FR2133561B1 - - Google Patents

Info

Publication number
FR2133561B1
FR2133561B1 FR7146963A FR7146963A FR2133561B1 FR 2133561 B1 FR2133561 B1 FR 2133561B1 FR 7146963 A FR7146963 A FR 7146963A FR 7146963 A FR7146963 A FR 7146963A FR 2133561 B1 FR2133561 B1 FR 2133561B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7146963A
Other versions
FR2133561A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2133561A1 publication Critical patent/FR2133561A1/fr
Application granted granted Critical
Publication of FR2133561B1 publication Critical patent/FR2133561B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR7146963A 1971-04-15 1971-12-28 Expired FR2133561B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2133561A1 FR2133561A1 (fr) 1972-12-01
FR2133561B1 true FR2133561B1 (fr) 1977-03-18

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7146963A Expired FR2133561B1 (fr) 1971-04-15 1971-12-28

Country Status (6)

Country Link
DE (1) DE2118356A1 (fr)
FR (1) FR2133561B1 (fr)
GB (1) GB1330081A (fr)
IT (1) IT957175B (fr)
NL (1) NL7202856A (fr)
SE (1) SE383583B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532C3 (de) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Scheibenförmige Halbleiterzelle
FR2440077A1 (fr) * 1978-10-23 1980-05-23 Transformation En Cie Indle Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP5187343B2 (ja) * 2010-04-27 2013-04-24 三菱電機株式会社 圧接型半導体装置
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (fr) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (de) * 1967-11-09 1970-07-31 Ckd Praha Halbleiterbauelement

Also Published As

Publication number Publication date
IT957175B (it) 1973-10-10
NL7202856A (fr) 1972-10-17
FR2133561A1 (fr) 1972-12-01
GB1330081A (en) 1973-09-12
DE2118356A1 (de) 1972-10-26
SE383583B (sv) 1976-03-15

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Legal Events

Date Code Title Description
ST Notification of lapse