JP7763937B2 - 制御機器および制御盤 - Google Patents

制御機器および制御盤

Info

Publication number
JP7763937B2
JP7763937B2 JP2024515277A JP2024515277A JP7763937B2 JP 7763937 B2 JP7763937 B2 JP 7763937B2 JP 2024515277 A JP2024515277 A JP 2024515277A JP 2024515277 A JP2024515277 A JP 2024515277A JP 7763937 B2 JP7763937 B2 JP 7763937B2
Authority
JP
Japan
Prior art keywords
protrusion
circuit board
heat
main circuit
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024515277A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023199481A1 (https=
JPWO2023199481A5 (https=
Inventor
献一郎 大倉
知樹 奥野
正和 竹冨
剛広 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023199481A1 publication Critical patent/JPWO2023199481A1/ja
Publication of JPWO2023199481A5 publication Critical patent/JPWO2023199481A5/ja
Application granted granted Critical
Publication of JP7763937B2 publication Critical patent/JP7763937B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024515277A 2022-04-14 2022-04-14 制御機器および制御盤 Active JP7763937B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017843 WO2023199481A1 (ja) 2022-04-14 2022-04-14 制御機器および制御盤

Publications (3)

Publication Number Publication Date
JPWO2023199481A1 JPWO2023199481A1 (https=) 2023-10-19
JPWO2023199481A5 JPWO2023199481A5 (https=) 2024-10-28
JP7763937B2 true JP7763937B2 (ja) 2025-11-04

Family

ID=88329399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024515277A Active JP7763937B2 (ja) 2022-04-14 2022-04-14 制御機器および制御盤

Country Status (3)

Country Link
JP (1) JP7763937B2 (https=)
GB (1) GB2631603A (https=)
WO (1) WO2023199481A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217343A (ja) 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2004259948A (ja) 2003-02-26 2004-09-16 Denso Corp 電子制御装置
JP2009182181A (ja) 2008-01-31 2009-08-13 Toshiba Corp 半導体装置
JP2020088050A (ja) 2018-11-20 2020-06-04 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077183U (ja) * 1993-06-24 1995-01-31 富士通テン株式会社 プリント基板の筐体構造
JP3773615B2 (ja) * 1997-02-24 2006-05-10 古河電気工業株式会社 発熱部品冷却用放熱装置
JP4326035B2 (ja) * 1997-11-28 2009-09-02 ソニー株式会社 電子機器及び電子機器の放熱構造
JP4255602B2 (ja) * 2000-06-22 2009-04-15 古河スカイ株式会社 Ｄｉ成形性に優れた缶胴用アルミニウム合金板およびその製造方法
JP3910816B2 (ja) * 2001-09-14 2007-04-25 八木アンテナ株式会社 電子機器筐体
JP5093481B2 (ja) * 2008-01-31 2012-12-12 日本精機株式会社 電子部品収容ケース体における放熱構造
US8451600B1 (en) * 2010-03-04 2013-05-28 Amazon Technologies, Inc. Heat spreading chassis for rack-mounted computer system
JP6578616B1 (ja) * 2018-06-27 2019-09-25 レノボ・シンガポール・プライベート・リミテッド 電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217343A (ja) 2001-01-16 2002-08-02 Denso Corp 電子装置
JP2004259948A (ja) 2003-02-26 2004-09-16 Denso Corp 電子制御装置
JP2009182181A (ja) 2008-01-31 2009-08-13 Toshiba Corp 半導体装置
JP2020088050A (ja) 2018-11-20 2020-06-04 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Also Published As

Publication number Publication date
JPWO2023199481A1 (https=) 2023-10-19
GB2631603A (en) 2025-01-08
GB202412546D0 (en) 2024-10-09
WO2023199481A1 (ja) 2023-10-19

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