CH378422A - Vacuum sealed package semiconductor device and method of manufacturing the same - Google Patents
Vacuum sealed package semiconductor device and method of manufacturing the sameInfo
- Publication number
- CH378422A CH378422A CH11160A CH11160A CH378422A CH 378422 A CH378422 A CH 378422A CH 11160 A CH11160 A CH 11160A CH 11160 A CH11160 A CH 11160A CH 378422 A CH378422 A CH 378422A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacturing
- semiconductor device
- same
- sealed package
- vacuum sealed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0061301 | 1959-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH378422A true CH378422A (en) | 1964-06-15 |
Family
ID=7494754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH11160A CH378422A (en) | 1959-01-13 | 1960-01-06 | Vacuum sealed package semiconductor device and method of manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH378422A (en) |
| FR (1) | FR1242768A (en) |
| GB (1) | GB890455A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2132601B (en) * | 1982-12-23 | 1986-08-20 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
-
1959
- 1959-12-02 GB GB4097159A patent/GB890455A/en not_active Expired
- 1959-12-17 FR FR813339A patent/FR1242768A/en not_active Expired
-
1960
- 1960-01-06 CH CH11160A patent/CH378422A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB890455A (en) | 1962-02-28 |
| FR1242768A (en) | 1960-09-30 |
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