SE383583B - Skivformad halvledarkomponent innefattande ett halvledarelement och ett holje - Google Patents
Skivformad halvledarkomponent innefattande ett halvledarelement och ett holjeInfo
- Publication number
- SE383583B SE383583B SE480872A SE480872A SE383583B SE 383583 B SE383583 B SE 383583B SE 480872 A SE480872 A SE 480872A SE 480872 A SE480872 A SE 480872A SE 383583 B SE383583 B SE 383583B
- Authority
- SE
- Sweden
- Prior art keywords
- disc
- cover
- semiconductor element
- component including
- summarized
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712118356 DE2118356A1 (de) | 1971-04-15 | 1971-04-15 | Scheibenförmiges Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE383583B true SE383583B (sv) | 1976-03-15 |
Family
ID=5804825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE480872A SE383583B (sv) | 1971-04-15 | 1972-04-13 | Skivformad halvledarkomponent innefattande ett halvledarelement och ett holje |
Country Status (6)
| Country | Link |
|---|---|
| DE (1) | DE2118356A1 (sv) |
| FR (1) | FR2133561B1 (sv) |
| GB (1) | GB1330081A (sv) |
| IT (1) | IT957175B (sv) |
| NL (1) | NL7202856A (sv) |
| SE (1) | SE383583B (sv) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2654532C3 (de) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Scheibenförmige Halbleiterzelle |
| FR2440077A1 (fr) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication |
| DE3221794A1 (de) * | 1982-06-09 | 1983-12-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente |
| US4829364A (en) * | 1985-11-29 | 1989-05-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USRE34696E (en) * | 1985-11-29 | 1994-08-16 | Mitsubishi Denki Kabushiki | Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
| JP5187343B2 (ja) * | 2010-04-27 | 2013-04-24 | 三菱電機株式会社 | 圧接型半導体装置 |
| DE102015113111B4 (de) * | 2015-08-10 | 2020-01-30 | Infineon Technologies Ag | Leistungshalbleitermodul mit verbesserter Abdichtung |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE316534B (sv) * | 1965-07-09 | 1969-10-27 | Asea Ab | |
| US3476986A (en) * | 1966-09-17 | 1969-11-04 | Nippon Electric Co | Pressure contact semiconductor devices |
| GB1189062A (en) * | 1967-03-23 | 1970-04-22 | Motorola Inc | Semiconductor Rectifier Assembly |
| GB1219570A (en) * | 1967-08-04 | 1971-01-20 | Lucas Industries Ltd | Diode units |
| CH494471A (de) * | 1967-11-09 | 1970-07-31 | Ckd Praha | Halbleiterbauelement |
-
1971
- 1971-04-15 DE DE19712118356 patent/DE2118356A1/de active Pending
- 1971-12-28 FR FR7146963A patent/FR2133561B1/fr not_active Expired
-
1972
- 1972-03-03 NL NL7202856A patent/NL7202856A/xx unknown
- 1972-03-03 GB GB1000172A patent/GB1330081A/en not_active Expired
- 1972-04-12 IT IT721272A patent/IT957175B/it active
- 1972-04-13 SE SE480872A patent/SE383583B/sv unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2133561A1 (sv) | 1972-12-01 |
| DE2118356A1 (de) | 1972-10-26 |
| GB1330081A (en) | 1973-09-12 |
| FR2133561B1 (sv) | 1977-03-18 |
| IT957175B (it) | 1973-10-10 |
| NL7202856A (sv) | 1972-10-17 |
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