GB2505594B - Microelectronic substrate for alternate package functionality - Google Patents
Microelectronic substrate for alternate package functionalityInfo
- Publication number
- GB2505594B GB2505594B GB1321487.9A GB201321487A GB2505594B GB 2505594 B GB2505594 B GB 2505594B GB 201321487 A GB201321487 A GB 201321487A GB 2505594 B GB2505594 B GB 2505594B
- Authority
- GB
- United Kingdom
- Prior art keywords
- microelectronic substrate
- alternate package
- package functionality
- functionality
- alternate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Combinations Of Printed Boards (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/153,608 US8674235B2 (en) | 2011-06-06 | 2011-06-06 | Microelectronic substrate for alternate package functionality |
PCT/US2012/040677 WO2012170328A2 (en) | 2011-06-06 | 2012-06-04 | Microelectronic substrate for alternate package functionality |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201321487D0 GB201321487D0 (en) | 2014-01-22 |
GB2505594A GB2505594A (en) | 2014-03-05 |
GB2505594B true GB2505594B (en) | 2015-11-25 |
Family
ID=47260798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1321487.9A Expired - Fee Related GB2505594B (en) | 2011-06-06 | 2012-06-04 | Microelectronic substrate for alternate package functionality |
Country Status (8)
Country | Link |
---|---|
US (2) | US8674235B2 (ko) |
JP (2) | JP5940653B2 (ko) |
KR (1) | KR101555773B1 (ko) |
CN (2) | CN103597594B (ko) |
DE (1) | DE112012002370T5 (ko) |
GB (1) | GB2505594B (ko) |
TW (1) | TWI544600B (ko) |
WO (1) | WO2012170328A2 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8207453B2 (en) | 2009-12-17 | 2012-06-26 | Intel Corporation | Glass core substrate for integrated circuit devices and methods of making the same |
US9420707B2 (en) | 2009-12-17 | 2016-08-16 | Intel Corporation | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
US8674235B2 (en) | 2011-06-06 | 2014-03-18 | Intel Corporation | Microelectronic substrate for alternate package functionality |
WO2013133827A1 (en) * | 2012-03-07 | 2013-09-12 | Intel Corporation | Glass clad microelectronic substrate |
WO2014190005A1 (en) * | 2013-05-22 | 2014-11-27 | Transient Electronics, Inc. | Controlled transformation of non-transient electronics |
US9204543B2 (en) * | 2013-12-03 | 2015-12-01 | Infineon Technologies Ag | Integrated IC package |
US9859896B1 (en) * | 2015-09-11 | 2018-01-02 | Xilinx, Inc. | Distributed multi-die routing in a multi-chip module |
US10522949B1 (en) * | 2018-08-08 | 2019-12-31 | Qualcomm Incorporated | Optimized pin pattern for high speed input/output |
US11585102B2 (en) | 2018-11-07 | 2023-02-21 | Viconic Sporting Llc | Load distribution and absorption underpayment system |
US10982451B2 (en) | 2018-11-07 | 2021-04-20 | Viconic Sporting Llc | Progressive stage load distribution and absorption underlayment system |
US20190115293A1 (en) * | 2018-12-12 | 2019-04-18 | Intel Corporation | Multiple ball grid array (bga) configurations for a single integrated circuit (ic) package |
US20220189880A1 (en) * | 2020-12-16 | 2022-06-16 | Srinivas V. Pietambaram | Microelectronic structures including glass cores |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5631807A (en) * | 1995-01-20 | 1997-05-20 | Minnesota Mining And Manufacturing Company | Electronic circuit structure with aperture suspended component |
JPH09298217A (ja) * | 1996-05-07 | 1997-11-18 | Hitachi Ltd | 半導体装置の製造方法、半導体装置および電子装置 |
US20020020898A1 (en) * | 2000-08-16 | 2002-02-21 | Vu Quat T. | Microelectronic substrates with integrated devices |
JP2003188508A (ja) * | 2001-12-18 | 2003-07-04 | Toshiba Corp | プリント配線板、面実装形回路部品および回路モジュール |
KR100648040B1 (ko) * | 2005-11-25 | 2006-11-23 | 삼성전자주식회사 | 다수의 금속 랜드를 가지는 인터포저 기판, 및 이로부터제작되는 인터포저를 포함하는 적층 칩 패키지 |
US20080271914A1 (en) * | 2005-04-18 | 2008-11-06 | Kabushiki Kaisha Toshiba | Printed wiring board and information processing apparatus |
KR20090105661A (ko) * | 2008-04-03 | 2009-10-07 | 삼성전기주식회사 | 다층 인쇄회로기판 및 그 제조방법 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184905A (ja) | 1984-10-03 | 1986-04-30 | Nippon Telegr & Teleph Corp <Ntt> | アンテナ装置 |
JPS62196376U (ko) * | 1986-06-04 | 1987-12-14 | ||
JPH10135223A (ja) * | 1996-11-01 | 1998-05-22 | Hitachi Ltd | はんだバンプの転写形成方法およびはんだバンプ転写用チップならびに半導体装置 |
JPH10150120A (ja) * | 1996-11-19 | 1998-06-02 | Denso Corp | プリント配線基板,bga型lsiパッケージ及び電子装置 |
JPH10294553A (ja) * | 1997-04-18 | 1998-11-04 | Tec Corp | 回路基板 |
US6297565B1 (en) * | 1998-03-31 | 2001-10-02 | Altera Corporation | Compatible IC packages and methods for ensuring migration path |
JP2001033515A (ja) * | 1999-07-22 | 2001-02-09 | Nec Corp | 半導体装置の裏面解析用基板 |
TW531082U (en) * | 2000-05-11 | 2003-05-01 | Asustek Comp Inc | Double layout of slot hole |
JP3558595B2 (ja) | 2000-12-22 | 2004-08-25 | 松下電器産業株式会社 | 半導体チップ,半導体チップ群及びマルチチップモジュール |
JP4023159B2 (ja) * | 2001-07-31 | 2007-12-19 | ソニー株式会社 | 半導体装置の製造方法及び積層半導体装置の製造方法 |
TW565011U (en) * | 2003-04-09 | 2003-12-01 | Via Tech Inc | Flip-chip package substrate |
JP2005101082A (ja) * | 2003-09-22 | 2005-04-14 | Sharp Corp | ランドパターン構造 |
ATE478545T1 (de) * | 2004-10-29 | 2010-09-15 | Murata Manufacturing Co | Mehrschichtiges substrat mit elektronischer komponente des chiptyps und herstellungsverfahren dafür |
US7926033B2 (en) | 2005-05-27 | 2011-04-12 | Cisco Technology, Inc. | Method for supporting new network element software versions in an element management system without upgrading |
WO2007034629A1 (ja) * | 2005-09-20 | 2007-03-29 | Murata Manufacturing Co., Ltd. | 部品内蔵モジュールの製造方法および部品内蔵モジュール |
TWI292947B (en) * | 2006-06-20 | 2008-01-21 | Unimicron Technology Corp | The structure of embedded chip packaging and the fabricating method thereof |
ATE462189T1 (de) * | 2006-09-25 | 2010-04-15 | Borealis Tech Oy | Koaxiales kabel |
TWI380427B (en) * | 2007-01-16 | 2012-12-21 | Advanced Semiconductor Eng | Substrate and the semiconductor package comprising the same |
JP4424449B2 (ja) * | 2007-05-02 | 2010-03-03 | 株式会社村田製作所 | 部品内蔵モジュール及びその製造方法 |
JP2009231489A (ja) * | 2008-03-21 | 2009-10-08 | Akebono Brake Ind Co Ltd | 加速度センサの実装構造 |
JP5150518B2 (ja) * | 2008-03-25 | 2013-02-20 | パナソニック株式会社 | 半導体装置および多層配線基板ならびにそれらの製造方法 |
JP5005603B2 (ja) * | 2008-04-03 | 2012-08-22 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
US8674235B2 (en) * | 2011-06-06 | 2014-03-18 | Intel Corporation | Microelectronic substrate for alternate package functionality |
-
2011
- 2011-06-06 US US13/153,608 patent/US8674235B2/en not_active Expired - Fee Related
-
2012
- 2012-05-25 TW TW101118791A patent/TWI544600B/zh not_active IP Right Cessation
- 2012-06-04 CN CN201280027841.0A patent/CN103597594B/zh not_active Expired - Fee Related
- 2012-06-04 KR KR1020137033510A patent/KR101555773B1/ko not_active IP Right Cessation
- 2012-06-04 CN CN201610364334.6A patent/CN106057769B/zh active Active
- 2012-06-04 GB GB1321487.9A patent/GB2505594B/en not_active Expired - Fee Related
- 2012-06-04 DE DE112012002370.6T patent/DE112012002370T5/de not_active Withdrawn
- 2012-06-04 WO PCT/US2012/040677 patent/WO2012170328A2/en active Application Filing
- 2012-06-04 JP JP2014513781A patent/JP5940653B2/ja active Active
-
2014
- 2014-01-23 US US14/162,002 patent/US9961769B2/en not_active Expired - Fee Related
-
2016
- 2016-05-18 JP JP2016099170A patent/JP6174195B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5631807A (en) * | 1995-01-20 | 1997-05-20 | Minnesota Mining And Manufacturing Company | Electronic circuit structure with aperture suspended component |
JPH09298217A (ja) * | 1996-05-07 | 1997-11-18 | Hitachi Ltd | 半導体装置の製造方法、半導体装置および電子装置 |
US20020020898A1 (en) * | 2000-08-16 | 2002-02-21 | Vu Quat T. | Microelectronic substrates with integrated devices |
JP2003188508A (ja) * | 2001-12-18 | 2003-07-04 | Toshiba Corp | プリント配線板、面実装形回路部品および回路モジュール |
US20080271914A1 (en) * | 2005-04-18 | 2008-11-06 | Kabushiki Kaisha Toshiba | Printed wiring board and information processing apparatus |
KR100648040B1 (ko) * | 2005-11-25 | 2006-11-23 | 삼성전자주식회사 | 다수의 금속 랜드를 가지는 인터포저 기판, 및 이로부터제작되는 인터포저를 포함하는 적층 칩 패키지 |
KR20090105661A (ko) * | 2008-04-03 | 2009-10-07 | 삼성전기주식회사 | 다층 인쇄회로기판 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP5940653B2 (ja) | 2016-06-29 |
WO2012170328A3 (en) | 2013-04-25 |
GB2505594A (en) | 2014-03-05 |
CN103597594B (zh) | 2016-08-17 |
KR20140021032A (ko) | 2014-02-19 |
KR101555773B1 (ko) | 2015-09-25 |
GB201321487D0 (en) | 2014-01-22 |
TWI544600B (zh) | 2016-08-01 |
TW201308561A (zh) | 2013-02-16 |
CN103597594A (zh) | 2014-02-19 |
US20140133075A1 (en) | 2014-05-15 |
JP2016154265A (ja) | 2016-08-25 |
DE112012002370T5 (de) | 2014-03-06 |
CN106057769B (zh) | 2018-11-16 |
US20120305303A1 (en) | 2012-12-06 |
WO2012170328A2 (en) | 2012-12-13 |
JP6174195B2 (ja) | 2017-08-02 |
JP2014517532A (ja) | 2014-07-17 |
US9961769B2 (en) | 2018-05-01 |
CN106057769A (zh) | 2016-10-26 |
US8674235B2 (en) | 2014-03-18 |
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