CH518006A - Method for manufacturing a semiconductor device with adjacent regions of different thickness, semiconductor device manufactured according to the method and using the same for converting mechanical forces into electrical signals - Google Patents

Method for manufacturing a semiconductor device with adjacent regions of different thickness, semiconductor device manufactured according to the method and using the same for converting mechanical forces into electrical signals

Info

Publication number
CH518006A
CH518006A CH1758969A CH1758969A CH518006A CH 518006 A CH518006 A CH 518006A CH 1758969 A CH1758969 A CH 1758969A CH 1758969 A CH1758969 A CH 1758969A CH 518006 A CH518006 A CH 518006A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
manufacturing
electrical signals
manufactured according
same
Prior art date
Application number
CH1758969A
Other languages
German (de)
Inventor
Maris Gieles Antonius Cornelis
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH518006A publication Critical patent/CH518006A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R21/00—Variable-resistance transducers
    • H04R21/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/22—Clamping rim of diaphragm or cone against seating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Recrystallisation Techniques (AREA)
CH1758969A 1968-11-29 1969-11-26 Method for manufacturing a semiconductor device with adjacent regions of different thickness, semiconductor device manufactured according to the method and using the same for converting mechanical forces into electrical signals CH518006A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6817089A NL162254B (en) 1968-11-29 1968-11-29 SEMI-CONDUCTOR DEVICE FOR CONVERSION OF MECHANICAL VOLTAGES INTO ELECTRICAL SIGNALS AND METHOD OF MANUFACTURING THIS.

Publications (1)

Publication Number Publication Date
CH518006A true CH518006A (en) 1972-01-15

Family

ID=19805282

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1758969A CH518006A (en) 1968-11-29 1969-11-26 Method for manufacturing a semiconductor device with adjacent regions of different thickness, semiconductor device manufactured according to the method and using the same for converting mechanical forces into electrical signals

Country Status (10)

Country Link
AT (1) AT316894B (en)
BE (1) BE742331A (en)
BR (1) BR6914557D0 (en)
CH (1) CH518006A (en)
DE (1) DE1959527C3 (en)
ES (2) ES373779A1 (en)
FR (1) FR2024961A1 (en)
GB (1) GB1295650A (en)
NL (1) NL162254B (en)
SE (2) SE384437B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071838A (en) 1976-02-09 1978-01-31 Diax Corporation Solid state force transducer and method of making same
US4191057A (en) * 1978-06-28 1980-03-04 Gould Inc. Inversion layer sprain gauge
DE2841312C2 (en) * 1978-09-22 1985-06-05 Robert Bosch Gmbh, 7000 Stuttgart Monolithic semiconductor pressure sensor and process for its manufacture
JPS5550668A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Semiconductor pressure converter
IT1212404B (en) * 1979-02-22 1989-11-22 Rca Corp METHOD OF A SINGLE ATTACK FOR THE FORMATION OF A MESA PRESENTING A MULTIPLE WALL.
DE3874884T2 (en) * 1988-04-21 1993-04-29 Marelli Autronica ELECTRICAL FORCE AND / OR DEFLECTION SENSOR, ESPECIALLY FOR USE AS A PRESSURE SENSOR.
US4904978A (en) * 1988-04-29 1990-02-27 Solartron Electronics, Inc. Mechanical sensor for high temperature environments
JP2719448B2 (en) * 1991-01-24 1998-02-25 三菱電機株式会社 Semiconductor pressure detector
WO2006023753A2 (en) * 2004-08-20 2006-03-02 Semitool, Inc. System for thinning a semiconductor workpiece
CN113555346B (en) * 2020-08-21 2023-05-23 友达光电股份有限公司 Circuit board and method for measuring strain amount of circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270554A (en) * 1961-01-04 1966-09-06 Bell Telephone Labor Inc Diffused layer transducers
US3277698A (en) * 1963-11-15 1966-10-11 Bell Telephone Labor Inc Stress sensing semiconductive devices
NL153947B (en) * 1967-02-25 1977-07-15 Philips Nv PROCEDURE FOR MANUFACTURING SEMICONDUCTOR DEVICES, USING A SELECTIVE ELECTROLYTIC ETCHING PROCESS AND OBTAINING SEMI-CONDUCTOR DEVICE BY APPLICATION OF THE PROCESS.
BE711537A (en) * 1968-03-01 1968-09-02

Also Published As

Publication number Publication date
BE742331A (en) 1970-05-27
SE363700B (en) 1974-01-28
SE384437B (en) 1976-05-03
DE1959527A1 (en) 1970-06-11
NL162254B (en) 1979-11-15
DE1959527B2 (en) 1981-03-19
ES373779A1 (en) 1972-05-16
FR2024961A1 (en) 1970-09-04
AT316894B (en) 1974-07-25
DE1959527C3 (en) 1981-12-10
GB1295650A (en) 1972-11-08
NL6817089A (en) 1970-06-02
BR6914557D0 (en) 1973-01-02
ES400839A1 (en) 1975-02-01

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Legal Events

Date Code Title Description
PL Patent ceased