GB941760A - Improvements in power transistors - Google Patents

Improvements in power transistors

Info

Publication number
GB941760A
GB941760A GB1199962A GB1199962A GB941760A GB 941760 A GB941760 A GB 941760A GB 1199962 A GB1199962 A GB 1199962A GB 1199962 A GB1199962 A GB 1199962A GB 941760 A GB941760 A GB 941760A
Authority
GB
United Kingdom
Prior art keywords
bonded
plate
silicon
electrode
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1199962A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pacific Semiconductors Inc
Original Assignee
Pacific Semiconductors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pacific Semiconductors Inc filed Critical Pacific Semiconductors Inc
Publication of GB941760A publication Critical patent/GB941760A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)

Abstract

941,760. Transistors. PACIFIC SEMICONDUCTORS Inc. March 29, 1962 [May 5, 1961], No. 11999/62. Heading H1K. In a high power transistor the emitter and base electrodes, situated on the same face of a semi-conductor wafer, are each formed of at least two comb-shaped parts, each set of teeth on one electrode being interdigitated with a corresponding set of teeth on the other. The spines of the combs are parallel and the parts of each electrode interconnected by U-shaped metal contact members the limbs of which are bonded to the spines of the combs. In the silicon transistor shown in Figs. 2 and 4, in which the emitter and base electrodes are designated 13, 14; 11, 12, respectively, the collector electrode on the opposite face of silicon wafer 10 is ohmically bonded to a hollow internally-threaded mounting stud 32 brazed into an aperture in base plate 33. Materials of high heat conductivity such as copper, steel or metallized ceramic are used for the stud and plate. The interconnecting U- shaped members 21a, 21b are made of a material with a thermal expansion coefficient matching that of silicon, e.g. certain iron-nickel-cobalt and molybdenum-tungsten alloys. Braided flexible conductors 47a, 47b bonded to the U-shaped members extend to the inner ends of contact pins 43, 44, insulatedly sealed through the base plate. A cap is hermetically sealed to the rim of this plate to complete the assembly. Specification 920,306 is referred to.
GB1199962A 1961-05-05 1962-03-29 Improvements in power transistors Expired GB941760A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10805461A 1961-05-05 1961-05-05

Publications (1)

Publication Number Publication Date
GB941760A true GB941760A (en) 1963-11-13

Family

ID=22320020

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1199962A Expired GB941760A (en) 1961-05-05 1962-03-29 Improvements in power transistors

Country Status (2)

Country Link
GB (1) GB941760A (en)
NL (1) NL276750A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors

Also Published As

Publication number Publication date
NL276750A (en)

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