SE316534B - - Google Patents

Info

Publication number
SE316534B
SE316534B SE906165A SE906165A SE316534B SE 316534 B SE316534 B SE 316534B SE 906165 A SE906165 A SE 906165A SE 906165 A SE906165 A SE 906165A SE 316534 B SE316534 B SE 316534B
Authority
SE
Sweden
Application number
SE906165A
Inventor
N Andersson
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE906165A priority Critical patent/SE316534B/xx
Priority to NL6609153A priority patent/NL6609153A/xx
Priority to DE19661539652 priority patent/DE1539652A1/de
Priority to FR68754A priority patent/FR1486215A/fr
Publication of SE316534B publication Critical patent/SE316534B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SE906165A 1965-07-09 1965-07-09 SE316534B (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE906165A SE316534B (fr) 1965-07-09 1965-07-09
NL6609153A NL6609153A (fr) 1965-07-09 1966-06-30
DE19661539652 DE1539652A1 (de) 1965-07-09 1966-07-08 Halbleiteranordnung
FR68754A FR1486215A (fr) 1965-07-09 1966-07-08 Dispositif à semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE906165A SE316534B (fr) 1965-07-09 1965-07-09

Publications (1)

Publication Number Publication Date
SE316534B true SE316534B (fr) 1969-10-27

Family

ID=20275725

Family Applications (1)

Application Number Title Priority Date Filing Date
SE906165A SE316534B (fr) 1965-07-09 1965-07-09

Country Status (4)

Country Link
DE (1) DE1539652A1 (fr)
FR (1) FR1486215A (fr)
NL (1) NL6609153A (fr)
SE (1) SE316534B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805122A (en) * 1971-12-03 1974-04-16 Bbc Brown Boveri & Cie Semiconductor disc assembly providing predetermined compressive force against opposite faces of the disc by clamped heat-conductive bodies

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE2118356A1 (de) * 1971-04-15 1972-10-26 Siemens AG, 1000 Berlin u. 8000 München Scheibenförmiges Halbleiterbauelement
FR2162275A1 (en) * 1971-12-08 1973-07-20 Sescosem Encapsulated high power semiconductor - with improved heat dissipation
CH592961A5 (fr) * 1975-09-23 1977-11-15 Bbc Brown Boveri & Cie
FR2598031B1 (fr) * 1986-04-29 1988-12-02 Alsthom Boitier pour semi-conducteur de puissance
WO2011092859A1 (fr) * 2010-02-01 2011-08-04 トヨタ自動車株式会社 Procédé de fabrication d'un dispositif à semi-conducteurs et dispositif à semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805122A (en) * 1971-12-03 1974-04-16 Bbc Brown Boveri & Cie Semiconductor disc assembly providing predetermined compressive force against opposite faces of the disc by clamped heat-conductive bodies

Also Published As

Publication number Publication date
DE1539652A1 (de) 1969-12-18
FR1486215A (fr) 1967-06-23
NL6609153A (fr) 1967-01-10

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