FR2157923A1 - - Google Patents
Info
- Publication number
- FR2157923A1 FR2157923A1 FR7237651A FR7237651A FR2157923A1 FR 2157923 A1 FR2157923 A1 FR 2157923A1 FR 7237651 A FR7237651 A FR 7237651A FR 7237651 A FR7237651 A FR 7237651A FR 2157923 A1 FR2157923 A1 FR 2157923A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Gasket Seals (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19246871A | 1971-10-26 | 1971-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2157923A1 true FR2157923A1 (en) | 1973-06-08 |
Family
ID=22709794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7237651A Withdrawn FR2157923A1 (en) | 1971-10-26 | 1972-10-24 |
Country Status (9)
| Country | Link |
|---|---|
| JP (2) | JPS4857581A (en) |
| AU (1) | AU465197B2 (en) |
| BE (1) | BE790502A (en) |
| CA (1) | CA963586A (en) |
| DE (1) | DE2250753A1 (en) |
| ES (1) | ES406779A1 (en) |
| FR (1) | FR2157923A1 (en) |
| GB (1) | GB1358504A (en) |
| ZA (1) | ZA725913B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2200626A1 (en) * | 1972-09-21 | 1974-04-19 | Siemens Ag | |
| FR2361746A1 (en) * | 1976-08-13 | 1978-03-10 | Siemens Ag | THYRISTOR BOX WITH CONNECTION FOR AN AUXILIARY TRANSMITTER ELECTRODE |
| FR2440077A1 (en) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring |
| EP0432796A2 (en) * | 1989-12-15 | 1991-06-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2525390A1 (en) * | 1975-06-06 | 1976-12-16 | Siemens Ag | CONTROLLED SEMICONDUCTOR COMPONENT |
| JPS5619406Y2 (en) * | 1976-06-10 | 1981-05-08 | ||
| DE2630320A1 (en) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING |
| JPS5636134Y2 (en) * | 1976-09-07 | 1981-08-25 | ||
| DE2654532C3 (en) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Disc-shaped semiconductor cell |
| DE3308720A1 (en) * | 1983-03-11 | 1984-09-13 | Siemens AG, 1000 Berlin und 8000 München | SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING |
| DE3316964A1 (en) * | 1983-05-09 | 1984-11-15 | Siemens AG, 1000 Berlin und 8000 München | SEMICONDUCTOR COMPONENT WITH PUSHED MUG |
| EP2447988B1 (en) | 2010-11-02 | 2015-05-06 | GE Energy Power Conversion Technology Limited | Power electronic device with edge passivation |
-
0
- BE BE790502D patent/BE790502A/en unknown
-
1972
- 1972-08-29 ZA ZA725913A patent/ZA725913B/en unknown
- 1972-09-01 AU AU46240/72A patent/AU465197B2/en not_active Expired
- 1972-09-04 GB GB4084772A patent/GB1358504A/en not_active Expired
- 1972-09-11 CA CA 151336 patent/CA963586A/en not_active Expired
- 1972-09-18 ES ES406779A patent/ES406779A1/en not_active Expired
- 1972-10-12 JP JP10167072A patent/JPS4857581A/ja active Pending
- 1972-10-17 DE DE2250753A patent/DE2250753A1/en not_active Ceased
- 1972-10-24 FR FR7237651A patent/FR2157923A1/fr not_active Withdrawn
-
1977
- 1977-07-12 JP JP9164177U patent/JPS5311966U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2200626A1 (en) * | 1972-09-21 | 1974-04-19 | Siemens Ag | |
| FR2361746A1 (en) * | 1976-08-13 | 1978-03-10 | Siemens Ag | THYRISTOR BOX WITH CONNECTION FOR AN AUXILIARY TRANSMITTER ELECTRODE |
| FR2440077A1 (en) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring |
| EP0432796A2 (en) * | 1989-12-15 | 1991-06-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| EP0432796A3 (en) * | 1989-12-15 | 1991-09-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and electrode block therefor |
| US5189509A (en) * | 1989-12-15 | 1993-02-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and electrode block for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2250753A1 (en) | 1973-05-03 |
| AU465197B2 (en) | 1975-09-18 |
| ZA725913B (en) | 1973-05-30 |
| AU4624072A (en) | 1974-03-07 |
| GB1358504A (en) | 1974-07-03 |
| JPS5311966U (en) | 1978-01-31 |
| ES406779A1 (en) | 1975-10-01 |
| JPS4857581A (en) | 1973-08-13 |
| CA963586A (en) | 1975-02-25 |
| BE790502A (en) | 1973-04-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |