ES406779A1 - Elastomerically encapsulated semiconductor device - Google Patents

Elastomerically encapsulated semiconductor device

Info

Publication number
ES406779A1
ES406779A1 ES406779A ES406779A ES406779A1 ES 406779 A1 ES406779 A1 ES 406779A1 ES 406779 A ES406779 A ES 406779A ES 406779 A ES406779 A ES 406779A ES 406779 A1 ES406779 A1 ES 406779A1
Authority
ES
Spain
Prior art keywords
semiconductor device
encapsulated semiconductor
pair
elastomerically
tabs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES406779A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ES406779A1 publication Critical patent/ES406779A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Gasket Seals (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An encapsulated semiconductor device comprising a semiconductor wafer having an electrode attached to each side, and a pair of cylindrical contacts abutting an associated electrode and including outwardly extending circumferential tabs; characterized by an elastomeric encapsulating cylindrical member having a pair of inwardly extending circumferential flanges positioned to engage with the respectively associated flanges of the contact members, and an inwardly extending sealing member which is arranged to Compression fit between the tabs of the contact member to provide a watertight seal for the pad. (Machine-translation by Google Translate, not legally binding)
ES406779A 1971-10-26 1972-09-18 Elastomerically encapsulated semiconductor device Expired ES406779A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19246871A 1971-10-26 1971-10-26

Publications (1)

Publication Number Publication Date
ES406779A1 true ES406779A1 (en) 1975-10-01

Family

ID=22709794

Family Applications (1)

Application Number Title Priority Date Filing Date
ES406779A Expired ES406779A1 (en) 1971-10-26 1972-09-18 Elastomerically encapsulated semiconductor device

Country Status (9)

Country Link
JP (2) JPS4857581A (en)
AU (1) AU465197B2 (en)
BE (1) BE790502A (en)
CA (1) CA963586A (en)
DE (1) DE2250753A1 (en)
ES (1) ES406779A1 (en)
FR (1) FR2157923A1 (en)
GB (1) GB1358504A (en)
ZA (1) ZA725913B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2246423C3 (en) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor with a disc-shaped housing
DE2525390A1 (en) * 1975-06-06 1976-12-16 Siemens Ag CONTROLLED SEMICONDUCTOR COMPONENT
JPS5619406Y2 (en) * 1976-06-10 1981-05-08
DE2630320A1 (en) * 1976-07-06 1978-01-12 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING
DE2636631A1 (en) * 1976-08-13 1978-02-16 Siemens Ag THYRISTOR
JPS5636134Y2 (en) * 1976-09-07 1981-08-25
DE2654532C3 (en) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Disc-shaped semiconductor cell
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
DE3308720A1 (en) * 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING
DE3316964A1 (en) * 1983-05-09 1984-11-15 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH PUSHED MUG
JPH0744191B2 (en) * 1989-12-15 1995-05-15 三菱電機株式会社 Semiconductor device and electrode block therefor
EP2447988B1 (en) * 2010-11-02 2015-05-06 GE Energy Power Conversion Technology Limited Power electronic device with edge passivation

Also Published As

Publication number Publication date
DE2250753A1 (en) 1973-05-03
AU4624072A (en) 1974-03-07
ZA725913B (en) 1973-05-30
JPS4857581A (en) 1973-08-13
BE790502A (en) 1973-04-25
FR2157923A1 (en) 1973-06-08
JPS5311966U (en) 1978-01-31
CA963586A (en) 1975-02-25
GB1358504A (en) 1974-07-03
AU465197B2 (en) 1975-09-18

Similar Documents

Publication Publication Date Title
ES406779A1 (en) Elastomerically encapsulated semiconductor device
NO145086C (en) DEVICE FOR FORMING A CONNECTION SOCKET THAT SHOWS AN ELASTIC SEALING RING.
SE416309B (en) PHOTOSENTIVE ELASTOMES COMPOSITION
ES389451A1 (en) Tablet-shaped semiconductor component and process for its manufacture
ES271318A1 (en) A bearing seal (Machine-translation by Google Translate, not legally binding)
BE807603A (en) SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT
NL7510396A (en) VULCANIZABLE ELASTOMERIC COMPOUNDS.
GB975499A (en) Gasket assembly
IT1072025B (en) DEVICE FOR LAMULATING OF FLAT ANULAR SURFACES, PARTICULARLY OF THE GATE VALVE SEAL RINGS
CH540455A (en) Elastic sealing sleeve
BE599125A (en) Double sealed gasket with leak control
ES334071A1 (en) Improvements in the joint hermetic bellows for joints with movement in all directions, in particular seals. (Machine-translation by Google Translate, not legally binding)
ES433137A1 (en) Rotary mechanical face seals
GB1330081A (en) Semiconductor components
ES411514A1 (en) Sealings rings
IT1017892B (en) BALL VALVE WITH UNIT-BODY SEALING MEMBER
GB998762A (en) An improved sealing unit for bearings
GB729725A (en) Diaphragm type mechanical seal
SU474876A1 (en) Sealed electrical connector
SU474875A1 (en) Plug Socket
ES434561A1 (en) Contact plate. (Machine-translation by Google Translate, not legally binding)
SU761775A1 (en) Seal
ES189901U (en) An elastic cojinete. (Machine-translation by Google Translate, not legally binding)
SU481209A1 (en) Safety valve
JPS51124827A (en) Bellows type sealing valve