GB1491746A - Making patterns by sputter etching - Google Patents

Making patterns by sputter etching

Info

Publication number
GB1491746A
GB1491746A GB5303/75A GB530375A GB1491746A GB 1491746 A GB1491746 A GB 1491746A GB 5303/75 A GB5303/75 A GB 5303/75A GB 530375 A GB530375 A GB 530375A GB 1491746 A GB1491746 A GB 1491746A
Authority
GB
United Kingdom
Prior art keywords
layer
etching
aluminium
molybdenum
sputter etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5303/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1491746A publication Critical patent/GB1491746A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/262—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by physical means only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB5303/75A 1974-02-12 1975-02-07 Making patterns by sputter etching Expired GB1491746A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7401859A NL7401859A (nl) 1974-02-12 1974-02-12 Werkwijze voor het vervaardigen van een patroon en of meer lagen op een ondergrond door selijk verwijderen van deze laag of lagen sputteretsen en voorwerpen, in het bijzon- alfgeleiderinrichtingen, vervaardigd met ssing van deze werkwijze.

Publications (1)

Publication Number Publication Date
GB1491746A true GB1491746A (en) 1977-11-16

Family

ID=19820730

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5303/75A Expired GB1491746A (en) 1974-02-12 1975-02-07 Making patterns by sputter etching

Country Status (6)

Country Link
US (1) US3984300A (enExample)
JP (1) JPS5530289B2 (enExample)
DE (1) DE2504500A1 (enExample)
FR (1) FR2260451B1 (enExample)
GB (1) GB1491746A (enExample)
NL (1) NL7401859A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340276A (en) 1978-11-01 1982-07-20 Minnesota Mining And Manufacturing Company Method of producing a microstructured surface and the article produced thereby
GB2148769A (en) * 1983-10-22 1985-06-05 Standard Telephones Cables Ltd Topographic feature formation by ion beam milling of a substrate

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057831A (en) * 1972-09-05 1977-11-08 U.S. Philips Corporation Video record disc manufactured by a process involving chemical or sputter etching
DE2536718C3 (de) * 1975-08-18 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung geätzter Strukturen in Festkörperoberflächen durch Ionenätzung und Bestrahlungsmaske zur Verwendung in diesem Verfahren
US4057460A (en) * 1976-11-22 1977-11-08 Data General Corporation Plasma etching process
DE2754526C2 (de) * 1977-12-07 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung des Kathodensystems eines Röntgen- oder Gammastrahlenkonverters
JPS5496775A (en) * 1978-01-17 1979-07-31 Hitachi Ltd Method of forming circuit
JPS57157523A (en) * 1981-03-25 1982-09-29 Hitachi Ltd Forming method for pattern
US4375390A (en) * 1982-03-15 1983-03-01 Anderson Nathaniel C Thin film techniques for fabricating narrow track ferrite heads
DE3534418A1 (de) * 1985-09-27 1987-04-02 Telefunken Electronic Gmbh Verfahren zum herstellen von vertiefungen in einem halbleiterbauelemente enthaltenden halbleiterkoerper
US4767418A (en) * 1986-02-13 1988-08-30 California Institute Of Technology Luminal surface fabrication for cardiovascular prostheses
US5139974A (en) * 1991-01-25 1992-08-18 Micron Technology, Inc. Semiconductor manufacturing process for decreasing the optical refelctivity of a metal layer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400066A (en) * 1965-11-15 1968-09-03 Ibm Sputtering processes for depositing thin films of controlled thickness
US3436327A (en) * 1966-07-18 1969-04-01 Collins Radio Co Selective sputtering rate circuit forming process
US3649503A (en) * 1969-12-03 1972-03-14 Motorola Inc Sputter etch mask
US3676317A (en) * 1970-10-23 1972-07-11 Stromberg Datagraphix Inc Sputter etching process
US3791952A (en) * 1972-07-24 1974-02-12 Bell Telephone Labor Inc Method for neutralizing charge in semiconductor bodies and dielectric coatings induced by cathodic etching

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340276A (en) 1978-11-01 1982-07-20 Minnesota Mining And Manufacturing Company Method of producing a microstructured surface and the article produced thereby
GB2148769A (en) * 1983-10-22 1985-06-05 Standard Telephones Cables Ltd Topographic feature formation by ion beam milling of a substrate

Also Published As

Publication number Publication date
DE2504500A1 (de) 1975-08-14
JPS5530289B2 (enExample) 1980-08-09
FR2260451B1 (enExample) 1980-03-21
FR2260451A1 (enExample) 1975-09-05
JPS50110073A (enExample) 1975-08-29
US3984300A (en) 1976-10-05
NL7401859A (nl) 1975-08-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee