FR2440077A1 - Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication - Google Patents

Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication

Info

Publication number
FR2440077A1
FR2440077A1 FR7830039A FR7830039A FR2440077A1 FR 2440077 A1 FR2440077 A1 FR 2440077A1 FR 7830039 A FR7830039 A FR 7830039A FR 7830039 A FR7830039 A FR 7830039A FR 2440077 A1 FR2440077 A1 FR 2440077A1
Authority
FR
France
Prior art keywords
ring
insulating
lipped
pressed against
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7830039A
Other languages
English (en)
Inventor
Andre Renelle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRANSFORMATION EN CIE INDLE
Original Assignee
TRANSFORMATION EN CIE INDLE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRANSFORMATION EN CIE INDLE filed Critical TRANSFORMATION EN CIE INDLE
Priority to FR7830039A priority Critical patent/FR2440077A1/fr
Priority to DE19792942585 priority patent/DE2942585A1/de
Publication of FR2440077A1 publication Critical patent/FR2440077A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

COMPOSANT ELECTRONIQUE DE PUISSANCE. LES BLOCS DE CATHODE ET D'ANODE SONT APPLIQUES SUR L'ELEMENT ACTIF SEMI-CONDUCTEUR AU MOYEN D'UN ISOLATEUR EXTERIEUR EN MATERIAU PLASTIQUE DE GRANDE RESISTANCE MECANIQUE ET THERMIQUE. DIODES ET THYRISTORS DE FORTE PUISSANCE.
FR7830039A 1978-10-23 1978-10-23 Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication Withdrawn FR2440077A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR7830039A FR2440077A1 (fr) 1978-10-23 1978-10-23 Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE19792942585 DE2942585A1 (de) 1978-10-23 1979-10-22 Leistungs-halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7830039A FR2440077A1 (fr) 1978-10-23 1978-10-23 Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication

Publications (1)

Publication Number Publication Date
FR2440077A1 true FR2440077A1 (fr) 1980-05-23

Family

ID=9214030

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7830039A Withdrawn FR2440077A1 (fr) 1978-10-23 1978-10-23 Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication

Country Status (2)

Country Link
DE (1) DE2942585A1 (fr)
FR (1) FR2440077A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601477A1 (fr) * 1986-07-11 1988-01-15 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
EP0415059A2 (fr) * 1989-07-31 1991-03-06 Siemens Aktiengesellschaft Bo˨tier pour composant semi-conducteur

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JPS61113249A (ja) * 1984-11-08 1986-05-31 Mitsubishi Electric Corp 半導体装置
JP7117309B2 (ja) * 2017-01-17 2022-08-12 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 半導体スイッチングデバイス

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR87273E (fr) * 1963-12-21 1966-07-08 C K D Praha Narodni Podnik Enveloppe étanche au vide pour éléments semi-conducteurs et semi-conducteur équipé avec ladite enveloppe
FR1531714A (fr) * 1966-06-03 1968-07-05 Westinghouse Electric Corp Dispositif semi-conducteur du type à disques
FR2133561A1 (fr) * 1971-04-15 1972-12-01 Siemens Ag
FR2157923A1 (fr) * 1971-10-26 1973-06-08 Westinghouse Electric Corp
FR2200626A1 (fr) * 1972-09-21 1974-04-19 Siemens Ag

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR87273E (fr) * 1963-12-21 1966-07-08 C K D Praha Narodni Podnik Enveloppe étanche au vide pour éléments semi-conducteurs et semi-conducteur équipé avec ladite enveloppe
FR1531714A (fr) * 1966-06-03 1968-07-05 Westinghouse Electric Corp Dispositif semi-conducteur du type à disques
FR2133561A1 (fr) * 1971-04-15 1972-12-01 Siemens Ag
FR2157923A1 (fr) * 1971-10-26 1973-06-08 Westinghouse Electric Corp
FR2200626A1 (fr) * 1972-09-21 1974-04-19 Siemens Ag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601477A1 (fr) * 1986-07-11 1988-01-15 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
EP0415059A2 (fr) * 1989-07-31 1991-03-06 Siemens Aktiengesellschaft Bo˨tier pour composant semi-conducteur
EP0415059A3 (en) * 1989-07-31 1992-04-01 Siemens Aktiengesellschaft Housing for semiconductor component

Also Published As

Publication number Publication date
DE2942585A1 (de) 1980-05-08

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Legal Events

Date Code Title Description
ST Notification of lapse