GB1295650A - - Google Patents
Info
- Publication number
- GB1295650A GB1295650A GB1295650DA GB1295650A GB 1295650 A GB1295650 A GB 1295650A GB 1295650D A GB1295650D A GB 1295650DA GB 1295650 A GB1295650 A GB 1295650A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- strips
- type
- diaphragm
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 abstract 7
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000009760 electrical discharge machining Methods 0.000 abstract 1
- 238000000866 electrolytic etching Methods 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R21/00—Variable-resistance transducers
- H04R21/02—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
- H04R7/22—Clamping rim of diaphragm or cone against seating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Recrystallisation Techniques (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
1295650 Semi-conductor devices PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 26 Nov 1969 [29 Nov 1968] 57792/69 Heading H1K A semi-conductor device including a relatively thick portion 3 and a thinner portion 2 is formed by providing on a flat semi-conductor substrate 20 a layer 21 having different conductivity and/ or conductivity type from the substrate 20, locally removing part of the substrate 21 to a depth approaching, but not reaching, its interface with the layer 21, and finally electrolytically etching down to the interface within the recess formed by the local removal. The local removal may itself be effected by electrolytic etching using an electrode in an insulating capillary, by drilling or grinding, or, in the preferred method, by spark erosion using an electrode which is moved steadily towards the substrate as erosion progresses. The electrolytic etch may, for a Si substrate, use an HF solution with Pt electrodes in the solution and on the substrate. In the embodiment shown the thin portion 2 of the device constitutes a flexible diaphragm for use, for example, in measuring fluid pressure. The portion 2 is part of a relatively high resistivity P-doped N-type layer 21 epitaxially deposited on the low resistivity Sbdoped N-type substrate 20, and contains four B-diffused P-type resistance strips such as 22, 23 constituting a Wheatstone Bridge strain gauge arrangement interconnected by Al strips 42, 46 &c. When the diaphragm 2 lies in the (111) plane the strain-dependence of resistance of the P-type strips is independent of strip orientation, and the strips are situated in two pairs, one near the centre of the diaphragm 2 and one near the periphery where it joins the thick annular pin 3. If the diaphragm 2 is situated in the (110) plane two of the P-type strips lie along the [110] direction while the other two lie along the [001] direction, along which axis resistance is relatively independent of strain for P-type material. For use in an accelerometer, a microphone, a displacement detector or a device for measuring surface radius of curvature, a thick central hub may additionally be provided, and the diaphragm may be continuous or may be divided into three radiating spoke-like strips joining the hub and rim, each strip containing a Wheatstone Bridge strain gauge arrangement.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6817089A NL162254B (en) | 1968-11-29 | 1968-11-29 | SEMI-CONDUCTOR DEVICE FOR CONVERSION OF MECHANICAL VOLTAGES INTO ELECTRICAL SIGNALS AND METHOD OF MANUFACTURING THIS. |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1295650A true GB1295650A (en) | 1972-11-08 |
Family
ID=19805282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1295650D Expired GB1295650A (en) | 1968-11-29 | 1969-11-26 |
Country Status (10)
Country | Link |
---|---|
AT (1) | AT316894B (en) |
BE (1) | BE742331A (en) |
BR (1) | BR6914557D0 (en) |
CH (1) | CH518006A (en) |
DE (1) | DE1959527C3 (en) |
ES (2) | ES373779A1 (en) |
FR (1) | FR2024961A1 (en) |
GB (1) | GB1295650A (en) |
NL (1) | NL162254B (en) |
SE (2) | SE384437B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2438264A1 (en) * | 1978-10-06 | 1980-04-30 | Hitachi Ltd | SEMICONDUCTOR PRESSURE TRANSDUCER ASSEMBLY |
USRE31459E (en) | 1976-02-09 | 1983-12-06 | Harry E. Aine | Solid state force transducer and method of making same |
DE4201634A1 (en) * | 1991-01-24 | 1992-08-06 | Mitsubishi Electric Corp | SEMICONDUCTOR PRESSURE RECORDING DEVICE |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4191057A (en) * | 1978-06-28 | 1980-03-04 | Gould Inc. | Inversion layer sprain gauge |
DE2841312C2 (en) * | 1978-09-22 | 1985-06-05 | Robert Bosch Gmbh, 7000 Stuttgart | Monolithic semiconductor pressure sensor and process for its manufacture |
IT1212404B (en) * | 1979-02-22 | 1989-11-22 | Rca Corp | METHOD OF A SINGLE ATTACK FOR THE FORMATION OF A MESA PRESENTING A MULTIPLE WALL. |
DE3874884T2 (en) * | 1988-04-21 | 1993-04-29 | Marelli Autronica | ELECTRICAL FORCE AND / OR DEFLECTION SENSOR, ESPECIALLY FOR USE AS A PRESSURE SENSOR. |
US4904978A (en) * | 1988-04-29 | 1990-02-27 | Solartron Electronics, Inc. | Mechanical sensor for high temperature environments |
WO2006023753A2 (en) * | 2004-08-20 | 2006-03-02 | Semitool, Inc. | System for thinning a semiconductor workpiece |
CN113555346B (en) * | 2020-08-21 | 2023-05-23 | 友达光电股份有限公司 | Circuit board and method for measuring strain amount of circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270554A (en) * | 1961-01-04 | 1966-09-06 | Bell Telephone Labor Inc | Diffused layer transducers |
US3277698A (en) * | 1963-11-15 | 1966-10-11 | Bell Telephone Labor Inc | Stress sensing semiconductive devices |
NL153947B (en) * | 1967-02-25 | 1977-07-15 | Philips Nv | PROCEDURE FOR MANUFACTURING SEMICONDUCTOR DEVICES, USING A SELECTIVE ELECTROLYTIC ETCHING PROCESS AND OBTAINING SEMI-CONDUCTOR DEVICE BY APPLICATION OF THE PROCESS. |
BE711537A (en) * | 1968-03-01 | 1968-09-02 |
-
1968
- 1968-11-29 NL NL6817089A patent/NL162254B/en not_active IP Right Cessation
-
1969
- 1969-11-21 ES ES373779A patent/ES373779A1/en not_active Expired
- 1969-11-26 AT AT1103969A patent/AT316894B/en not_active IP Right Cessation
- 1969-11-26 GB GB1295650D patent/GB1295650A/en not_active Expired
- 1969-11-26 CH CH1758969A patent/CH518006A/en not_active IP Right Cessation
- 1969-11-26 BR BR21455769A patent/BR6914557D0/en unknown
- 1969-11-26 SE SE223173A patent/SE384437B/en unknown
- 1969-11-26 SE SE1625669A patent/SE363700B/xx unknown
- 1969-11-27 DE DE19691959527 patent/DE1959527C3/en not_active Expired
- 1969-11-27 BE BE742331D patent/BE742331A/xx not_active IP Right Cessation
- 1969-12-01 FR FR6941355A patent/FR2024961A1/fr not_active Withdrawn
-
1972
- 1972-03-16 ES ES400839A patent/ES400839A1/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE31459E (en) | 1976-02-09 | 1983-12-06 | Harry E. Aine | Solid state force transducer and method of making same |
FR2438264A1 (en) * | 1978-10-06 | 1980-04-30 | Hitachi Ltd | SEMICONDUCTOR PRESSURE TRANSDUCER ASSEMBLY |
DE4201634A1 (en) * | 1991-01-24 | 1992-08-06 | Mitsubishi Electric Corp | SEMICONDUCTOR PRESSURE RECORDING DEVICE |
Also Published As
Publication number | Publication date |
---|---|
ES400839A1 (en) | 1975-02-01 |
NL6817089A (en) | 1970-06-02 |
AT316894B (en) | 1974-07-25 |
SE384437B (en) | 1976-05-03 |
BE742331A (en) | 1970-05-27 |
CH518006A (en) | 1972-01-15 |
DE1959527B2 (en) | 1981-03-19 |
DE1959527A1 (en) | 1970-06-11 |
NL162254B (en) | 1979-11-15 |
BR6914557D0 (en) | 1973-01-02 |
FR2024961A1 (en) | 1970-09-04 |
DE1959527C3 (en) | 1981-12-10 |
SE363700B (en) | 1974-01-28 |
ES373779A1 (en) | 1972-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee | ||
PCNP | Patent ceased through non-payment of renewal fee |