GB1134615A - Gold electroplating bath - Google Patents

Gold electroplating bath

Info

Publication number
GB1134615A
GB1134615A GB5358/67A GB535867A GB1134615A GB 1134615 A GB1134615 A GB 1134615A GB 5358/67 A GB5358/67 A GB 5358/67A GB 535867 A GB535867 A GB 535867A GB 1134615 A GB1134615 A GB 1134615A
Authority
GB
United Kingdom
Prior art keywords
metal
gold
added
amount
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5358/67A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technic Inc
Original Assignee
Technic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technic Inc filed Critical Technic Inc
Publication of GB1134615A publication Critical patent/GB1134615A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
GB5358/67A 1966-02-10 1967-02-03 Gold electroplating bath Expired GB1134615A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52638566A 1966-02-10 1966-02-10

Publications (1)

Publication Number Publication Date
GB1134615A true GB1134615A (en) 1968-11-27

Family

ID=24097129

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5358/67A Expired GB1134615A (en) 1966-02-10 1967-02-03 Gold electroplating bath

Country Status (4)

Country Link
US (1) US3475292A (de)
BE (1) BE741892A (de)
DE (1) DE1621180C3 (de)
GB (1) GB1134615A (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060106A1 (en) * 1969-08-19 1971-06-11 Sel Rex Corp Bath for electroplating gold
JPS4972140A (de) * 1972-11-13 1974-07-12
GB2142344A (en) * 1983-06-27 1985-01-16 American Chem & Refining Co Gold plating baths containing tartrate and carbonate salts
WO2009037180A1 (fr) * 2007-09-21 2009-03-26 G. Aliprandini Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques
CN104233384A (zh) * 2014-09-17 2014-12-24 朱忠良 一种无氰电镀金镀液及使用其的电镀工艺
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
CN110699713A (zh) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 一种无氰金合金电铸液及其使用方法
CN111647919A (zh) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 用于制备金和银的层的水性制剂

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3910774A (en) * 1970-08-13 1975-10-07 Gen Dynamics Corp Solid film lubricant and method for lubricating cycling low-high temperature friction surfaces
ZA734253B (en) * 1972-07-10 1975-02-26 Degussa Electrolytic bath
US3981782A (en) * 1972-07-28 1976-09-21 Johnson Matthey & Co., Limited Electroplating of gold and gold compounds therefor
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
CH555894A (fr) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
US3833487A (en) * 1972-12-22 1974-09-03 Bell Telephone Labor Inc Electrolytic soft gold plating
US3990954A (en) * 1973-12-17 1976-11-09 Oxy Metal Industries Corporation Sulfite gold plating bath and process
US4076598A (en) * 1976-11-17 1978-02-28 Amp Incorporated Method, electrolyte and additive for electroplating a cobalt brightened gold alloy
US4199416A (en) * 1977-05-03 1980-04-22 Johnson, Matthey & Co., Limited Composition for the electroplating of gold
US4366035A (en) * 1979-04-24 1982-12-28 Engelhard Corporation Electrodeposition of gold alloys
US4212708A (en) * 1979-06-05 1980-07-15 Belikin Alexandr V Gold-plating electrolyte
DE3013030C2 (de) * 1980-04-03 1984-02-09 Degussa Ag, 6000 Frankfurt Galvanisches Bad und Verfahren zur Abscheidung hochglänzender Weißgoldüberzüge
US4435253A (en) 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
DE3309397A1 (de) * 1983-03-16 1984-09-20 Degussa Ag, 6000 Frankfurt Elektrolytisches bad zum abscheiden von niederkaraetigen, glaenzenden gold-silber-legierungsueberzuegen
DE3341233A1 (de) * 1983-11-15 1985-05-30 Robert Bosch Gmbh, 7000 Stuttgart Saures galvanisches bad zur abscheidung feiner strukturen aus weichgold sowie verfahren zur abscheidung derartiger strukturen
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
EP0525890A1 (de) * 1991-07-31 1993-02-03 Calgon Corporation Verfahren zum Löslichmachen von Tellur unter Verwendung organischer Säuren
US5575900A (en) * 1995-07-03 1996-11-19 Antelman Technologies Ltd. Gold plating solutions
GB2323853B (en) * 1997-03-25 2002-04-24 Enthone Omi Electroplating processes compositions and deposits
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
JP4699105B2 (ja) * 2005-06-24 2011-06-08 アサヒプリテック株式会社 金の回収方法および装置
US8066865B2 (en) * 2008-05-19 2011-11-29 Solopower, Inc. Electroplating methods and chemistries for deposition of group IIIA-group via thin films
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
US8425753B2 (en) * 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
DE102008033174B3 (de) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
ITMI20081610A1 (it) * 2008-09-09 2010-03-10 Giuseppe Antognazzi Bagno per elettrodeposizione di oro.
ITFI20130057A1 (it) * 2013-03-18 2014-09-19 Bluclad S R L Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103755738B (zh) * 2014-01-13 2016-06-01 孙松华 一种络合剂及其制备方法和用途
WO2023041972A1 (en) * 2021-09-16 2023-03-23 Galvasols P & S High-speed pure gold electroforming/electroplating bath
CN114934302A (zh) * 2022-04-27 2022-08-23 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金镀液及其应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US923864A (en) * 1908-02-03 1909-06-08 Alfred Levy Process for the electric dissociation of metals by the wet method.
DE801312C (de) * 1949-05-05 1950-11-23 Pforzheimer Elektrizitäts - Gesellschaft m. b. H., Pforzheim Verfahren zur elektrolvtischen Abscheidung von Gold und Goldlegierungen
NL197948A (de) * 1954-06-26
US3020217A (en) * 1956-10-19 1962-02-06 Sel Rex Precious Metals Inc Mirror bright gold alloy electroplating
BE570261A (de) * 1957-08-13
US3057789A (en) * 1959-02-26 1962-10-09 Paul T Smith Gold plating bath and process
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060106A1 (en) * 1969-08-19 1971-06-11 Sel Rex Corp Bath for electroplating gold
JPS4972140A (de) * 1972-11-13 1974-07-12
JPS5324898B2 (de) * 1972-11-13 1978-07-24
GB2142344A (en) * 1983-06-27 1985-01-16 American Chem & Refining Co Gold plating baths containing tartrate and carbonate salts
US10233555B2 (en) 2007-09-21 2019-03-19 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
CN101815814B (zh) * 2007-09-21 2012-05-16 G·阿利普兰迪尼 不使用有毒金属或类似金属由电铸获得黄色金合金沉积物的方法
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
WO2009037180A1 (fr) * 2007-09-21 2009-03-26 G. Aliprandini Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques
US10619260B2 (en) 2007-09-21 2020-04-14 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
CN104233384A (zh) * 2014-09-17 2014-12-24 朱忠良 一种无氰电镀金镀液及使用其的电镀工艺
CN111647919A (zh) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 用于制备金和银的层的水性制剂
CN110699713A (zh) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 一种无氰金合金电铸液及其使用方法

Also Published As

Publication number Publication date
DE1621180C3 (de) 1978-08-24
US3475292A (en) 1969-10-28
DE1621180A1 (de) 1971-05-19
BE741892A (de) 1970-05-04
DE1621180B2 (de) 1976-09-02

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