AU465197B2 - Improvements in or relating to elastomerically encapsulated semiconductor device - Google Patents

Improvements in or relating to elastomerically encapsulated semiconductor device

Info

Publication number
AU465197B2
AU465197B2 AU46240/72A AU4624072A AU465197B2 AU 465197 B2 AU465197 B2 AU 465197B2 AU 46240/72 A AU46240/72 A AU 46240/72A AU 4624072 A AU4624072 A AU 4624072A AU 465197 B2 AU465197 B2 AU 465197B2
Authority
AU
Australia
Prior art keywords
elastomerically
relating
semiconductor device
encapsulated semiconductor
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU46240/72A
Other versions
AU4624072A (en
Inventor
RICHARD CAMP and ROBERT REGIS SHAW HENRY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of AU4624072A publication Critical patent/AU4624072A/en
Application granted granted Critical
Publication of AU465197B2 publication Critical patent/AU465197B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Gasket Seals (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
AU46240/72A 1971-10-26 1972-09-01 Improvements in or relating to elastomerically encapsulated semiconductor device Expired AU465197B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19246871A 1971-10-26 1971-10-26
USUS192468 1971-10-26

Publications (2)

Publication Number Publication Date
AU4624072A AU4624072A (en) 1974-03-07
AU465197B2 true AU465197B2 (en) 1975-09-18

Family

ID=22709794

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46240/72A Expired AU465197B2 (en) 1971-10-26 1972-09-01 Improvements in or relating to elastomerically encapsulated semiconductor device

Country Status (9)

Country Link
JP (2) JPS4857581A (en)
AU (1) AU465197B2 (en)
BE (1) BE790502A (en)
CA (1) CA963586A (en)
DE (1) DE2250753A1 (en)
ES (1) ES406779A1 (en)
FR (1) FR2157923A1 (en)
GB (1) GB1358504A (en)
ZA (1) ZA725913B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2246423C3 (en) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor with a disc-shaped housing
DE2525390A1 (en) * 1975-06-06 1976-12-16 Siemens Ag CONTROLLED SEMICONDUCTOR COMPONENT
JPS5619406Y2 (en) * 1976-06-10 1981-05-08
DE2630320A1 (en) * 1976-07-06 1978-01-12 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING
DE2636631A1 (en) * 1976-08-13 1978-02-16 Siemens Ag THYRISTOR
JPS5636134Y2 (en) * 1976-09-07 1981-08-25
DE2654532C3 (en) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Disc-shaped semiconductor cell
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
DE3308720A1 (en) * 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING
DE3316964A1 (en) * 1983-05-09 1984-11-15 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH PUSHED MUG
JPH0744191B2 (en) * 1989-12-15 1995-05-15 三菱電機株式会社 Semiconductor device and electrode block therefor
EP2447988B1 (en) * 2010-11-02 2015-05-06 GE Energy Power Conversion Technology Limited Power electronic device with edge passivation

Also Published As

Publication number Publication date
CA963586A (en) 1975-02-25
AU4624072A (en) 1974-03-07
JPS4857581A (en) 1973-08-13
ES406779A1 (en) 1975-10-01
BE790502A (en) 1973-04-25
ZA725913B (en) 1973-05-30
JPS5311966U (en) 1978-01-31
FR2157923A1 (en) 1973-06-08
GB1358504A (en) 1974-07-03
DE2250753A1 (en) 1973-05-03

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