GB2237691B - Electronic device - Google Patents

Electronic device

Info

Publication number
GB2237691B
GB2237691B GB9023214A GB9023214A GB2237691B GB 2237691 B GB2237691 B GB 2237691B GB 9023214 A GB9023214 A GB 9023214A GB 9023214 A GB9023214 A GB 9023214A GB 2237691 B GB2237691 B GB 2237691B
Authority
GB
United Kingdom
Prior art keywords
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9023214A
Other versions
GB2237691A (en
GB9023214D0 (en
Inventor
Tetsuroo Tsuzi
Hitoshi Toda
Tsugio Tabaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9023214D0 publication Critical patent/GB9023214D0/en
Publication of GB2237691A publication Critical patent/GB2237691A/en
Application granted granted Critical
Publication of GB2237691B publication Critical patent/GB2237691B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
GB9023214A 1989-10-30 1990-10-25 Electronic device Expired - Lifetime GB2237691B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1283351A JPH03145186A (en) 1989-10-30 1989-10-30 Semiconductor module

Publications (3)

Publication Number Publication Date
GB9023214D0 GB9023214D0 (en) 1990-12-05
GB2237691A GB2237691A (en) 1991-05-08
GB2237691B true GB2237691B (en) 1993-08-25

Family

ID=17664359

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9023214A Expired - Lifetime GB2237691B (en) 1989-10-30 1990-10-25 Electronic device

Country Status (2)

Country Link
JP (1) JPH03145186A (en)
GB (1) GB2237691B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7870322B2 (en) 1997-09-26 2011-01-11 Rambus Inc. Memory module having signal lines configured for sequential arrival of signals at synchronous memory devices

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255675B (en) * 1991-05-10 1995-09-27 Technophone Ltd Circuit assembly
EP0518701A3 (en) * 1991-06-14 1993-04-21 Aptix Corporation Field programmable circuit module
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
TW276356B (en) * 1994-06-24 1996-05-21 Ibm
ES2111470B1 (en) * 1995-08-07 1998-11-01 Mecanismos Aux Ind ELECTRONIC INTEGRATION IN BOXES OF SERVICES.
US5759049A (en) * 1996-05-15 1998-06-02 Dallas Semiconductor Corp. Electrical contact clip
US6222739B1 (en) 1998-01-20 2001-04-24 Viking Components High-density computer module with stacked parallel-plane packaging
WO1999036959A1 (en) * 1998-01-20 1999-07-22 Viking Components, Inc. High-density computer modules with stacked parallel-plane packaging
JP2002151648A (en) 2000-11-07 2002-05-24 Mitsubishi Electric Corp Semiconductor module
EP1333443A1 (en) * 2002-01-31 2003-08-06 Infineon Technologies AG Memory system
CN102625624A (en) * 2011-01-27 2012-08-01 英业达股份有限公司 Electronic device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1137907A (en) * 1964-12-09 1968-12-27 Signetics Corp Improvements in or relating to multiple-chip integrated circuit assembly with interconnection structure
GB1259602A (en) * 1968-01-26 1972-01-05
GB1384220A (en) * 1972-11-30 1975-02-19 Ibm Circuit assemblies
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2130025A (en) * 1982-11-08 1984-05-23 Control Data Corp Memory board stacking module
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
GB2169751A (en) * 1985-01-11 1986-07-16 Fuji Electrochemical Co Ltd An electronic circuit module
EP0339154A2 (en) * 1988-04-26 1989-11-02 Citizen Watch Co. Ltd. Memory card

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1137907A (en) * 1964-12-09 1968-12-27 Signetics Corp Improvements in or relating to multiple-chip integrated circuit assembly with interconnection structure
GB1259602A (en) * 1968-01-26 1972-01-05
GB1384220A (en) * 1972-11-30 1975-02-19 Ibm Circuit assemblies
EP0065425A2 (en) * 1981-05-18 1982-11-24 Matsushita Electric Industrial Co., Ltd. Hybrid integrated circuit component and printed circuit board mounting said component
GB2130025A (en) * 1982-11-08 1984-05-23 Control Data Corp Memory board stacking module
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
GB2169751A (en) * 1985-01-11 1986-07-16 Fuji Electrochemical Co Ltd An electronic circuit module
EP0339154A2 (en) * 1988-04-26 1989-11-02 Citizen Watch Co. Ltd. Memory card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7870322B2 (en) 1997-09-26 2011-01-11 Rambus Inc. Memory module having signal lines configured for sequential arrival of signals at synchronous memory devices
US8214575B2 (en) 1997-09-26 2012-07-03 Rambus Inc. Memory module having signal lines configured for sequential arrival of signals at synchronous memory devices
US8364878B2 (en) 1997-09-26 2013-01-29 Rambus Inc. Memory module having signal lines configured for sequential arrival of signals at a plurality of memory devices

Also Published As

Publication number Publication date
GB2237691A (en) 1991-05-08
GB9023214D0 (en) 1990-12-05
JPH03145186A (en) 1991-06-20

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19960611