WO2023199481A1 - 制御機器および制御盤 - Google Patents

制御機器および制御盤 Download PDF

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Publication number
WO2023199481A1
WO2023199481A1 PCT/JP2022/017843 JP2022017843W WO2023199481A1 WO 2023199481 A1 WO2023199481 A1 WO 2023199481A1 JP 2022017843 W JP2022017843 W JP 2022017843W WO 2023199481 A1 WO2023199481 A1 WO 2023199481A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
main circuit
protrusion
heating element
sheet metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/017843
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English (en)
French (fr)
Japanese (ja)
Inventor
献一郎 大倉
知樹 奥野
正和 竹冨
剛広 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to GB2412546.0A priority Critical patent/GB2631603A/en
Priority to JP2024515277A priority patent/JP7763937B2/ja
Priority to PCT/JP2022/017843 priority patent/WO2023199481A1/ja
Publication of WO2023199481A1 publication Critical patent/WO2023199481A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to control equipment and control panels.
  • modules have been proposed that include a heat dissipation board for dissipating heat emitted from heat-generating components.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2010-3718 (Patent Document 1) describes a module including a heat dissipation board.
  • a plurality of heat generating components are arranged on one side of a heat dissipation board.
  • the heat dissipation board sandwiches the circuit board with the interboard connection terminal of the heat dissipation board bent. This makes it possible to downsize the module, thereby making it possible to downsize the equipment in which the module is incorporated.
  • the circuit board is heated by the heat generating components while the circuit board is sandwiched between the heat generating components mounted on the heat dissipation board.
  • heat builds up inside the device in which the module is installed.
  • the heat dissipation substrate is bent, the projected area of the module becomes smaller, but the depth of the module becomes larger. For this reason, it is not possible to make the device in which the module is incorporated thinner.
  • the present disclosure has been made in view of the above problems, and its purpose is to provide a control device and a control panel that can realize an efficient cooling configuration and a thinner design.
  • the control device of the present disclosure includes a main circuit board, a first heating element, a second heating element, a structure, a first heat radiation sheet, and a second heat radiation sheet.
  • the main circuit board has a front surface and a back surface.
  • the first heating element is mounted on the surface of the main circuit board.
  • the second heating element is mounted on the back surface of the main circuit board.
  • the structure has a first protrusion and a second protrusion.
  • the first protrusion protrudes toward the first heating element.
  • the second protrusion protrudes toward the second heating element.
  • the first heat dissipation sheet is sandwiched between the first heating element and the first protrusion.
  • the second heat dissipation sheet is sandwiched between the second heating element and the second protrusion.
  • the first heat dissipation sheet is in contact with the first heating element and the first protrusion.
  • the second heat dissipation sheet is in contact with the second heating element and the second protrusion.
  • control device and control panel of the present disclosure it is possible to provide a control device that can realize an efficient cooling configuration and a thinner design.
  • FIG. 1 is a perspective view schematically showing the configuration of a control device according to Embodiment 1.
  • FIG. 2 is a cross-sectional perspective view taken along line II-II in FIG. 1.
  • FIG. 2 is a cross-sectional perspective view taken along line III-III in FIG. 1.
  • FIG. 1 is a perspective view schematically showing the internal configuration of a control device according to Embodiment 1.
  • FIG. 5 is a cross-sectional perspective view taken along line VV in FIG. 4.
  • FIG. 6 is an enlarged view of the VI section of FIG. 5.
  • FIG. 5 is a cross-sectional perspective view taken along line VII-VII in FIG. 4.
  • FIG. 8 is an enlarged view of part VIII in FIG. 7; FIG. FIG.
  • FIG. 3 is a perspective view schematically showing the internal configuration of a control device according to a second embodiment.
  • 10 is a cross-sectional perspective view taken along line XX in FIG. 9.
  • FIG. 11 is an enlarged view of section XI in FIG. 10.
  • FIG. 10 is a cross-sectional perspective view taken along line XII-XII in FIG. 9.
  • FIG. 13 is an enlarged view of section XIII in FIG. 12.
  • FIG. FIG. 7 is a cross-sectional perspective view schematically showing a state in which a control device according to a second embodiment is attached to a sheet metal bracket member.
  • 15 is an enlarged view of section XV in FIG. 14.
  • FIG. FIG. 3 is a cross-sectional view schematically showing the configuration of a control panel according to a second embodiment.
  • FIG. 3 is a front view schematically showing the configuration of a control panel according to Embodiment 2.
  • FIG. 3 is a front view schematically showing the configuration of a control
  • control device 1000 is attached to a wall via a wall-mounting frame member (not shown).
  • FIG. 1 is a perspective view showing a control device 1000 according to the first embodiment from the back side.
  • FIG. 2 is a vertical cross-sectional perspective view of the first heating element 40a on the main circuit board 40 at its central position.
  • FIG. 3 is a vertical cross-sectional perspective view of the second heating element 40b on the main circuit board 40 at its central position. Arrows in FIGS. 2 and 3 indicate air flow.
  • the control device 1000 includes a housing member 8, a base sheet metal member 20, a main circuit board 40, a first heating element 40a, a second heating element 40b, a first heat dissipation sheet 41, and a second heat dissipation sheet 23. , a heat spreader 42 and a housing cover member 60.
  • the structure ST includes a base sheet metal member 20 and a heat spreader 42.
  • the base sheet metal member 20, main circuit board 40, first heating element 40a, second heating element 40b, first heat radiation sheet 41, second heat radiation sheet 23, and heat spreader 42 are covered by a housing cover member.
  • the housing member 8 is arranged on the front side of the control device 1000.
  • the housing cover member 60 is arranged on the back side of the control device 1000.
  • the housing cover member 60 is fixed to the housing member 8.
  • a display device 1 is mounted on the front of the control device 1000.
  • the display device 1 is fixed to a housing cover member 60.
  • the display device 1 constitutes an operation section.
  • the display device 1 is equipped with a touch panel (not shown).
  • the housing cover member 60 is provided with a plurality of intake slits 60c and a plurality of exhaust slits 60d.
  • the plurality of intake slits 60c and the plurality of exhaust slits 60d are provided so as to penetrate the wall surface on the back side of the housing cover member 60.
  • the plurality of intake slits 60c are for intake of air from the outside to the inside of the housing cover member 60.
  • the plurality of exhaust slits 60d are for exhausting air from the inside of the housing cover member 60 to the outside.
  • a plurality of intake slits 60c are provided at the lower part of the housing cover member 60.
  • a plurality of exhaust slits 60d are provided at the top of the housing cover member 60.
  • the main circuit board 40 has a front surface FS and a back surface RS.
  • a first heating element 40a is mounted on the surface FS of the main circuit board 40.
  • the first heating element 40a is, for example, a CPU (Central Processing Unit).
  • a second heating element 40b is mounted on the back surface RS of the main circuit board 40.
  • the second heating element 40b is, for example, a PMIC (Power Management Integrated Circuit). That is, heating elements are mounted on both sides of the main circuit board 40.
  • the first heating element 40a is thermally more severe (has a larger amount of heat generated) than the second heating element 40b, and requires more heat dissipation than the second heating element 40b.
  • the first heating element 40a, the second heating element 40b, the first heat radiation sheet 41, and the second heat radiation sheet 23 are arranged between the main circuit board 40, the base metal sheet member 20, and the heat spreader 42.
  • the first heat dissipation sheet 41 and the second heat dissipation sheet 23 are, for example, silicon-based heat dissipation sheets.
  • the main circuit board 40, the base sheet metal member 20, and the heat spreader 42 allow air to pass between the main circuit board 40, the base sheet metal member 20, and the heat spreader 42 from the plurality of intake slits 60c to the plurality of exhaust slits 60d. It is configured to flow.
  • FIG. 4 is a perspective view showing a state in which the housing cover member 60 is removed from the housing member 8.
  • a base metal member 20 is arranged on the back side of the display device 1.
  • the base sheet metal member 20 is made of, for example, a galvanized steel plate (iron-based).
  • a sheet metal case member 30 is fixed to the back side of the base sheet metal member 20 with screws 403.
  • a power supply system board 33 is fixed to the sheet metal case member 30.
  • a main circuit board 40 is arranged on the back side of the base sheet metal member 20.
  • the base sheet metal member 20 holds a main circuit board 40.
  • the base sheet metal member 20 holds a heat spreader 42.
  • the heat spreader 42 is made of aluminum, for example.
  • the heat spreader 42 is made of a material with better heat dissipation than the base metal member 20. Further, the heat spreader 42 is made of a plate material that is thicker than the base metal sheet member 20, thereby making heat dissipation advantageous.
  • the base sheet metal member 20 faces the back surface RS of the main circuit board 40.
  • a heat spreader 42 is arranged on the back side of the main circuit board 40. Heat spreader 42 faces surface FS of main circuit board 40.
  • a transmission system board 51 is fixed to the back side of the heat spreader 42 with screws 404.
  • the heat spreader 42 is fixed to the base metal sheet member 20 with screws 404 passing through holes provided in the main circuit board 40.
  • FIG. 5 is a vertical cross-sectional perspective view at the center position of the first heating element 40a.
  • FIG. 6 is an enlarged view of the vicinity of the first heating element 40a in FIG.
  • the heat spreader 42 has a first protrusion 42a.
  • the first projection 42a projects toward the first heating element 40a.
  • the first protrusion 42a has a diaphragm shape.
  • the first heat dissipation sheet 41 is in contact with the lower surface of the first protrusion 42a.
  • the first heat dissipation sheet 41 is sandwiched between the first heating element 40a and the first protrusion 42a.
  • a through hole is provided in the surface of the first protrusion 42a on which the first heat dissipation sheet 41 is disposed.
  • This through hole is for confirming whether the first heat dissipation sheet 41 is reliably located at a predetermined position when the main circuit board 40 and the heat spreader 42 are combined.
  • the first heat dissipation sheet 41 is in contact with the first heating element 40a and the first protrusion 42a.
  • the first heat dissipation sheet 41 has higher thermal conductivity than air.
  • the heat spreader 42 is fixed with the screws 404, the first projections 42a come into contact with the first heat radiation sheet 41, so that half of the thickness of the first heat radiation sheet 41 is collapsed.
  • a boss portion having a screw hole is provided around the first protrusion 42a. In particular, a pair of boss portions are provided so as to sandwich the first protrusion 42a.
  • the height of the boss portion is higher than the height of the first protrusion 42a and lower than the height of the first protrusion 42a and the height of the first heat dissipation sheet 41 before being crushed.
  • FIG. 7 is a vertical cross-sectional perspective view at the center position of the second heating element 40b.
  • FIG. 8 is an enlarged view of the vicinity of the second heating element 40b in FIG. 7.
  • the base sheet metal member 20 has a second protrusion 20a.
  • the second projection 20a projects toward the second heating element 40b.
  • the second protrusion 20a has a diaphragm shape.
  • the second heat dissipation sheet 23 is in contact with the upper surface of the second protrusion 20a.
  • the second heat dissipation sheet 23 is sandwiched between the second heating element 40b and the second protrusion 20a.
  • a through hole is provided in the surface of the second protrusion 20a on which the second heat dissipation sheet 23 is disposed.
  • This through hole is for confirming whether the second heat dissipation sheet 23 is reliably located at a predetermined position when the main circuit board 40 and the base sheet metal member 20 are combined.
  • the second heat dissipation sheet 23 is in contact with the second heating element 40b and the second protrusion 20a.
  • the first heat dissipation sheet 41 has higher thermal conductivity than air.
  • the height of the boss portion is higher than the height of the second protrusion 20a and lower than the height of the second protrusion 20a and the height of the second heat dissipation sheet 23 before being crushed.
  • a fire prevention partition sheet metal member 22 is fixed to the base sheet metal member 20.
  • the heat spreader 42 is provided with a bent portion 42d. When the control device 1000 is installed on a wall, the bent portion 42d is located at the upper end of the main circuit board 40.
  • the fireproof partition sheet metal member 22 is located on the back side of the main circuit board 40 and also functions as a firewall.
  • a plate spring component 40c is mounted on the main circuit board 40.
  • the leaf spring component 40c is pressed against the heat spreader 42 by contacting the surface of the heat spreader 42 facing the main circuit board 40. This reduces the height dimension of the leaf spring component 40c.
  • the ground connection of the main circuit board 40 is strengthened, and noise radiation generated from the electrical components mounted on the main circuit board 40 is reduced. Since the heat spreader 42 itself partially covers the main circuit board 40, the heat spreader 42 also has a noise radiation shielding function.
  • the iris-shaped side surface of the first protrusion 42a is arranged substantially perpendicular to the direction of the wind.
  • the first projection 42a includes a lower surface on which the first heat dissipation sheet 41 is disposed, and at least two first side surfaces connecting the lower surface and the main surface of the heat spreader 42.
  • One first side surface of the at least two first side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42.
  • One first side surface of the at least two first side surfaces is connected to the first side connected to the bottom surface, the second side connected to the main surface of the heat spreader 42, and the first side and the second side. and a third side connected to the other one of the at least two first side surfaces.
  • the second side is longer than the first side.
  • the heat generated by the second heating element 40b is transmitted to the second protrusion 20a via the second heat dissipation sheet 23, and is diffused into the base metal sheet member 20.
  • the heat diffused into the base sheet metal member 20 is radiated to the outside of the control device 1000 by the air flow. Heat dissipation is enhanced by the wind hitting the second protrusion 20a.
  • the diaphragm-shaped side surface of the second protrusion 20a is arranged substantially perpendicular to the direction of the wind.
  • the second protrusion 20a includes an upper surface on which the second heat dissipation sheet 23 is disposed, and at least two second side surfaces connecting the upper surface and the main surface of the base sheet metal member 20.
  • One of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42.
  • One second side surface of the at least two second side surfaces has a fourth side connected to the top surface, a fifth side connected to the main surface of the base sheet metal member 20, and a fourth side and a fifth side connected to the top surface. It has a sixth side that is connected to the other second side of the at least two second side surfaces. The fifth side is longer than the fourth side.
  • the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base metal sheet member 20.
  • the height of the first protrusion 42a is lower than the height of the second protrusion 20a.
  • the first heat dissipation sheet 41 is in contact with the first heat generating element 40a and the first protrusion 42a
  • the second heat dissipation sheet 23 is in contact with the second heat generating element 40b and the second protrusion 42a. It is in contact with the protrusion 20a. Therefore, the heat generated by the first heating element 40a is transmitted to the first protrusion 42a via the first heat dissipation sheet 41, and the heat generated by the second heat generation pusher 40b is transmitted to the second protrusion via the second heat dissipation sheet 23. 20a.
  • a first heating element 40a is mounted on the front surface FS of the main circuit board 40, and a second heating element 40b is mounted on the back surface RS of the main circuit board 40. Therefore, the main circuit board 40 can be made thinner than when it is bent. Therefore, it is an object of the present invention to provide a control device 1000 that can realize an efficient cooling configuration and a reduced thickness.
  • the main circuit board 40 and the structure ST pass from the plurality of intake slits 60c to the plurality of exhaust slits 60d between the main circuit board 40 and the structure ST. It is configured to allow air to flow through. Therefore, the heat dissipated from the first heating element 40a to the first protrusion 42a via the first heat dissipation sheet 41 and the heat dissipated from the second heat generation element 40b to the second protrusion 20a via the second heat dissipation sheet 23.
  • the heat can be cooled by air flowing from the plurality of intake slits 60c, between the main circuit board 40 and the structure ST, and into the plurality of exhaust slits 60d.
  • control device 1000 since the control device 1000 is not molded with mold resin, air can flow inside the control device 1000. Therefore, cooling efficiency can be increased.
  • the structure ST includes the heat spreader 42.
  • the heat spreader 42 faces the surface FS of the main circuit board 40 and has a first protrusion 42a. Therefore, heat can be diffused using the heat spreader 42.
  • the structure ST includes the base sheet metal member 20.
  • the base sheet metal member 20 holds the main circuit board 40 and the heat spreader 42, faces the back surface RS of the main circuit board 40, and has a second protrusion 20a. Therefore, heat can be diffused using the base sheet metal member 20.
  • the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base sheet metal member 20. Therefore, by changing the speed of the wind flowing through the gap between the main circuit board 40 and the heat spreader 42 and the gap between the main circuit board 40 and the base sheet metal member 20, the first heating element 40a and the second heating element 40b can be effectively heated. can be cooled to Therefore, it is possible to improve heat dissipation on the side of the first heating element 40a, which is more thermally severe.
  • the height of the first protrusion 42a is lower than the height of the second protrusion 20a. Therefore, the gap between the main circuit board 40 and the heat spreader 42 can be made narrower than the gap between the main circuit board 40 and the base sheet metal member 20.
  • one of the at least two first side surfaces is oriented with respect to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42. It is arranged almost vertically. Further, one of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42. Therefore, the first heating element 40a and the second heating element 40b can be effectively cooled.
  • the second side is longer than the first side on the first side surface of the first projection 42a. Further, on the second side surface of the second protrusion 20a, the fifth side of the second protrusion is longer than the fourth side. Therefore, the first protrusion 42a and the second protrusion 20a can be shaped into a constricted shape.
  • heat generated by the heat generating components is diffused to a structure ST that faces the main circuit board 40 on which a plurality of heat generating components are mounted and has other various functions. Can be done. Moreover, air can be efficiently flowed over the surface of the structure ST. Therefore, when the control device 1000 according to the first embodiment is applied to an air conditioning control device, it is possible to make the air conditioning control device thinner.
  • Embodiment 2 The control device according to the second embodiment has the same configuration, operation, and effect as the control device according to the first embodiment, unless otherwise specified.
  • FIG. 9 is a perspective view showing a state in which the housing cover member 60 (see FIG. 14) is removed from the sheet metal outer case 200.
  • a control device 1000 according to the second embodiment includes a sheet metal outer case 200.
  • the structure ST includes a sheet metal outer case 200.
  • the sheet metal outer case 200 is arranged on the front side of the control device 1000.
  • the sheet metal outer case 200 does not have a display device.
  • the sheet metal outer case 200 holds the main circuit board 40.
  • the main circuit board 40, the heat spreader 42, the transmission system board 51, the power supply system board 33, and the sheet metal case member 30 are fixed to the sheet metal outer case 200.
  • a housing cover member 60 is attached to the sheet metal outer case 200 (see FIG. 14).
  • FIG. 10 is a vertical cross-sectional perspective view at the center position of the first heating element 40a.
  • FIG. 11 is an enlarged view of the vicinity of the first heating element 40a in FIG. 10.
  • heat spreader 42 faces surface FS of main circuit board 40.
  • the heat spreader 42 has a first protrusion 42a.
  • the first projection 42a projects toward the first heating element 40a.
  • the first heat dissipation sheet 41 is sandwiched between the first heating element 40a and the first protrusion 42a.
  • the first heat dissipation sheet 41 is in contact with the first heating element 40a and the first protrusion 42a.
  • the heat generated by the first heating element 40a is transmitted to the first protrusion 42a of the heat spreader 42 via the first heat dissipation sheet 41, and is diffused onto the surface of the heat spreader 42.
  • FIG. 12 is a vertical cross-sectional perspective view at the center position of the second heating element 40b.
  • FIG. 13 is an enlarged view of the vicinity of the second heating element 40b in FIG. 12.
  • the sheet metal outer case 200 faces the back surface RS of the main circuit board 40.
  • the sheet metal outer case 200 has a second protrusion 20a.
  • the second projection 20a projects toward the second heating element 40b.
  • the second heat dissipation sheet 23 is sandwiched between the second heating element 40b and the second protrusion 20a.
  • the second heat dissipation sheet 23 is in contact with the second heating element 40b and the second protrusion 20a.
  • the heat generated by the second heating element 40b is transmitted to the second protrusion 20a of the sheet metal outer case 200 via the second heat dissipation sheet 23, and is diffused to the surface of the sheet metal outer case 200.
  • FIG. 14 is a vertical cross-sectional perspective view at the center position of the second heating element 40b with the sheet metal outer case 200 attached to the sheet metal bracket member 120.
  • FIG. 15 is an enlarged view of the vicinity of the second heating element 40b. The arrows in FIGS. 14 and 15 indicate the flow of heat.
  • the sheet metal outer case 200 is attached to the sheet metal bracket member 120.
  • the sheet metal bracket member 120 is fixed to the metal wall material 3000a (see FIG. 16) of the control panel 3000 with screws 501.
  • the heat generated by the second heating element 40b is transmitted to the second protrusion 20a of the sheet metal outer case 200 via the second heat dissipation sheet 23, and is diffused into the sheet metal outer case 200.
  • the heat transmitted downward is transmitted to the surface of the sheet metal bracket member 120 via the contact portion between the sheet metal outer case 200 and the sheet metal bracket member 120.
  • FIG. 16 is a cross-sectional view of the control panel 3000 with the control device 1000 installed on the control panel 3000.
  • FIG. 17 is a front view of the control panel 3000 in a state where the control device 1000 is installed on the control panel 3000. Note that in FIG. 17, the front cover of the control panel 3000 is not shown for convenience of explanation.
  • the sheet metal bracket member 120 is attached to a metal wall material 3000a within the control panel 3000. The heat transferred to the sheet metal bracket member 120 is transferred to the metal wall material 3000a having a large area, as shown by the arrow in FIG.
  • control devices 1000 are housed in the control panel 3000, but the number of control devices 1000 is not limited to four.
  • the structure ST includes the sheet metal outer case 200.
  • the sheet metal outer case 200 holds the main circuit board 40, faces the back surface RS of the main circuit board 40, and has a second protrusion 20a. Therefore, heat can be diffused using the sheet metal outer case 200.
  • the control panel 3000 includes a sheet metal bracket member 120 to which the sheet metal outer case 200 of the control device 1000 is attached, and a metal wall material 3000a to which the sheet metal bracket member 120 is attached. Therefore, heat can be diffused through the route of the sheet metal outer case 200, the sheet metal bracket member 120, and the metal wall material 3000a.
  • the heat of the heat generating components mounted on the main circuit board 40 is transferred to the structure ST corresponding to the main circuit board 40, the sheet metal outer case 200, the sheet metal bracket member 120, and the control panel. Heat can be spread through 3000 routes. Even if a large number of heat generating components are mounted on the main circuit board 40, it is possible to suppress heat from accumulating inside the control device 1000. Therefore, an efficient cooling configuration can be realized. Therefore, when the control device 1000 according to the second embodiment is applied to an air conditioning control device, an efficient cooling structure can be realized.
  • 1 Display device 8 Housing member, 20 Base sheet metal member, 20a Second protrusion, 22 Fire prevention partition sheet metal member, 23 Second heat dissipation sheet, 30 Sheet metal case member, 33 Power supply system board, 40 Main circuit board, 40a 1st heating element, 40b 2nd heating element, 40c plate spring component, 41 1st heat dissipation sheet, 42 heat spreader, 42a 1st protrusion, 42d bent part, 51 transmission system board, 60 housing cover member, 60c air intake 60d Exhaust slit, 120 Sheet metal bracket member, 200 Sheet metal outer case, 403, 404, 501 Screws, 1000 Control equipment, 3000 Control panel, 3000a Metal wall material, FS front, RS back, ST structure.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PCT/JP2022/017843 2022-04-14 2022-04-14 制御機器および制御盤 Ceased WO2023199481A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB2412546.0A GB2631603A (en) 2022-04-14 2022-04-14 Control apparatus and control panel
JP2024515277A JP7763937B2 (ja) 2022-04-14 2022-04-14 制御機器および制御盤
PCT/JP2022/017843 WO2023199481A1 (ja) 2022-04-14 2022-04-14 制御機器および制御盤

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