GB963022A - Method of manufacturing hermetically sealed enclosure devices - Google Patents

Method of manufacturing hermetically sealed enclosure devices

Info

Publication number
GB963022A
GB963022A GB18470/61A GB1847061A GB963022A GB 963022 A GB963022 A GB 963022A GB 18470/61 A GB18470/61 A GB 18470/61A GB 1847061 A GB1847061 A GB 1847061A GB 963022 A GB963022 A GB 963022A
Authority
GB
United Kingdom
Prior art keywords
flange
cold
copper
soldered
deformable material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18470/61A
Inventor
Frederick John Raymond
Donald Valentine Stevenson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB18470/61A priority Critical patent/GB963022A/en
Publication of GB963022A publication Critical patent/GB963022A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

963,022. Welding by pressure. STANDARD TELEPHONES & CABLES Ltd. May 19, 1961, No. 18470/61. Heading B3R. [Also in Division H1] In making an hermetically sealed enclosure device with a flanged base and a flanged cap, one flange being of non-deformable material and the other of cold weldable material, the flange of non-deformable material is provided with a permanently attached member of cold weldable material, the flange of cold weldable material is provided with a permanently attached backing member of non-deformable material and pressure is applied to the members of non-deformable material to cold pressure weld the members of cold weldable material. A copper base 1 soldered to a semi-conductor rectifier element 5 has a radial flange 2, to the underside of which is welded or soldered a steel washer 4, and a steel cap 9 has a radial flange 10 to which is welded or soldered a copper washer 11 in contact with the flange 2. Annular tools 12, 13 in an hydraulic press act on the flange 10 arid washer 4 to cold weld the copper surfaces. A lead wire 6 is crimped in a copper tube 7 sealed in a glass ring 8 in the cap 9. The flanges 2, 4 and 10, 11 may be originally hexagonal or may be cropped to this shape after welding.
GB18470/61A 1961-05-19 1961-05-19 Method of manufacturing hermetically sealed enclosure devices Expired GB963022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB18470/61A GB963022A (en) 1961-05-19 1961-05-19 Method of manufacturing hermetically sealed enclosure devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB18470/61A GB963022A (en) 1961-05-19 1961-05-19 Method of manufacturing hermetically sealed enclosure devices

Publications (1)

Publication Number Publication Date
GB963022A true GB963022A (en) 1964-07-08

Family

ID=10112980

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18470/61A Expired GB963022A (en) 1961-05-19 1961-05-19 Method of manufacturing hermetically sealed enclosure devices

Country Status (1)

Country Link
GB (1) GB963022A (en)

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