CN1091339C - 回路基板 - Google Patents

回路基板 Download PDF

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CN1091339C
CN1091339C CN98100591A CN98100591A CN1091339C CN 1091339 C CN1091339 C CN 1091339C CN 98100591 A CN98100591 A CN 98100591A CN 98100591 A CN98100591 A CN 98100591A CN 1091339 C CN1091339 C CN 1091339C
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electrodeposited coating
loop substrate
loop
substrate
coating
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CN1195960A (zh
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井上善贵
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及一种回路基板,其由绝缘基板1a和设在该绝缘基板端面4上的侧面通孔部分5构成,在该侧面通孔部分中,作有第一电镀层5a和第二电镀层5b。该第二电镀层5b作在该第一电镀层上,由硬度比第一电镀层更高的材料制成。因此,在切断时不会损伤回转刀刃的锋利度,不会引起回路之间的短路。

Description

回路基板
本发明涉及回路基板,详细地说,涉及具有侧面通孔结构的回路基板。
回路基板在许多电气机械制品上广泛应用。由于小型化,轻型化的倾向,回路基板的集成度正日益提高。并且,近年来,例如在电视机的主基板的母回路基板上,使用装有比较小型的回路基板,通过叠合形成的母回路基板。
作为这种将所装载的小型回路基板,与母回路基板电气连接的一种方法是,利用在回路基板端面作出的侧面通孔部分,形成连接端子,利用这个连接端子,与母回路基板的回路图形进行连接。
这里,根据图5~图8来说明先前的回路基板。
图5为先前的回路基板10;图6为利用先前的回路基板的侧面通孔部分的VI-VI线剖开的主要部分的剖面图;图7为用于说明先前的回路基板的制造的回路基板材料的俯视图;图8为图7的D部分的放大的俯视图。
首先,如图5所示,先前的回路基板10由绝缘材料制成,大略为方形,在其上表面10a上,形成给定的回路图形20,在该回路图形20上,安装着芯片元件30和分立元件(图中未示出)等,构成具有给定功能的回路基板10。
该回路基板10,是通过分割回路基板材料B形成的。
另外,在回路基板10的端面40上,形成多个侧面通孔部分50;它们是由通孔70(参见图8)构成的,其形状可以为(例如)半圆形或圆弧形等。上述通孔70分别由铜电镀层50a和焊锡涂层50b分割为两部分,构成侧面通孔部分50。又,如图5和图8所示,在先前的这个回路基板10的侧面通孔部分50上,覆盖着铜的电镀层50a作为基底,在该铜电镀层50a上,形成厚度较厚(例如,约20微米厚)的,由焊锡构成的焊锡涂层50b。
再者,该焊锡涂层50b,是当利用焊锡,使侧面通孔部分50与图中没有示出的母回路基板的回路图形连接时,为了改善焊锡的附着性能而设置的。另外,上述通孔70的分割是通过利用回转刀刃的切断进行的。
但是,如图7所示,由于上述结构的回路基板10是同时在同一基板上形成的,当沿着切断线60a,60b,将由多个分别连接在一起的回路基板10构成的回路基板材料B切断分割为单个的回路基板10时,是利用具有回转刀刃的刀具(图中未示出)进行切断的,而切断时,因为构成侧面通孔部分50的通孔70上形成的焊锡涂层50b(参见图5)的粘性大,因此,焊锡会粘附在回转刀刃周围。
另外,由于焊锡涂层50b容易塑性变形,粘度大,因此,难以完全切断,而且切割粉末难以落下。此外,切割粉末粘在回转刀刃上,使回转刀刃的锋利度变坏。而且,由于回转刀刃的锋利度变坏,铜电镀层50a的切口上会产生毛刺、翘尾;又由于焊锡涂层50b柔软,也会有产生毛刺、翘尾的问题。
由这种铜电镀层50a和焊锡涂层50b形成的较大的毛刺,在将端面40上具有侧面通孔部分50的回路基板10放置在母回路基板(图中未示出)上时,可从回路基板10的侧面通孔部分50上剥离,而与(例如)母回路基板上的其它回路图形接触,从而使回路之间短路,这也是一个问题。
本发明的回路基板由绝缘基板和设在该绝缘基板端面上的侧面通孔部分构成,在该侧面通孔部分上形成第一电镀层,和第二电镀层;该第二电镀层在该第一电镀层上,由比第一电镀层硬度更高的材料制成。
在本发明中,第一电镀层为铜电镀层,而第二电镀层为镍电镀层。
另外,在本发明中,在第二电镀层上还形成作为第三电镀层的金电镀层。
本发明的目的是提供一种焊锡附着性能好的、性能稳定的回路基板。
现结合附图对本发明进行详细的描述。
图1为本发明的实施例的回路基板的透视图;
图2为利用本发明的实施例的回路基板的侧面通孔部分的II-II线剖开的主要部分的剖面图;
图3为用于说明本发明的回路基板的制造的回路基板材料的俯视图;
图4为本发明的图3的C部的放大的俯视图;
图5为先前的回路基板的透视图;
图6为利用图5的先前的回路基板的侧面通孔部分VI-VI线剖开的主要部分的剖面图;
图7为用于说明先前的回路基板的制造的回路基板材料的俯视图;
图8为图7的D部分的放大的俯视图。
如图1所示,由绝缘材料制成的本发明的回路基板1由大略为方形的绝缘基板1a构成,在其上表面1b上,设有所希望的回路图形2,在该回路图形2上放置着(例如)电阻和电容等芯片元件3和分立元件(图中未示出)等,形成具有所希望功能的回路基板1。
在上述回路基板1的端面4上,作出多个(例如)半圆形或圆弧形等的侧面通孔部分5...。又如图2所示,在该侧面通孔部分5...上,形成作为基底的、(例如)由铜电镀层构成的第一电镀层5a和第二电镀层5b。该第二电镀层作在该第一电镀层5a上,由(例如)镍电镀层等比上述第一电镀层5a硬度更高的材料制成。
另外,铜电镀层,镍电镀层的硬度随着电镀时的条件和电镀毛坯材料成分的不同而不同。一般,镍电镀层的硬度比铜电镀层要高。
在上述第二电镀层5b上还形成比较薄的(例如,几个微米厚),由例如,金或银等焊锡附着性能良好的材料制成的第三电镀层5c。
上述的侧面通孔部分5...即成为与母回路基板(图中未示出)的回路图形连接的连接端子部分。
又如图3和图4所示,制造回路基板1时,在该回路基板材料A的纵向切断线6a上,设有多个(例如)圆形或椭圆形等形状的通孔7,而在该通孔7中形成上述第一,第二和第三电镀层5a,5b,5c。另外,该通孔7通过利用回转刀刃的切断被分割开来,从而制造出分别具有侧面通孔部分5的回路基板1。
另外,如图3所示,上述的各个回路基板1是利用具有回转刀刃的刀具(图中未示出),分别沿着多条纵向切断线6a和横向切断线6b,将回路基板材料A切断而制造出来的。该回转基板材料A是将按多行×多列方式配置的多个(例如6行×5列时的30个)回路基板1与同一基板连接而形成的。在回路基板材料A的两端设有一对耳部8,8,它们用于通过夹具(图中未示出)支承回路基板材料A。
由于本发明的回路基板的第一电镀层(例如,铜电镀层)和在该第一电镀层上,由硬度比第一电镀层更高的材料制成的第二电镀层(例如,镍电镀层)是形成在作在端面上的侧面通孔部分中的,因此,在利用回转刀刃切断作有回路基板材料的通孔的纵向切断线时,第二电镀层贴在回转刀刃上,成为粉末状态,而被切断。由于第二电镀层的粘性比焊锡涂层的粘性低,因此,第二电镀层难以贴在回转刀刃上,不会损伤回转刀刃的锋利度。另外,由于第二电镀层的硬度也比第一电镀层的硬度高,因此,假设即使在第一电镀层的切断部分上产生毛刺、翘尾,也可具有抑制它们的效果。
因此,在利用回转刀刃切断回路基板材料时,第一,第二电镀层的毛刺产生比较少,而且,即使产生,也是较小的毛刺,这种毛刺不会从回路基板上被剥离下来,因此不会有由于剥下来的毛刺引起的回路之间的短路,可以提供性能稳定的回路基板。
又,在本发明中,因为在第二电镀层上形成了作为第三电镀层的金电镀层或银电镀层等的、焊锡附着性能比第二电镀层好的金属电镀层,而金电镀层与焊锡的附着性能好,因此,可以提供构成焊锡附着性能好的连接端子部分的侧面通孔部分。
另外,由于与第二电镀层比较,第三电镀层特别薄,因此,其硬度和粘性对切断没有影响。

Claims (3)

1.一种回路基板,其特征是,它由绝缘基板和设在该绝缘基板端面上的侧面通孔部分构成,通过以旋转刀刃切断设于集合所述绝缘基板的回路基板材料上的通孔,形成所述侧面通孔部分,在该侧面通孔部分上形成第一电镀层和第二电镀层;该第二电镀层在该第一电镀层上,由粘性比焊锡低而且硬度比第一电镀层高的材料制成。
2.如权利要求1所述的回路基板,其特征是,上述第一电镀层为铜电镀层,而第二电镀层为镍电镀层。
3.如权利要求1或2所述的回路基板,其特征是,在上述第二电镀层上,形成了作为第三电镀层的、焊锡附着性能比上述第二电镀层好的金属电镀层。
CN98100591A 1997-03-03 1998-03-02 回路基板 Expired - Fee Related CN1091339C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP065538/97 1997-03-03
JP9065538A JPH10247766A (ja) 1997-03-03 1997-03-03 回路基板

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CN1195960A CN1195960A (zh) 1998-10-14
CN1091339C true CN1091339C (zh) 2002-09-18

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JP (1) JPH10247766A (zh)
KR (1) KR19980079794A (zh)
CN (1) CN1091339C (zh)
DE (1) DE19808932C2 (zh)
FR (1) FR2760313B1 (zh)
GB (1) GB2322974A (zh)

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US20020140105A1 (en) * 2001-02-16 2002-10-03 Higgins Leo M. High strength vias
DE10224057A1 (de) * 2002-05-31 2004-01-08 Robert Bosch Gmbh Kontaktverbindung und Verfahren zu deren Herstellung
KR100451926B1 (ko) * 2002-10-14 2004-10-08 타이코에이엠피 주식회사 자동차 정션박스 인쇄회로기판의 대전류 분배용측면메탈라인의 성형방법 및 이 방법에 의해 제조되는자동차 정션박스의 인쇄회로기판
KR100495211B1 (ko) * 2002-11-25 2005-06-14 삼성전기주식회사 세라믹 다층기판 및 그 제조방법
DE10325550B4 (de) * 2003-06-05 2007-02-01 Novar Gmbh Elektrisches Kontaktierungsverfahren
CN1324932C (zh) * 2003-10-16 2007-07-04 光宝科技股份有限公司 具有防止切割毛边的印刷电路板
JP4850596B2 (ja) * 2006-06-19 2012-01-11 株式会社 日立ディスプレイズ 液晶表示装置
JP6755096B2 (ja) * 2016-01-22 2020-09-16 日立オートモティブシステムズ株式会社 車載用電子モジュール、カードエッジコネクタ、およびコネクタ
EP3512313A1 (de) * 2018-01-16 2019-07-17 ZKW Group GmbH Leiterplattenanordnung
KR20220052011A (ko) 2020-10-20 2022-04-27 삼성전자주식회사 모듈 기판 및 이를 포함하는 반도체 모듈

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Publication number Priority date Publication date Assignee Title
EP0475567A2 (en) * 1990-09-12 1992-03-18 Macdermid Incorporated Method for fabricating printed circuits

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DE19808932C2 (de) 2001-02-22
GB9802869D0 (en) 1998-04-08
JPH10247766A (ja) 1998-09-14
FR2760313B1 (fr) 2000-09-22
CN1195960A (zh) 1998-10-14
KR19980079794A (ko) 1998-11-25
GB2322974A (en) 1998-09-09
DE19808932A1 (de) 1998-09-10
FR2760313A1 (fr) 1998-09-04

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