid ends is soldered to the disc 10. A cap 14 with a copper peripheral flange 16 is placed on the base with the flanges 6, 16 in contact and the wire 12 enters a cavity 21 in a copper member 20 attached to a nickel-iron insert 19 secured in a glass ring 18 in a steel cylinder 17 brazed to a copper member 15. The assembly is placed in a recessed block 26 and an annular rod 27 is caused to cold weld the flanges. Excess flange material is cropped, the member 20 is crimped on the lead 12 and a flexible copper lead 24 is crimped and soldered in the member 20.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1847161A GB910249A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed exposure devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1847161A GB910249A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed exposure devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB910249A true GB910249A (en) | 1962-11-14 |
Family
ID=10113002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1847161A Expired GB910249A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed exposure devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB910249A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3842487A (en) * | 1971-10-18 | 1974-10-22 | Essex International Inc | Terminating of electrical conductors |
US5603449A (en) * | 1992-12-09 | 1997-02-18 | British Aerospace Public Limited Company | Forming of diffusion bonded joints in superplastically formed metal structures |
WO2011087157A1 (en) * | 2010-01-18 | 2011-07-21 | Yazaki Corporation | Wire end processing method |
-
1961
- 1961-05-19 GB GB1847161A patent/GB910249A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3842487A (en) * | 1971-10-18 | 1974-10-22 | Essex International Inc | Terminating of electrical conductors |
US5603449A (en) * | 1992-12-09 | 1997-02-18 | British Aerospace Public Limited Company | Forming of diffusion bonded joints in superplastically formed metal structures |
WO2011087157A1 (en) * | 2010-01-18 | 2011-07-21 | Yazaki Corporation | Wire end processing method |
US8490854B2 (en) | 2010-01-18 | 2013-07-23 | Yazaki Corporation | Wire end processing method |
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