GB1358504A - Elastomerically encapsulated semiconductor device - Google Patents
Elastomerically encapsulated semiconductor deviceInfo
- Publication number
- GB1358504A GB1358504A GB4084772A GB4084772A GB1358504A GB 1358504 A GB1358504 A GB 1358504A GB 4084772 A GB4084772 A GB 4084772A GB 4084772 A GB4084772 A GB 4084772A GB 1358504 A GB1358504 A GB 1358504A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrodes
- semi
- wafer
- sleeve
- contact members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thyristors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Gasket Seals (AREA)
Abstract
1358504 Semi-conductor devices WESTING- HOUSE ELECTRIC CORP 4 Sept 1972 [26 Oct 1971] 40847/72 Heading H1K A semi-conductor wafer 11 having electrodes 12 bonded to opposite faces has a pair of contact members 13 urged into contact with the electrodes 12 by the clamping effect of a flanged elastomeric sleeve 20 acting upon external flanges 15 on the contact members 13. The sleeve 20 also has a sealing portion 21 which extends into the channel 17 defined between the flanges 15 and provides a hermetic seal about the wafer 11. Suitable materials for the elastomeric sleeve 20 include silicone, butadienestyrene, butyl, nitrile or fluorocarbon rubbers, polyolefin tubing, neoprene, polysulphides, polyacrylates, chlorosulphonated polyethylene and polyurethane. As well as the PN junction diode shown the invention is described in relation to a thyristor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19246871A | 1971-10-26 | 1971-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1358504A true GB1358504A (en) | 1974-07-03 |
Family
ID=22709794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4084772A Expired GB1358504A (en) | 1971-10-26 | 1972-09-04 | Elastomerically encapsulated semiconductor device |
Country Status (9)
Country | Link |
---|---|
JP (2) | JPS4857581A (en) |
AU (1) | AU465197B2 (en) |
BE (1) | BE790502A (en) |
CA (1) | CA963586A (en) |
DE (1) | DE2250753A1 (en) |
ES (1) | ES406779A1 (en) |
FR (1) | FR2157923A1 (en) |
GB (1) | GB1358504A (en) |
ZA (1) | ZA725913B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0122431A1 (en) * | 1983-03-11 | 1984-10-24 | Siemens Aktiengesellschaft | Semiconductor device with a disc-shaped housing |
EP0127750A1 (en) * | 1983-05-09 | 1984-12-12 | Siemens Aktiengesellschaft | Encapsulated semiconductor device in a cup-shaped container |
WO2012059193A3 (en) * | 2010-11-02 | 2012-07-26 | Converteam Technology Ltd | Power electronic device with edge passivation |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2246423C3 (en) * | 1972-09-21 | 1979-03-08 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Thyristor with a disc-shaped housing |
DE2525390A1 (en) * | 1975-06-06 | 1976-12-16 | Siemens Ag | CONTROLLED SEMICONDUCTOR COMPONENT |
JPS5619406Y2 (en) * | 1976-06-10 | 1981-05-08 | ||
DE2630320A1 (en) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING |
DE2636631A1 (en) * | 1976-08-13 | 1978-02-16 | Siemens Ag | THYRISTOR |
JPS5636134Y2 (en) * | 1976-09-07 | 1981-08-25 | ||
DE2654532C3 (en) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Disc-shaped semiconductor cell |
FR2440077A1 (en) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring |
JPH0744191B2 (en) * | 1989-12-15 | 1995-05-15 | 三菱電機株式会社 | Semiconductor device and electrode block therefor |
-
0
- BE BE790502D patent/BE790502A/en unknown
-
1972
- 1972-08-29 ZA ZA725913A patent/ZA725913B/en unknown
- 1972-09-01 AU AU46240/72A patent/AU465197B2/en not_active Expired
- 1972-09-04 GB GB4084772A patent/GB1358504A/en not_active Expired
- 1972-09-11 CA CA 151336 patent/CA963586A/en not_active Expired
- 1972-09-18 ES ES406779A patent/ES406779A1/en not_active Expired
- 1972-10-12 JP JP10167072A patent/JPS4857581A/ja active Pending
- 1972-10-17 DE DE2250753A patent/DE2250753A1/en not_active Ceased
- 1972-10-24 FR FR7237651A patent/FR2157923A1/fr not_active Withdrawn
-
1977
- 1977-07-12 JP JP9164177U patent/JPS5311966U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0122431A1 (en) * | 1983-03-11 | 1984-10-24 | Siemens Aktiengesellschaft | Semiconductor device with a disc-shaped housing |
EP0127750A1 (en) * | 1983-05-09 | 1984-12-12 | Siemens Aktiengesellschaft | Encapsulated semiconductor device in a cup-shaped container |
WO2012059193A3 (en) * | 2010-11-02 | 2012-07-26 | Converteam Technology Ltd | Power electronic device with edge passivation |
US9349790B2 (en) | 2010-11-02 | 2016-05-24 | Ge Energy Power Conversion Technology Ltd. | Power electronic devices |
Also Published As
Publication number | Publication date |
---|---|
AU465197B2 (en) | 1975-09-18 |
CA963586A (en) | 1975-02-25 |
AU4624072A (en) | 1974-03-07 |
JPS4857581A (en) | 1973-08-13 |
ES406779A1 (en) | 1975-10-01 |
BE790502A (en) | 1973-04-25 |
ZA725913B (en) | 1973-05-30 |
JPS5311966U (en) | 1978-01-31 |
FR2157923A1 (en) | 1973-06-08 |
DE2250753A1 (en) | 1973-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |