GB2322974A - Circuit board having edge vias - Google Patents

Circuit board having edge vias Download PDF

Info

Publication number
GB2322974A
GB2322974A GB9802869A GB9802869A GB2322974A GB 2322974 A GB2322974 A GB 2322974A GB 9802869 A GB9802869 A GB 9802869A GB 9802869 A GB9802869 A GB 9802869A GB 2322974 A GB2322974 A GB 2322974A
Authority
GB
United Kingdom
Prior art keywords
plated layer
circuit board
hole portion
layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9802869A
Other languages
English (en)
Other versions
GB9802869D0 (en
Inventor
Yoshitaka Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9802869D0 publication Critical patent/GB9802869D0/en
Publication of GB2322974A publication Critical patent/GB2322974A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB9802869A 1997-03-03 1998-02-12 Circuit board having edge vias Withdrawn GB2322974A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9065538A JPH10247766A (ja) 1997-03-03 1997-03-03 回路基板

Publications (2)

Publication Number Publication Date
GB9802869D0 GB9802869D0 (en) 1998-04-08
GB2322974A true GB2322974A (en) 1998-09-09

Family

ID=13289903

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9802869A Withdrawn GB2322974A (en) 1997-03-03 1998-02-12 Circuit board having edge vias

Country Status (6)

Country Link
JP (1) JPH10247766A (fr)
KR (1) KR19980079794A (fr)
CN (1) CN1091339C (fr)
DE (1) DE19808932C2 (fr)
FR (1) FR2760313B1 (fr)
GB (1) GB2322974A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346734A (en) * 1999-01-28 2000-08-16 Marconi Electronic Syst Ltd Connections for optical components on circuit boards
DE10224057A1 (de) * 2002-05-31 2004-01-08 Robert Bosch Gmbh Kontaktverbindung und Verfahren zu deren Herstellung
US7155815B2 (en) 2003-06-05 2007-01-02 Novar Gmbh Electrical contacting method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
US20020140105A1 (en) * 2001-02-16 2002-10-03 Higgins Leo M. High strength vias
KR100451926B1 (ko) * 2002-10-14 2004-10-08 타이코에이엠피 주식회사 자동차 정션박스 인쇄회로기판의 대전류 분배용측면메탈라인의 성형방법 및 이 방법에 의해 제조되는자동차 정션박스의 인쇄회로기판
KR100495211B1 (ko) * 2002-11-25 2005-06-14 삼성전기주식회사 세라믹 다층기판 및 그 제조방법
CN1324932C (zh) * 2003-10-16 2007-07-04 光宝科技股份有限公司 具有防止切割毛边的印刷电路板
JP4850596B2 (ja) * 2006-06-19 2012-01-11 株式会社 日立ディスプレイズ 液晶表示装置
JP6755096B2 (ja) * 2016-01-22 2020-09-16 日立オートモティブシステムズ株式会社 車載用電子モジュール、カードエッジコネクタ、およびコネクタ
EP3512313A1 (fr) * 2018-01-16 2019-07-17 ZKW Group GmbH Système de carte de circuit imprimé
KR20220052011A (ko) 2020-10-20 2022-04-27 삼성전자주식회사 모듈 기판 및 이를 포함하는 반도체 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060369A (en) * 1990-01-31 1991-10-29 Ford Motor Company Printed wiring board construction
EP0475567A2 (fr) * 1990-09-12 1992-03-18 Macdermid Incorporated Méthode de fabrication de plaquettes à circuit imprimé

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1085209B (de) * 1959-12-12 1960-07-14 Dielektra Ag Gedruckte elektrische Leiterplatte
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
JPH07122831A (ja) * 1993-10-25 1995-05-12 Taiyo Yuden Co Ltd 回路基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060369A (en) * 1990-01-31 1991-10-29 Ford Motor Company Printed wiring board construction
EP0475567A2 (fr) * 1990-09-12 1992-03-18 Macdermid Incorporated Méthode de fabrication de plaquettes à circuit imprimé

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346734A (en) * 1999-01-28 2000-08-16 Marconi Electronic Syst Ltd Connections for optical components on circuit boards
US6487087B1 (en) 1999-01-28 2002-11-26 Bookham Technology Plc Optical interface arrangement
GB2346734B (en) * 1999-01-28 2003-09-24 Marconi Electronic Syst Ltd Optical interface arrangement
DE10224057A1 (de) * 2002-05-31 2004-01-08 Robert Bosch Gmbh Kontaktverbindung und Verfahren zu deren Herstellung
US7155815B2 (en) 2003-06-05 2007-01-02 Novar Gmbh Electrical contacting method

Also Published As

Publication number Publication date
DE19808932C2 (de) 2001-02-22
GB9802869D0 (en) 1998-04-08
JPH10247766A (ja) 1998-09-14
FR2760313B1 (fr) 2000-09-22
CN1195960A (zh) 1998-10-14
KR19980079794A (ko) 1998-11-25
DE19808932A1 (de) 1998-09-10
CN1091339C (zh) 2002-09-18
FR2760313A1 (fr) 1998-09-04

Similar Documents

Publication Publication Date Title
US6096131A (en) Solder paste deposition
US4758459A (en) Molded circuit board
GB2322974A (en) Circuit board having edge vias
CN103117264A (zh) 布线基板及其制造方法
KR102659691B1 (ko) 회로기판
KR102040605B1 (ko) 인쇄회로기판 및 그의 제조 방법
US7065869B2 (en) Method for plating of printed circuit board strip
GB2248345A (en) Edge soldering of electronic components
JP4023971B2 (ja) チップ型半導体装置
US6609915B2 (en) Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
US4925522A (en) Printed circuit assembly with contact dot
US6305067B1 (en) Elastic plate structure for preventing electromagnetic interference and manufacturing method for the same
EP0277118B1 (fr) Barre de branchement commun amovible
US6240635B1 (en) Printed circuit board scrap removal and printed circuit board fabrication process
EP0468787A2 (fr) Transport automatique sur bande pour la technique des semi-conducteurs
EP0621982A1 (fr) Cadre de montage et composant a semi-conducteurs l'utilisant
JP2006120677A (ja) 配線基板の接続端子構造
JP2009158660A (ja) 表面実装型発光ダイオードおよび発光装置
JPH0750464A (ja) カットスルーホール基板及びその製造方法
JPH0582931A (ja) フレキシブルプリント配線板
JPS59158588A (ja) プリント配線基板
JP2632020B2 (ja) 多連プリント配線板
JP2006120867A (ja) 配線回路基板の製造方法
JPH10270844A (ja) 配線板の製造方法
JPH0443698A (ja) 多層積層配線基板

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)