FR3048306B1 - Support pour une structure semi-conductrice - Google Patents

Support pour une structure semi-conductrice Download PDF

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Publication number
FR3048306B1
FR3048306B1 FR1651642A FR1651642A FR3048306B1 FR 3048306 B1 FR3048306 B1 FR 3048306B1 FR 1651642 A FR1651642 A FR 1651642A FR 1651642 A FR1651642 A FR 1651642A FR 3048306 B1 FR3048306 B1 FR 3048306B1
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France
Prior art keywords
support
semiconductor structure
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1651642A
Other languages
English (en)
French (fr)
Other versions
FR3048306A1 (fr
Inventor
Christophe Figuet
Oleg Kononchuk
Kassam Alassaad
Gabriel Ferro
Veronique Souliere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Soitec SA
Universite Claude Bernard Lyon 1
Original Assignee
Centre National de la Recherche Scientifique CNRS
Soitec SA
Universite Claude Bernard Lyon 1
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1651642A priority Critical patent/FR3048306B1/fr
Application filed by Centre National de la Recherche Scientifique CNRS, Soitec SA, Universite Claude Bernard Lyon 1 filed Critical Centre National de la Recherche Scientifique CNRS
Priority to SG11201807197PA priority patent/SG11201807197PA/en
Priority to KR1020187025017A priority patent/KR102687932B1/ko
Priority to PCT/FR2017/050400 priority patent/WO2017144821A1/fr
Priority to SG10201913216XA priority patent/SG10201913216XA/en
Priority to EP17710350.4A priority patent/EP3420583B1/fr
Priority to CN201780013336.3A priority patent/CN109155276B/zh
Priority to US16/080,279 priority patent/US11251265B2/en
Priority to JP2018544865A priority patent/JP6981629B2/ja
Priority to TW106106332A priority patent/TWI787172B/zh
Publication of FR3048306A1 publication Critical patent/FR3048306A1/fr
Application granted granted Critical
Publication of FR3048306B1 publication Critical patent/FR3048306B1/fr
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3206—Carbon, e.g. diamond-like carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3208—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3211—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3251—Layer structure consisting of three or more layers
    • H10P14/3252—Alternating layers, e.g. superlattice
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H10P14/3456—Polycrystalline
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
FR1651642A 2016-02-26 2016-02-26 Support pour une structure semi-conductrice Active FR3048306B1 (fr)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FR1651642A FR3048306B1 (fr) 2016-02-26 2016-02-26 Support pour une structure semi-conductrice
JP2018544865A JP6981629B2 (ja) 2016-02-26 2017-02-23 半導体構造用の支持体
PCT/FR2017/050400 WO2017144821A1 (fr) 2016-02-26 2017-02-23 Support pour une structure semi-conductrice
SG10201913216XA SG10201913216XA (en) 2016-02-26 2017-02-23 Support for a semiconductor structure
EP17710350.4A EP3420583B1 (fr) 2016-02-26 2017-02-23 Support pour une structure semi-conductrice
CN201780013336.3A CN109155276B (zh) 2016-02-26 2017-02-23 用于半导体结构的支撑件
SG11201807197PA SG11201807197PA (en) 2016-02-26 2017-02-23 Support for a semiconductor structure
KR1020187025017A KR102687932B1 (ko) 2016-02-26 2017-02-23 반도체 구조를 위한 지지체
US16/080,279 US11251265B2 (en) 2016-02-26 2017-02-23 Carrier for a semiconductor structure
TW106106332A TWI787172B (zh) 2016-02-26 2017-02-24 用於半導體結構的支撐件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1651642 2016-02-26
FR1651642A FR3048306B1 (fr) 2016-02-26 2016-02-26 Support pour une structure semi-conductrice

Publications (2)

Publication Number Publication Date
FR3048306A1 FR3048306A1 (fr) 2017-09-01
FR3048306B1 true FR3048306B1 (fr) 2018-03-16

Family

ID=55650590

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1651642A Active FR3048306B1 (fr) 2016-02-26 2016-02-26 Support pour une structure semi-conductrice

Country Status (9)

Country Link
US (1) US11251265B2 (https=)
EP (1) EP3420583B1 (https=)
JP (1) JP6981629B2 (https=)
KR (1) KR102687932B1 (https=)
CN (1) CN109155276B (https=)
FR (1) FR3048306B1 (https=)
SG (2) SG10201913216XA (https=)
TW (1) TWI787172B (https=)
WO (1) WO2017144821A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6619874B2 (ja) * 2016-04-05 2019-12-11 株式会社サイコックス 多結晶ＳｉＣ基板およびその製造方法
FR3068506B1 (fr) * 2017-06-30 2020-02-21 Soitec Procede pour preparer un support pour une structure semi-conductrice
US20210183691A1 (en) * 2018-07-05 2021-06-17 Soitec Substrate for an integrated radiofrequency device, and process for manufacturing same
FR3091011B1 (fr) * 2018-12-21 2022-08-05 Soitec Silicon On Insulator Substrat de type semi-conducteur sur isolant pour des applications radiofréquences
FR3104318B1 (fr) 2019-12-05 2023-03-03 Soitec Silicon On Insulator Procédé de formation d'un support de manipulation à haute résistivité pour substrat composite
FR3110283B1 (fr) 2020-05-18 2022-04-15 Soitec Silicon On Insulator Procédé de fabrication d’un substrat semi-conducteur sur isolant pour applications radiofréquences
JP2021190660A (ja) * 2020-06-04 2021-12-13 株式会社Sumco 貼り合わせウェーハ用の支持基板
CN111979524B (zh) * 2020-08-19 2021-12-14 福建省晋华集成电路有限公司 一种多晶硅层形成方法、多晶硅层以及半导体结构
FR3116151A1 (fr) 2020-11-10 2022-05-13 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de formation d’une structure de piegeage d’un substrat utile
FR3117668B1 (fr) 2020-12-16 2022-12-23 Commissariat Energie Atomique Structure amelioree de substrat rf et procede de realisation
FR3134239B1 (fr) * 2022-03-30 2025-02-14 Soitec Silicon On Insulator Substrat piézoélectrique sur isolant (POI) et procédé de fabrication d’un substrat piézoélectrique sur isolant (POI)
US20240030222A1 (en) * 2022-07-20 2024-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Trapping layer for a radio frequency die and methods of formation
JP2026511208A (ja) 2022-11-29 2026-04-10 ソイテック 電荷トラップ層を含む支持体、そのような支持体を含む複合基板、および関連する製造方法
WO2024115410A1 (fr) 2022-11-29 2024-06-06 Soitec Support comprenant une couche de piegeage de charges, substrat composite comprenant un tel support et procedes de fabrication associes.
EP4627621A1 (fr) 2022-11-29 2025-10-08 Soitec Support comprenant une couche de piegeage de charges, substrat composite comprenant un tel support et procedes de fabrication associes
FR3146020B1 (fr) 2023-02-20 2025-07-18 Soitec Silicon On Insulator Support comprenant une couche de piégeage de charges, substrat composite comprenant un tel support et procédé de fabrication associés

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JPH0864851A (ja) 1994-06-14 1996-03-08 Sanyo Electric Co Ltd 光起電力素子及びその製造方法
JP2907128B2 (ja) * 1996-07-01 1999-06-21 日本電気株式会社 電界効果型トランジスタ及びその製造方法
US20070032040A1 (en) * 2003-09-26 2007-02-08 Dimitri Lederer Method of manufacturing a multilayer semiconductor structure with reduced ohmic losses
US7202124B2 (en) * 2004-10-01 2007-04-10 Massachusetts Institute Of Technology Strained gettering layers for semiconductor processes
KR101436313B1 (ko) * 2007-07-04 2014-09-01 신에쯔 한도타이 가부시키가이샤 다층 실리콘 웨이퍼의 제작법
FR2953640B1 (fr) * 2009-12-04 2012-02-10 S O I Tec Silicon On Insulator Tech Procede de fabrication d'une structure de type semi-conducteur sur isolant, a pertes electriques diminuees et structure correspondante
US8536021B2 (en) * 2010-12-24 2013-09-17 Io Semiconductor, Inc. Trap rich layer formation techniques for semiconductor devices
FR2973158B1 (fr) 2011-03-22 2014-02-28 Soitec Silicon On Insulator Procédé de fabrication d'un substrat de type semi-conducteur sur isolant pour applications radiofréquences
US8741739B2 (en) * 2012-01-03 2014-06-03 International Business Machines Corporation High resistivity silicon-on-insulator substrate and method of forming
FR2999801B1 (fr) * 2012-12-14 2014-12-26 Soitec Silicon On Insulator Procede de fabrication d'une structure
JP5978986B2 (ja) 2012-12-26 2016-08-24 信越半導体株式会社 高周波半導体装置及び高周波半導体装置の製造方法
US8951896B2 (en) * 2013-06-28 2015-02-10 International Business Machines Corporation High linearity SOI wafer for low-distortion circuit applications
US9768056B2 (en) * 2013-10-31 2017-09-19 Sunedison Semiconductor Limited (Uen201334164H) Method of manufacturing high resistivity SOI wafers with charge trapping layers based on terminated Si deposition
US9853133B2 (en) * 2014-09-04 2017-12-26 Sunedison Semiconductor Limited (Uen201334164H) Method of manufacturing high resistivity silicon-on-insulator substrate
US10622247B2 (en) * 2016-02-19 2020-04-14 Globalwafers Co., Ltd. Semiconductor on insulator structure comprising a buried high resistivity layer
CN108022934A (zh) * 2016-11-01 2018-05-11 沈阳硅基科技有限公司 一种薄膜的制备方法
US10468486B2 (en) * 2017-10-30 2019-11-05 Taiwan Semiconductor Manufacturing Company Ltd. SOI substrate, semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
CN109155276B (zh) 2023-01-17
EP3420583B1 (fr) 2021-08-04
JP2019512870A (ja) 2019-05-16
KR20190013696A (ko) 2019-02-11
JP6981629B2 (ja) 2021-12-15
TW201742108A (zh) 2017-12-01
KR102687932B1 (ko) 2024-07-25
EP3420583A1 (fr) 2019-01-02
TWI787172B (zh) 2022-12-21
WO2017144821A1 (fr) 2017-08-31
SG10201913216XA (en) 2020-02-27
US11251265B2 (en) 2022-02-15
US20190058031A1 (en) 2019-02-21
CN109155276A (zh) 2019-01-04
SG11201807197PA (en) 2018-09-27
FR3048306A1 (fr) 2017-09-01

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