AT331271B - Aus schichten aufgebautes strahlungs empfindliches material - Google Patents
Aus schichten aufgebautes strahlungs empfindliches materialInfo
- Publication number
- AT331271B AT331271B AT696072A AT696072A AT331271B AT 331271 B AT331271 B AT 331271B AT 696072 A AT696072 A AT 696072A AT 696072 A AT696072 A AT 696072A AT 331271 B AT331271 B AT 331271B
- Authority
- AT
- Austria
- Prior art keywords
- radiation
- layers
- sensitive material
- material built
- built
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT750275A AT342942B (de) | 1971-09-24 | 1975-10-01 | Mit einem metall beschichtetes material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17105271A | 1971-08-12 | 1971-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA696072A ATA696072A (de) | 1975-11-15 |
AT331271B true AT331271B (de) | 1976-08-10 |
Family
ID=22622300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT696072A AT331271B (de) | 1971-08-12 | 1972-08-11 | Aus schichten aufgebautes strahlungs empfindliches material |
Country Status (2)
Country | Link |
---|---|
US (1) | US3773514A (de) |
AT (1) | AT331271B (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4054094A (en) * | 1972-08-25 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Laser production of lithographic printing plates |
FR2214934B1 (de) * | 1973-01-18 | 1978-03-24 | Thomson Csf | |
CA1049312A (en) * | 1974-01-17 | 1979-02-27 | John O.H. Peterson | Presensitized printing plate with in-situ, laser imageable mask |
FR2399184A1 (fr) * | 1977-07-28 | 1979-02-23 | Telecommunications Sa | Procede de realisation de circuits imprimes a trous metallises a partir de supports isolants en stratifie : verre-resine synthetique |
US4447519A (en) * | 1981-12-16 | 1984-05-08 | Nathan Pritikin | Solid photoresist and method of making photoresist |
US4526810A (en) * | 1982-06-17 | 1985-07-02 | At&T Technologies, Inc. | Process for improved wall definition of an additive printed circuit |
US4702994A (en) * | 1984-10-01 | 1987-10-27 | W. R. Grace & Co. | Projection imaged relief printing plates |
US4661372A (en) * | 1985-12-23 | 1987-04-28 | General Motors Corporation | UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface |
IL98660A (en) * | 1991-06-28 | 1996-10-16 | Orbotech Ltd | Method of printing an image on a substrate particularly useful for producing printed circuit boards |
US6030708A (en) * | 1996-10-28 | 2000-02-29 | Nissha Printing Co., Ltd. | Transparent shielding material for electromagnetic interference |
US6679982B1 (en) * | 1997-08-07 | 2004-01-20 | Ngk Spark Plug Co., Ltd. | Oxygen sensor |
US6120693A (en) * | 1998-11-06 | 2000-09-19 | Alliedsignal Inc. | Method of manufacturing an interlayer via and a laminate precursor useful for same |
IL133355A (en) * | 1999-12-07 | 2003-10-31 | Creo Il Ltd | Method and plate for digitally-imaged offset printing |
US9302452B2 (en) | 2012-03-02 | 2016-04-05 | Ppg Industries Ohio, Inc. | Transparent laminates comprising inkjet printed conductive lines and methods of forming the same |
US9389512B2 (en) * | 2014-09-30 | 2016-07-12 | Eastman Kodak Company | Forming conductive metal patterns using water-soluble polymers |
US9986669B2 (en) * | 2015-11-25 | 2018-05-29 | Ppg Industries Ohio, Inc. | Transparency including conductive mesh including a closed shape having at least one curved side |
US11745702B2 (en) | 2018-12-11 | 2023-09-05 | Ppg Industries Ohio, Inc. | Coating including electrically conductive lines directly on electrically conductive layer |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL280795A (de) * | 1958-11-26 | |||
US3458311A (en) * | 1966-06-27 | 1969-07-29 | Du Pont | Photopolymerizable elements with solvent removable protective layers |
-
1971
- 1971-08-12 US US00171052A patent/US3773514A/en not_active Expired - Lifetime
-
1972
- 1972-08-11 AT AT696072A patent/AT331271B/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US3773514A (en) | 1973-11-20 |
ATA696072A (de) | 1975-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |