DE2118356A1 - Scheibenförmiges Halbleiterbauelement - Google Patents

Scheibenförmiges Halbleiterbauelement

Info

Publication number
DE2118356A1
DE2118356A1 DE19712118356 DE2118356A DE2118356A1 DE 2118356 A1 DE2118356 A1 DE 2118356A1 DE 19712118356 DE19712118356 DE 19712118356 DE 2118356 A DE2118356 A DE 2118356A DE 2118356 A1 DE2118356 A1 DE 2118356A1
Authority
DE
Germany
Prior art keywords
semiconductor component
cover plates
ring
component according
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712118356
Other languages
German (de)
English (en)
Inventor
Reimer Dipl.-Phys.Dr.; Martin Heinz; 8000 München Emeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19712118356 priority Critical patent/DE2118356A1/de
Priority to FR7146963A priority patent/FR2133561B1/fr
Priority to GB1000172A priority patent/GB1330081A/en
Priority to NL7202856A priority patent/NL7202856A/xx
Priority to IT721272A priority patent/IT957175B/it
Priority to SE480872A priority patent/SE383583B/xx
Publication of DE2118356A1 publication Critical patent/DE2118356A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
DE19712118356 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement Pending DE2118356A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement
FR7146963A FR2133561B1 (fr) 1971-04-15 1971-12-28
GB1000172A GB1330081A (en) 1971-04-15 1972-03-03 Semiconductor components
NL7202856A NL7202856A (fr) 1971-04-15 1972-03-03
IT721272A IT957175B (it) 1971-04-15 1972-04-12 Componente dischiforme e semicon duttori
SE480872A SE383583B (sv) 1971-04-15 1972-04-13 Skivformad halvledarkomponent innefattande ett halvledarelement och ett holje

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2118356A1 true DE2118356A1 (de) 1972-10-26

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712118356 Pending DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Country Status (6)

Country Link
DE (1) DE2118356A1 (fr)
FR (1) FR2133561B1 (fr)
GB (1) GB1330081A (fr)
IT (1) IT957175B (fr)
NL (1) NL7202856A (fr)
SE (1) SE383583B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532A1 (de) * 1976-12-02 1978-06-08 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE3640801A1 (de) * 1985-11-29 1987-06-04 Mitsubishi Electric Corp Halbleiterbauelement
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
DE102015113111A1 (de) * 2015-08-10 2017-02-16 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440077A1 (fr) * 1978-10-23 1980-05-23 Transformation En Cie Indle Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JP5187343B2 (ja) * 2010-04-27 2013-04-24 三菱電機株式会社 圧接型半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (fr) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (de) * 1967-11-09 1970-07-31 Ckd Praha Halbleiterbauelement

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532A1 (de) * 1976-12-02 1978-06-08 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE3640801A1 (de) * 1985-11-29 1987-06-04 Mitsubishi Electric Corp Halbleiterbauelement
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
DE102015113111A1 (de) * 2015-08-10 2017-02-16 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Also Published As

Publication number Publication date
FR2133561A1 (fr) 1972-12-01
GB1330081A (en) 1973-09-12
SE383583B (sv) 1976-03-15
FR2133561B1 (fr) 1977-03-18
IT957175B (it) 1973-10-10
NL7202856A (fr) 1972-10-17

Similar Documents

Publication Publication Date Title
DE3839868C2 (de) Thermistorbauelement
DE1639039A1 (de) Scheibenfoermiges Halbleiterbauelement
DE1944515A1 (de) Halbleiterbauelement mit Kunststoffuellung
DE2160302A1 (de) Kuehldose zum einbau in scheibenzellenstapel
DE2118356A1 (de) Scheibenförmiges Halbleiterbauelement
DE1539643A1 (de) Halbleiterbauelement
DE2435637A1 (de) Halbleiterbauelement mit druckkontakt
DE1564107A1 (de) Gekapselte Halbleiteranordnung
DE1564665C3 (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
EP0124705B1 (fr) Dispositif semi-conducteur ayant une plaquette semi-conductrice et un corps isolant en forme d'anneau
DE3308720A1 (de) Halbleiterbauelement mit scheibenfoermigem gehaeuse
DE2938096A1 (de) Leistungshalbleiterbauelement
DE3221794C2 (fr)
DE2926342A1 (de) Kuehldose fuer scheibenfoermige halbleiterbauelemente
DE2654532C3 (de) Scheibenförmige Halbleiterzelle
DE2825682C2 (de) Halbleiterbauelement mit Isoliergehäuse
DE2246423A1 (de) Thyristor mit scheibenfoermigem gehaeuse
DE2718228C2 (de) Kondensatorabdeckscheibe
DE3640801C2 (fr)
DE202015102948U1 (de) Halbleiterbauelement
DE3107282A1 (de) Elektrostatischer schallwandler
DE2426113B2 (de) Thyristor-halbleiteranordnung
DE3425176C2 (fr)
DE2711711C3 (de) Halbleiteranordnung mit einem scheibenförmigen, zwischen Kühlkörpern eingespanntem Halbleiterbauelement
DE2252830C2 (de) Halbleiterbauelement mit einem Halbleiterelement in einem hermetisch geschlossenen Gehäuse

Legal Events

Date Code Title Description
OHA Expiration of time for request for examination