FR1486215A - Dispositif à semi-conducteur - Google Patents
Dispositif à semi-conducteurInfo
- Publication number
- FR1486215A FR1486215A FR68754A FR68754A FR1486215A FR 1486215 A FR1486215 A FR 1486215A FR 68754 A FR68754 A FR 68754A FR 68754 A FR68754 A FR 68754A FR 1486215 A FR1486215 A FR 1486215A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE906165A SE316534B (fr) | 1965-07-09 | 1965-07-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1486215A true FR1486215A (fr) | 1967-06-23 |
Family
ID=20275725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR68754A Expired FR1486215A (fr) | 1965-07-09 | 1966-07-08 | Dispositif à semi-conducteur |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1539652A1 (fr) |
FR (1) | FR1486215A (fr) |
NL (1) | NL6609153A (fr) |
SE (1) | SE316534B (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2030266A1 (fr) * | 1969-02-03 | 1970-11-13 | Gen Electric | |
FR2133561A1 (fr) * | 1971-04-15 | 1972-12-01 | Siemens Ag | |
FR2162275A1 (en) * | 1971-12-08 | 1973-07-20 | Sescosem | Encapsulated high power semiconductor - with improved heat dissipation |
FR2326040A1 (fr) * | 1975-09-23 | 1977-04-22 | Bbc Brown Boveri & Cie | Groupe a semi-conducteurs et procede de fabrication de celui-ci |
FR2598031A1 (fr) * | 1986-04-29 | 1987-10-30 | Alsthom | Boitier pour semi-conducteur de puissance |
EP2533275A4 (fr) * | 2010-02-01 | 2016-12-21 | Toyota Motor Co Ltd | Procédé de fabrication d'un dispositif à semi-conducteurs et dispositif à semi-conducteurs |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7148146U (de) * | 1971-12-03 | 1973-11-29 | Bbc Ag | Halbleitereinheit |
-
1965
- 1965-07-09 SE SE906165A patent/SE316534B/xx unknown
-
1966
- 1966-06-30 NL NL6609153A patent/NL6609153A/xx unknown
- 1966-07-08 FR FR68754A patent/FR1486215A/fr not_active Expired
- 1966-07-08 DE DE19661539652 patent/DE1539652A1/de active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2030266A1 (fr) * | 1969-02-03 | 1970-11-13 | Gen Electric | |
FR2133561A1 (fr) * | 1971-04-15 | 1972-12-01 | Siemens Ag | |
FR2162275A1 (en) * | 1971-12-08 | 1973-07-20 | Sescosem | Encapsulated high power semiconductor - with improved heat dissipation |
FR2326040A1 (fr) * | 1975-09-23 | 1977-04-22 | Bbc Brown Boveri & Cie | Groupe a semi-conducteurs et procede de fabrication de celui-ci |
FR2598031A1 (fr) * | 1986-04-29 | 1987-10-30 | Alsthom | Boitier pour semi-conducteur de puissance |
EP2533275A4 (fr) * | 2010-02-01 | 2016-12-21 | Toyota Motor Co Ltd | Procédé de fabrication d'un dispositif à semi-conducteurs et dispositif à semi-conducteurs |
Also Published As
Publication number | Publication date |
---|---|
NL6609153A (fr) | 1967-01-10 |
SE316534B (fr) | 1969-10-27 |
DE1539652A1 (de) | 1969-12-18 |
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