AT316894B - Semiconductor device and method of manufacturing the same - Google Patents

Semiconductor device and method of manufacturing the same

Info

Publication number
AT316894B
AT316894B AT1103969A AT1103969A AT316894B AT 316894 B AT316894 B AT 316894B AT 1103969 A AT1103969 A AT 1103969A AT 1103969 A AT1103969 A AT 1103969A AT 316894 B AT316894 B AT 316894B
Authority
AT
Austria
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
Prior art date
Application number
AT1103969A
Other languages
German (de)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT316894B publication Critical patent/AT316894B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R21/00—Variable-resistance transducers
    • H04R21/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/22—Clamping rim of diaphragm or cone against seating
AT1103969A 1968-11-29 1969-11-26 Semiconductor device and method of manufacturing the same AT316894B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6817089A NL162254B (en) 1968-11-29 1968-11-29 SEMI-CONDUCTOR DEVICE FOR CONVERSION OF MECHANICAL VOLTAGES INTO ELECTRICAL SIGNALS AND METHOD OF MANUFACTURING THIS.

Publications (1)

Publication Number Publication Date
AT316894B true AT316894B (en) 1974-07-25

Family

ID=19805282

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1103969A AT316894B (en) 1968-11-29 1969-11-26 Semiconductor device and method of manufacturing the same

Country Status (10)

Country Link
AT (1) AT316894B (en)
BE (1) BE742331A (en)
BR (1) BR6914557D0 (en)
CH (1) CH518006A (en)
DE (1) DE1959527C3 (en)
ES (2) ES373779A1 (en)
FR (1) FR2024961A1 (en)
GB (1) GB1295650A (en)
NL (1) NL162254B (en)
SE (2) SE384437B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006740A1 (en) * 1978-06-28 1980-01-09 Gould Inc. Improvements in strain gauges
EP0338180A1 (en) * 1988-04-21 1989-10-25 MAGNETI MARELLI S.p.A. An electrical force and/or deformation sensor, particularly for use as a pressure sensor
EP0340022A1 (en) * 1988-04-29 1989-11-02 Schlumberger Industries, Inc. Mechanical sensor for high temperature environments

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071838A (en) 1976-02-09 1978-01-31 Diax Corporation Solid state force transducer and method of making same
DE2841312C2 (en) * 1978-09-22 1985-06-05 Robert Bosch Gmbh, 7000 Stuttgart Monolithic semiconductor pressure sensor and process for its manufacture
JPS5550668A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Semiconductor pressure converter
IT1212404B (en) * 1979-02-22 1989-11-22 Rca Corp METHOD OF A SINGLE ATTACK FOR THE FORMATION OF A MESA PRESENTING A MULTIPLE WALL.
JP2719448B2 (en) * 1991-01-24 1998-02-25 三菱電機株式会社 Semiconductor pressure detector
CN102790000B (en) * 2004-08-20 2016-06-29 应用材料公司 System for thinning semiconductor workpiece
CN113555346B (en) * 2020-08-21 2023-05-23 友达光电股份有限公司 Circuit board and method for measuring strain amount of circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270554A (en) * 1961-01-04 1966-09-06 Bell Telephone Labor Inc Diffused layer transducers
US3277698A (en) * 1963-11-15 1966-10-11 Bell Telephone Labor Inc Stress sensing semiconductive devices
NL6703014A (en) * 1967-02-25 1968-08-26
BE711537A (en) * 1968-03-01 1968-09-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006740A1 (en) * 1978-06-28 1980-01-09 Gould Inc. Improvements in strain gauges
EP0338180A1 (en) * 1988-04-21 1989-10-25 MAGNETI MARELLI S.p.A. An electrical force and/or deformation sensor, particularly for use as a pressure sensor
EP0340022A1 (en) * 1988-04-29 1989-11-02 Schlumberger Industries, Inc. Mechanical sensor for high temperature environments

Also Published As

Publication number Publication date
ES400839A1 (en) 1975-02-01
DE1959527A1 (en) 1970-06-11
FR2024961A1 (en) 1970-09-04
SE384437B (en) 1976-05-03
SE363700B (en) 1974-01-28
DE1959527B2 (en) 1981-03-19
DE1959527C3 (en) 1981-12-10
NL6817089A (en) 1970-06-02
GB1295650A (en) 1972-11-08
ES373779A1 (en) 1972-05-16
NL162254B (en) 1979-11-15
BR6914557D0 (en) 1973-01-02
BE742331A (en) 1970-05-27
CH518006A (en) 1972-01-15

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee