GB1330081A - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
GB1330081A
GB1330081A GB1000172A GB1000172A GB1330081A GB 1330081 A GB1330081 A GB 1330081A GB 1000172 A GB1000172 A GB 1000172A GB 1000172 A GB1000172 A GB 1000172A GB 1330081 A GB1330081 A GB 1330081A
Authority
GB
United Kingdom
Prior art keywords
discs
semi
flanges
urged together
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1000172A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1330081A publication Critical patent/GB1330081A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)

Abstract

1330081 Semi-conductor devices SIEMENS AG 3 March 1972 [15 April 1971] 10001/72 Heading H1K Two rigid cover discs 1, 2 on opposite sides of a semi-conductor element 3 are urged together so that axially inwardly directed annular projections 5, 7 near their respective edges, e.g. situated on relatively thin radially outwardly projecting flanges 4, 6, are pressed into an elastic insulating ring 8 to seal the enclosure around the element 3. In the embodiment shown the discs 1, 2 are urged together by annular elastic claws 9, preferably integral with the ring 8. Alternative means for urging the discs 1, 2 together include a heat-shrunk plastics tube or co-acting screw-threaded caps engaging the flanges 4, 6. The discs 1, 2 may be of Cu or Cu and Mo, and may be Ni-coated where they contact the silvered electrodes of the element 3. The contacts may be soldered or maintained by pressure alone. Cooling bodies may be attached to the discs 1, 2.
GB1000172A 1971-04-15 1972-03-03 Semiconductor components Expired GB1330081A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (en) 1971-04-15 1971-04-15 Disc-shaped semiconductor component

Publications (1)

Publication Number Publication Date
GB1330081A true GB1330081A (en) 1973-09-12

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1000172A Expired GB1330081A (en) 1971-04-15 1972-03-03 Semiconductor components

Country Status (6)

Country Link
DE (1) DE2118356A1 (en)
FR (1) FR2133561B1 (en)
GB (1) GB1330081A (en)
IT (1) IT957175B (en)
NL (1) NL7202856A (en)
SE (1) SE383583B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (en) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Pressure contact semiconductor device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532C3 (en) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Disc-shaped semiconductor cell
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
DE3221794A1 (en) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim DISC-SHAPED SEMICONDUCTOR CELL FOR PRESSURE-CONTACTABLE POWER SEMICONDUCTOR COMPONENTS
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
DE102015113111B4 (en) * 2015-08-10 2020-01-30 Infineon Technologies Ag Power semiconductor module with improved sealing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (en) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (en) * 1967-11-09 1970-07-31 Ckd Praha Semiconductor component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (en) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Pressure contact semiconductor device

Also Published As

Publication number Publication date
SE383583B (en) 1976-03-15
FR2133561B1 (en) 1977-03-18
NL7202856A (en) 1972-10-17
FR2133561A1 (en) 1972-12-01
IT957175B (en) 1973-10-10
DE2118356A1 (en) 1972-10-26

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee