GB1211499A - A method of manufacturing semiconductor devices - Google Patents

A method of manufacturing semiconductor devices

Info

Publication number
GB1211499A
GB1211499A GB02226/69A GB1222669A GB1211499A GB 1211499 A GB1211499 A GB 1211499A GB 02226/69 A GB02226/69 A GB 02226/69A GB 1222669 A GB1222669 A GB 1222669A GB 1211499 A GB1211499 A GB 1211499A
Authority
GB
United Kingdom
Prior art keywords
diamine
semiconductor devices
manufacturing semiconductor
junction
etchant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB02226/69A
Other languages
English (en)
Inventor
John Christopher Greenwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB02226/69A priority Critical patent/GB1211499A/en
Priority to DE19702010448 priority patent/DE2010448A1/de
Priority to FR7008093A priority patent/FR2034731B1/fr
Priority to JP45019246A priority patent/JPS4834454B1/ja
Publication of GB1211499A publication Critical patent/GB1211499A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/644—Anisotropic liquid etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/052—Strain gauge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Pressure Sensors (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
GB02226/69A 1969-03-07 1969-03-07 A method of manufacturing semiconductor devices Expired GB1211499A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB02226/69A GB1211499A (en) 1969-03-07 1969-03-07 A method of manufacturing semiconductor devices
DE19702010448 DE2010448A1 (https=) 1969-03-07 1970-03-05
FR7008093A FR2034731B1 (https=) 1969-03-07 1970-03-06
JP45019246A JPS4834454B1 (https=) 1969-03-07 1970-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB02226/69A GB1211499A (en) 1969-03-07 1969-03-07 A method of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
GB1211499A true GB1211499A (en) 1970-11-04

Family

ID=10000667

Family Applications (1)

Application Number Title Priority Date Filing Date
GB02226/69A Expired GB1211499A (en) 1969-03-07 1969-03-07 A method of manufacturing semiconductor devices

Country Status (4)

Country Link
JP (1) JPS4834454B1 (https=)
DE (1) DE2010448A1 (https=)
FR (1) FR2034731B1 (https=)
GB (1) GB1211499A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203128A (en) 1976-11-08 1980-05-13 Wisconsin Alumni Research Foundation Electrostatically deformable thin silicon membranes
FR2449971A1 (fr) * 1979-02-22 1980-09-19 Rca Corp Procede d'attaque en une fois pour former une structure mesa ayant une paroi a plusieurs etages
US4234361A (en) 1979-07-05 1980-11-18 Wisconsin Alumni Research Foundation Process for producing an electrostatically deformable thin silicon membranes utilizing a two-stage diffusion step to form an etchant resistant layer
GB2128404A (en) * 1982-10-04 1984-04-26 Becton Dickinson Co Piezoresistive transducer
GB2136204A (en) * 1983-01-26 1984-09-12 Hitachi Ltd A method of fabricating especially etching a diaphragm in a semiconductor device
GB2146697A (en) * 1983-09-17 1985-04-24 Stc Plc Flexible hinge device
GB2152690A (en) * 1983-08-12 1985-08-07 Standard Telephones Cables Ltd Improvements in infra-red sensor arrays
US4605919A (en) * 1982-10-04 1986-08-12 Becton, Dickinson And Company Piezoresistive transducer
GB2209245A (en) * 1987-08-28 1989-05-04 Gen Electric Co Plc Method of producing a three-dimensional structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4238275A (en) * 1978-12-29 1980-12-09 International Business Machines Corporation Pyrocatechol-amine-water solution for the determination of defects
JPH04342129A (ja) * 1991-05-17 1992-11-27 Sony Corp 層間絶縁膜の平坦化方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099591A (en) * 1958-12-15 1963-07-30 Shockley William Semiconductive device
NL256986A (https=) * 1960-01-04
FR1472688A (fr) * 1965-03-31 1967-03-10 Westinghouse Electric Corp Circuits intégrés à semi-conducteurs et procédé de fabrication correspondant
FR1483890A (fr) * 1965-04-26 1967-06-09 Siemens Ag Procédé de fabrication de circuits à semi-conducteurs

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203128A (en) 1976-11-08 1980-05-13 Wisconsin Alumni Research Foundation Electrostatically deformable thin silicon membranes
FR2449971A1 (fr) * 1979-02-22 1980-09-19 Rca Corp Procede d'attaque en une fois pour former une structure mesa ayant une paroi a plusieurs etages
US4234361A (en) 1979-07-05 1980-11-18 Wisconsin Alumni Research Foundation Process for producing an electrostatically deformable thin silicon membranes utilizing a two-stage diffusion step to form an etchant resistant layer
GB2128404A (en) * 1982-10-04 1984-04-26 Becton Dickinson Co Piezoresistive transducer
US4605919A (en) * 1982-10-04 1986-08-12 Becton, Dickinson And Company Piezoresistive transducer
GB2136204A (en) * 1983-01-26 1984-09-12 Hitachi Ltd A method of fabricating especially etching a diaphragm in a semiconductor device
US4588472A (en) * 1983-01-26 1986-05-13 Hitachi, Ltd. Method of fabricating a semiconductor device
GB2152690A (en) * 1983-08-12 1985-08-07 Standard Telephones Cables Ltd Improvements in infra-red sensor arrays
GB2146697A (en) * 1983-09-17 1985-04-24 Stc Plc Flexible hinge device
GB2209245A (en) * 1987-08-28 1989-05-04 Gen Electric Co Plc Method of producing a three-dimensional structure

Also Published As

Publication number Publication date
JPS4834454B1 (https=) 1973-10-22
FR2034731A1 (https=) 1970-12-11
DE2010448A1 (https=) 1970-09-24
FR2034731B1 (https=) 1975-09-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PLNP Patent lapsed through nonpayment of renewal fees