GB860807A - Improvements in or relating to methods of manufacturing vacuum-tight envelopes - Google Patents

Improvements in or relating to methods of manufacturing vacuum-tight envelopes

Info

Publication number
GB860807A
GB860807A GB3615057A GB3615057A GB860807A GB 860807 A GB860807 A GB 860807A GB 3615057 A GB3615057 A GB 3615057A GB 3615057 A GB3615057 A GB 3615057A GB 860807 A GB860807 A GB 860807A
Authority
GB
United Kingdom
Prior art keywords
copper
base
cap
iron
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3615057A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB860807A publication Critical patent/GB860807A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/50—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output
    • H01J31/54—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output in which the electron ray or beam is reflected by the image input screen on to the image output screen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

860,807. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Nov. 20, 1957 [Nov. 23, 1956], No. 36150/57. Class 37. [Also in Group XXII] In the manufacture of an envelope for a semiconductor such as a transistor, a copper cap 2 is joined to an iron base 1 having an annular groove 3 milled therein. Upon application of pressure and due to the work hardening of the copper the walls of the groove become closed in at 6, 7, Fig. 3. The base may have a central portion of copper soldered thereto, Fig. 8 (not shown) or the cap may be of steel and the base of copper, Fig. 4 (not shown). In other expedients, Figs. 5, 7 (not shown), a copper cap and a copper base having two parallel holes are joined to the same on opposite sides of an iron plate. The groove 3, Fig. 6, may be provided in an iron insert 21 fixed in a copper base plate 20. Two concentric grooves, Fig. 9, are provided in an iron base 30 for forming a vacuum-tight joint with the cap. The latter encloses a transistor comprising a protrusion 31 of the base 30, plated successively with copper and gilt and secured by a disc 32 of indium to a disc 33 of germanium. The latter is connected by a nickel strip 35 with a base contact pin 37. A second indium electrode 34 is joined to the germanium disc and is connected by a copper strip 39 with an emitter contact pin 38. The envelope constitutes the contact for the collector 32.
GB3615057A 1956-11-23 1957-11-20 Improvements in or relating to methods of manufacturing vacuum-tight envelopes Expired GB860807A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL212445 1956-11-23

Publications (1)

Publication Number Publication Date
GB860807A true GB860807A (en) 1961-02-08

Family

ID=19750812

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3615057A Expired GB860807A (en) 1956-11-23 1957-11-20 Improvements in or relating to methods of manufacturing vacuum-tight envelopes

Country Status (4)

Country Link
CH (1) CH363094A (en)
DE (1) DE1111299B (en)
FR (1) FR1186598A (en)
GB (1) GB860807A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3068382A (en) * 1960-05-23 1962-12-11 Westinghouse Electric Corp Hermetically sealed semiconductor devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1164577A (en) * 1915-04-03 1915-12-14 James Godfrey Boiler-flue joint.
DE335213C (en) * 1920-05-28 1921-03-24 Walter Overhoff Dipl Ing Connection of metallic components
CH297932A (en) * 1942-11-12 1954-04-15 Grossfuss Johannes Method for connecting a hollow sheet metal sleeve to an insert.
DE918090C (en) * 1943-11-03 1954-09-20 Siemens Ag Connecting parts that run at least partially in a straight line
AT179700B (en) * 1945-10-02 1954-09-25 Ernst Koller Method for the permanent connection of structural parts, in particular of profile pieces
DE842729C (en) * 1949-08-30 1952-06-30 Rca Corp Attachment of a small metallic object in a carrier

Also Published As

Publication number Publication date
CH363094A (en) 1962-07-15
DE1111299B (en) 1961-07-20
FR1186598A (en) 1959-08-27

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