GB963022A - Method of manufacturing hermetically sealed enclosure devices - Google Patents
Method of manufacturing hermetically sealed enclosure devicesInfo
- Publication number
- GB963022A GB963022A GB18470/61A GB1847061A GB963022A GB 963022 A GB963022 A GB 963022A GB 18470/61 A GB18470/61 A GB 18470/61A GB 1847061 A GB1847061 A GB 1847061A GB 963022 A GB963022 A GB 963022A
- Authority
- GB
- United Kingdom
- Prior art keywords
- flange
- cold
- copper
- soldered
- deformable material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 229910000831 Steel Inorganic materials 0.000 abstract 2
- 239000010959 steel Substances 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
963,022. Welding by pressure. STANDARD TELEPHONES & CABLES Ltd. May 19, 1961, No. 18470/61. Heading B3R. [Also in Division H1] In making an hermetically sealed enclosure device with a flanged base and a flanged cap, one flange being of non-deformable material and the other of cold weldable material, the flange of non-deformable material is provided with a permanently attached member of cold weldable material, the flange of cold weldable material is provided with a permanently attached backing member of non-deformable material and pressure is applied to the members of non-deformable material to cold pressure weld the members of cold weldable material. A copper base 1 soldered to a semi-conductor rectifier element 5 has a radial flange 2, to the underside of which is welded or soldered a steel washer 4, and a steel cap 9 has a radial flange 10 to which is welded or soldered a copper washer 11 in contact with the flange 2. Annular tools 12, 13 in an hydraulic press act on the flange 10 arid washer 4 to cold weld the copper surfaces. A lead wire 6 is crimped in a copper tube 7 sealed in a glass ring 8 in the cap 9. The flanges 2, 4 and 10, 11 may be originally hexagonal or may be cropped to this shape after welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB18470/61A GB963022A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed enclosure devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB18470/61A GB963022A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed enclosure devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB963022A true GB963022A (en) | 1964-07-08 |
Family
ID=10112980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB18470/61A Expired GB963022A (en) | 1961-05-19 | 1961-05-19 | Method of manufacturing hermetically sealed enclosure devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB963022A (en) |
-
1961
- 1961-05-19 GB GB18470/61A patent/GB963022A/en not_active Expired
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