JPWO2023199481A1 - - Google Patents
Info
- Publication number
- JPWO2023199481A1 JPWO2023199481A1 JP2024515277A JP2024515277A JPWO2023199481A1 JP WO2023199481 A1 JPWO2023199481 A1 JP WO2023199481A1 JP 2024515277 A JP2024515277 A JP 2024515277A JP 2024515277 A JP2024515277 A JP 2024515277A JP WO2023199481 A1 JPWO2023199481 A1 JP WO2023199481A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/017843 WO2023199481A1 (ja) | 2022-04-14 | 2022-04-14 | 制御機器および制御盤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023199481A1 true JPWO2023199481A1 (https=) | 2023-10-19 |
| JPWO2023199481A5 JPWO2023199481A5 (https=) | 2024-10-28 |
| JP7763937B2 JP7763937B2 (ja) | 2025-11-04 |
Family
ID=88329399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024515277A Active JP7763937B2 (ja) | 2022-04-14 | 2022-04-14 | 制御機器および制御盤 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7763937B2 (https=) |
| GB (1) | GB2631603A (https=) |
| WO (1) | WO2023199481A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH077183U (ja) * | 1993-06-24 | 1995-01-31 | 富士通テン株式会社 | プリント基板の筐体構造 |
| JPH10242353A (ja) * | 1997-02-24 | 1998-09-11 | Furukawa Electric Co Ltd:The | 発熱部品冷却用放熱装置 |
| JP2002217343A (ja) * | 2001-01-16 | 2002-08-02 | Denso Corp | 電子装置 |
| JP2004259948A (ja) * | 2003-02-26 | 2004-09-16 | Denso Corp | 電子制御装置 |
| JP2009182181A (ja) * | 2008-01-31 | 2009-08-13 | Toshiba Corp | 半導体装置 |
| US9694451B1 (en) * | 2010-03-04 | 2017-07-04 | Amazon Technologies, Inc. | Heat spreading chassis for rack-mounted computer system |
| JP2020088050A (ja) * | 2018-11-20 | 2020-06-04 | Ｎｅｃプラットフォームズ株式会社 | 電子機器の放熱構造及び電子機器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4326035B2 (ja) * | 1997-11-28 | 2009-09-02 | ソニー株式会社 | 電子機器及び電子機器の放熱構造 |
| JP4255602B2 (ja) * | 2000-06-22 | 2009-04-15 | 古河スカイ株式会社 | Ｄｉ成形性に優れた缶胴用アルミニウム合金板およびその製造方法 |
| JP3910816B2 (ja) * | 2001-09-14 | 2007-04-25 | 八木アンテナ株式会社 | 電子機器筐体 |
| JP5093481B2 (ja) * | 2008-01-31 | 2012-12-12 | 日本精機株式会社 | 電子部品収容ケース体における放熱構造 |
| JP6578616B1 (ja) * | 2018-06-27 | 2019-09-25 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
-
2022
- 2022-04-14 JP JP2024515277A patent/JP7763937B2/ja active Active
- 2022-04-14 WO PCT/JP2022/017843 patent/WO2023199481A1/ja not_active Ceased
- 2022-04-14 GB GB2412546.0A patent/GB2631603A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH077183U (ja) * | 1993-06-24 | 1995-01-31 | 富士通テン株式会社 | プリント基板の筐体構造 |
| JPH10242353A (ja) * | 1997-02-24 | 1998-09-11 | Furukawa Electric Co Ltd:The | 発熱部品冷却用放熱装置 |
| JP2002217343A (ja) * | 2001-01-16 | 2002-08-02 | Denso Corp | 電子装置 |
| JP2004259948A (ja) * | 2003-02-26 | 2004-09-16 | Denso Corp | 電子制御装置 |
| JP2009182181A (ja) * | 2008-01-31 | 2009-08-13 | Toshiba Corp | 半導体装置 |
| US9694451B1 (en) * | 2010-03-04 | 2017-07-04 | Amazon Technologies, Inc. | Heat spreading chassis for rack-mounted computer system |
| JP2020088050A (ja) * | 2018-11-20 | 2020-06-04 | Ｎｅｃプラットフォームズ株式会社 | 電子機器の放熱構造及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2631603A (en) | 2025-01-08 |
| JP7763937B2 (ja) | 2025-11-04 |
| GB202412546D0 (en) | 2024-10-09 |
| WO2023199481A1 (ja) | 2023-10-19 |
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