GB2147148A - Electronic circuit assembly - Google Patents
Electronic circuit assembly Download PDFInfo
- Publication number
- GB2147148A GB2147148A GB08325803A GB8325803A GB2147148A GB 2147148 A GB2147148 A GB 2147148A GB 08325803 A GB08325803 A GB 08325803A GB 8325803 A GB8325803 A GB 8325803A GB 2147148 A GB2147148 A GB 2147148A
- Authority
- GB
- United Kingdom
- Prior art keywords
- adhesive
- carrier
- components
- electronic components
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08325803A GB2147148A (en) | 1983-09-27 | 1983-09-27 | Electronic circuit assembly |
JP59503532A JPS61500047A (ja) | 1983-09-27 | 1984-09-27 | 電子回路組立方法 |
PCT/GB1984/000330 WO1985001634A1 (en) | 1983-09-27 | 1984-09-27 | Electronic circuit assembly |
EP84903558A EP0159331A1 (en) | 1983-09-27 | 1984-09-27 | Electronic circuit assembly |
KR1019850700044A KR850700100A (ko) | 1983-09-27 | 1985-05-17 | 전자 회로 조립체 |
DK229285A DK229285A (da) | 1983-09-27 | 1985-05-23 | Fremgangsmaade til montering af elektronisk kredsloeb |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08325803A GB2147148A (en) | 1983-09-27 | 1983-09-27 | Electronic circuit assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8325803D0 GB8325803D0 (en) | 1983-10-26 |
GB2147148A true GB2147148A (en) | 1985-05-01 |
Family
ID=10549343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08325803A Withdrawn GB2147148A (en) | 1983-09-27 | 1983-09-27 | Electronic circuit assembly |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0159331A1 (ja) |
JP (1) | JPS61500047A (ja) |
KR (1) | KR850700100A (ja) |
DK (1) | DK229285A (ja) |
GB (1) | GB2147148A (ja) |
WO (1) | WO1985001634A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2200801A (en) * | 1986-12-25 | 1988-08-10 | Tdk Corp | Attaching electronic circuit element to printed circuit board |
GB2221098A (en) * | 1988-04-06 | 1990-01-24 | Sagem | Electrical component equipped with double pairs of contacts for enabling two different possible mountings on a printed circuit board |
US4927697A (en) * | 1987-11-28 | 1990-05-22 | British Aerospace Public Limited Company | Surface mounting leadless components on conductor pattern supporting substrates |
GB2237691A (en) * | 1989-10-30 | 1991-05-08 | Mitsubishi Electric Corp | Semiconductor device and wiring board module |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3675734D1 (de) * | 1985-09-30 | 1991-01-03 | Siemens Ag | Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage. |
DE3806738C1 (ja) * | 1988-03-02 | 1989-09-07 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | |
DE69015375T2 (de) * | 1989-01-13 | 1995-05-04 | Matsushita Electric Ind Co Ltd | Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers. |
DE58909875D1 (de) * | 1989-05-31 | 2000-08-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
JPH0828565B2 (ja) * | 1990-09-06 | 1996-03-21 | ティーディーケイ株式会社 | 電子部品のプリント基板への搭載方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1221914A (en) * | 1969-06-13 | 1971-02-10 | Standard Telephones Cables Ltd | Manufacture of integrated circuits |
GB1467245A (en) * | 1973-07-10 | 1977-03-16 | Lucas Industries Ltd | Method of securing component to a substrate |
GB2032190A (en) * | 1978-09-21 | 1980-04-30 | Sony Corp | Printed circuit boards |
GB2037489A (en) * | 1978-12-18 | 1980-07-09 | Sony Corp | Circuit Components Interconnected by Solder Layers |
GB2047973A (en) * | 1979-04-26 | 1980-12-03 | Sony Corp | Electronic circuit arrangements and method of securing leadless circuit parts on printed circuit boards |
GB2125220A (en) * | 1982-07-14 | 1984-02-29 | Diehl Gmbh & Co | An arrangement for connecting an electrical component to a support |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53130831A (en) * | 1977-04-20 | 1978-11-15 | Schreiber Klaeranlagen | Apparatus for cleaning dust receiving grate arranged in water way |
JPS54155810A (en) * | 1978-05-29 | 1979-12-08 | Tdk Corp | Bonding method of electronic parts |
JPS5541793A (en) * | 1978-09-20 | 1980-03-24 | Matsushita Electric Ind Co Ltd | Method of mounting microminiature part |
JPS55144828A (en) * | 1979-04-24 | 1980-11-12 | Onishi Hitoshi | Malt producing method and movable malt chamber |
JPS5750497A (en) * | 1980-09-11 | 1982-03-24 | Mitsubishi Electric Corp | Method of mounting electric part on printed board |
DE3042043A1 (de) * | 1980-11-07 | 1982-05-27 | Nagel, Hans-Joachim, Dr., 2800 Bremen | Einrichtung fuer die haltung von mastgefluegel |
JPS5880894A (ja) * | 1981-11-10 | 1983-05-16 | パイオニア株式会社 | プリント基板の製造方法 |
JPS5885592A (ja) * | 1981-11-18 | 1983-05-21 | パイオニア株式会社 | プリント基板の製造方法 |
-
1983
- 1983-09-27 GB GB08325803A patent/GB2147148A/en not_active Withdrawn
-
1984
- 1984-09-27 JP JP59503532A patent/JPS61500047A/ja active Pending
- 1984-09-27 EP EP84903558A patent/EP0159331A1/en not_active Withdrawn
- 1984-09-27 WO PCT/GB1984/000330 patent/WO1985001634A1/en not_active Application Discontinuation
-
1985
- 1985-05-17 KR KR1019850700044A patent/KR850700100A/ko not_active Application Discontinuation
- 1985-05-23 DK DK229285A patent/DK229285A/da not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1221914A (en) * | 1969-06-13 | 1971-02-10 | Standard Telephones Cables Ltd | Manufacture of integrated circuits |
GB1467245A (en) * | 1973-07-10 | 1977-03-16 | Lucas Industries Ltd | Method of securing component to a substrate |
GB2032190A (en) * | 1978-09-21 | 1980-04-30 | Sony Corp | Printed circuit boards |
GB2037489A (en) * | 1978-12-18 | 1980-07-09 | Sony Corp | Circuit Components Interconnected by Solder Layers |
GB2047973A (en) * | 1979-04-26 | 1980-12-03 | Sony Corp | Electronic circuit arrangements and method of securing leadless circuit parts on printed circuit boards |
GB2125220A (en) * | 1982-07-14 | 1984-02-29 | Diehl Gmbh & Co | An arrangement for connecting an electrical component to a support |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2200801A (en) * | 1986-12-25 | 1988-08-10 | Tdk Corp | Attaching electronic circuit element to printed circuit board |
GB2200801B (en) * | 1986-12-25 | 1991-01-09 | Tdk Corp | Electronic circuit element |
US4927697A (en) * | 1987-11-28 | 1990-05-22 | British Aerospace Public Limited Company | Surface mounting leadless components on conductor pattern supporting substrates |
GB2221098A (en) * | 1988-04-06 | 1990-01-24 | Sagem | Electrical component equipped with double pairs of contacts for enabling two different possible mountings on a printed circuit board |
GB2221098B (en) * | 1988-04-06 | 1991-09-25 | Sagem | Electrical component,particularly for an electric motor,equipped with double pairs of contacts,especially for enabling two different possible mountings on a |
GB2237691A (en) * | 1989-10-30 | 1991-05-08 | Mitsubishi Electric Corp | Semiconductor device and wiring board module |
GB2237691B (en) * | 1989-10-30 | 1993-08-25 | Mitsubishi Electric Corp | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
DK229285D0 (da) | 1985-05-23 |
EP0159331A1 (en) | 1985-10-30 |
GB8325803D0 (en) | 1983-10-26 |
KR850700100A (ko) | 1985-10-21 |
DK229285A (da) | 1985-05-23 |
WO1985001634A1 (en) | 1985-04-11 |
JPS61500047A (ja) | 1986-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |