GB2631603A - Control apparatus and control panel - Google Patents

Control apparatus and control panel Download PDF

Info

Publication number
GB2631603A
GB2631603A GB2412546.0A GB202412546A GB2631603A GB 2631603 A GB2631603 A GB 2631603A GB 202412546 A GB202412546 A GB 202412546A GB 2631603 A GB2631603 A GB 2631603A
Authority
GB
United Kingdom
Prior art keywords
circuit board
main circuit
heating element
projecting portion
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB2412546.0A
Other languages
English (en)
Other versions
GB202412546D0 (en
Inventor
Okura Kenichiro
Okuno Tomoki
Taketomi Masakazu
Yamada Takahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB202412546D0 publication Critical patent/GB202412546D0/en
Publication of GB2631603A publication Critical patent/GB2631603A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB2412546.0A 2022-04-14 2022-04-14 Control apparatus and control panel Pending GB2631603A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017843 WO2023199481A1 (ja) 2022-04-14 2022-04-14 制御機器および制御盤

Publications (2)

Publication Number Publication Date
GB202412546D0 GB202412546D0 (en) 2024-10-09
GB2631603A true GB2631603A (en) 2025-01-08

Family

ID=88329399

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2412546.0A Pending GB2631603A (en) 2022-04-14 2022-04-14 Control apparatus and control panel

Country Status (3)

Country Link
JP (1) JP7763937B2 (https=)
GB (1) GB2631603A (https=)
WO (1) WO2023199481A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163566A (ja) * 1997-11-28 1999-06-18 Sony Corp 電子機器の放熱構造
JP2002003973A (ja) * 2000-06-22 2002-01-09 Furukawa Electric Co Ltd:The Ｄｉ成形性に優れた缶胴用アルミニウム合金板およびその製造方法
JP2002217343A (ja) * 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2003086983A (ja) * 2001-09-14 2003-03-20 Hitachi Kokusai Electric Inc 電子機器筐体
JP2004259948A (ja) * 2003-02-26 2004-09-16 Denso Corp 電子制御装置
JP2009182182A (ja) * 2008-01-31 2009-08-13 Nippon Seiki Co Ltd 電子部品収容ケース体における放熱構造
JP2020088050A (ja) * 2018-11-20 2020-06-04 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077183U (ja) * 1993-06-24 1995-01-31 富士通テン株式会社 プリント基板の筐体構造
JP3773615B2 (ja) * 1997-02-24 2006-05-10 古河電気工業株式会社 発熱部品冷却用放熱装置
JP2009182181A (ja) * 2008-01-31 2009-08-13 Toshiba Corp 半導体装置
US8451600B1 (en) * 2010-03-04 2013-05-28 Amazon Technologies, Inc. Heat spreading chassis for rack-mounted computer system
JP6578616B1 (ja) * 2018-06-27 2019-09-25 レノボ・シンガポール・プライベート・リミテッド 電子機器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163566A (ja) * 1997-11-28 1999-06-18 Sony Corp 電子機器の放熱構造
JP2002003973A (ja) * 2000-06-22 2002-01-09 Furukawa Electric Co Ltd:The Ｄｉ成形性に優れた缶胴用アルミニウム合金板およびその製造方法
JP2002217343A (ja) * 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2003086983A (ja) * 2001-09-14 2003-03-20 Hitachi Kokusai Electric Inc 電子機器筐体
JP2004259948A (ja) * 2003-02-26 2004-09-16 Denso Corp 電子制御装置
JP2009182182A (ja) * 2008-01-31 2009-08-13 Nippon Seiki Co Ltd 電子部品収容ケース体における放熱構造
JP2020088050A (ja) * 2018-11-20 2020-06-04 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CD-ROM of the specification and drawings annexed to the request of Japanese Utility Model Application No.34268/1993 (Laid-open No.7183/1995)(Fujitsu Ten Ltd) (1995-01-31) paragraphs [0002]-[0013],fig.5 *

Also Published As

Publication number Publication date
JPWO2023199481A1 (https=) 2023-10-19
JP7763937B2 (ja) 2025-11-04
GB202412546D0 (en) 2024-10-09
WO2023199481A1 (ja) 2023-10-19

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