FR2690171B1 - Solution de depot chimique de nickel ou d'un alliage de nickel et son procede d'utilisation. - Google Patents

Solution de depot chimique de nickel ou d'un alliage de nickel et son procede d'utilisation.

Info

Publication number
FR2690171B1
FR2690171B1 FR9304616A FR9304616A FR2690171B1 FR 2690171 B1 FR2690171 B1 FR 2690171B1 FR 9304616 A FR9304616 A FR 9304616A FR 9304616 A FR9304616 A FR 9304616A FR 2690171 B1 FR2690171 B1 FR 2690171B1
Authority
FR
France
Prior art keywords
nickel
solution
same
chemical deposition
nickel alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9304616A
Other languages
English (en)
French (fr)
Other versions
FR2690171A1 (fr
Inventor
Manabu Inoue
Mitsutada Kaneta
Ozawa Junko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Publication of FR2690171A1 publication Critical patent/FR2690171A1/fr
Application granted granted Critical
Publication of FR2690171B1 publication Critical patent/FR2690171B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR9304616A 1992-04-20 1993-04-20 Solution de depot chimique de nickel ou d'un alliage de nickel et son procede d'utilisation. Expired - Fee Related FR2690171B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04099711A JP3115095B2 (ja) 1992-04-20 1992-04-20 無電解メッキ液及びそれを使用するメッキ方法

Publications (2)

Publication Number Publication Date
FR2690171A1 FR2690171A1 (fr) 1993-10-22
FR2690171B1 true FR2690171B1 (fr) 1995-11-24

Family

ID=14254665

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9304616A Expired - Fee Related FR2690171B1 (fr) 1992-04-20 1993-04-20 Solution de depot chimique de nickel ou d'un alliage de nickel et son procede d'utilisation.

Country Status (5)

Country Link
US (1) US5269838A (ja)
JP (1) JP3115095B2 (ja)
DE (1) DE4311764C2 (ja)
FR (1) FR2690171B1 (ja)
GB (1) GB2266318B (ja)

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JP2901523B2 (ja) * 1995-08-09 1999-06-07 日本カニゼン株式会社 無電解黒色めっき浴組成と皮膜の形成方法
US5846598A (en) * 1995-11-30 1998-12-08 International Business Machines Corporation Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating
US6060176A (en) * 1995-11-30 2000-05-09 International Business Machines Corporation Corrosion protection for metallic features
EP0843597A4 (en) * 1996-06-05 1999-02-24 Univ Toledo AUTOCATALYTIC DEPOSITION OF A METAL LAYER ON AN ACTIVE SUBSTRATE
US5897692A (en) * 1996-09-10 1999-04-27 Denso Corporation Electroless plating solution
US5944879A (en) * 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration
US6183546B1 (en) * 1998-11-02 2001-02-06 Mccomas Industries International Coating compositions containing nickel and boron
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US6542720B1 (en) * 1999-03-01 2003-04-01 Micron Technology, Inc. Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
AU2000235165A1 (en) * 2000-03-08 2001-09-17 Mccomas, Edward Coating compositions containing nickel and boron
US7456113B2 (en) * 2000-06-26 2008-11-25 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US6927176B2 (en) 2000-06-26 2005-08-09 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
JP2002226974A (ja) * 2000-11-28 2002-08-14 Ebara Corp 無電解Ｎｉ−Ｂめっき液、電子デバイス装置及びその製造方法
JP2004537647A (ja) * 2000-12-21 2004-12-16 エドワード・マッコマス ニッケル、ホウ素および粒子を含有する塗料
WO2002074027A1 (en) * 2001-03-12 2002-09-19 Agency For Science, Technology And Research Improved laser metallisation circuit formation and circuits formed thereby
AU2002311619A1 (en) * 2001-06-28 2003-03-03 Algat Sherutey Gimur Teufati Method of anodizing of magnesium and magnesium alloys and producing conductive layers on an anodized surface
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
US20040002430A1 (en) * 2002-07-01 2004-01-01 Applied Materials, Inc. Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use
EP1439244A3 (en) * 2003-01-14 2005-02-09 Interuniversitair Microelektronica Centrum Vzw Method for plating and plating solution thereof
US20050048210A1 (en) * 2003-01-14 2005-03-03 Sam Siau Method for plating and plating solution therefor
JP2005126734A (ja) * 2003-10-21 2005-05-19 C Uyemura & Co Ltd 無電解ニッケルめっき浴及びそれを用いためっき方法
JP4352398B2 (ja) * 2004-04-09 2009-10-28 富士電機デバイステクノロジー株式会社 磁気記録媒体用基板およびその製造方法
KR20070040761A (ko) * 2004-05-28 2007-04-17 사카타 인쿠스 가부시키가이샤 니켈 화합물 함유 용액, 그 제조방법 및 그것을 사용한니켈금속 박막 형성법
US6933231B1 (en) * 2004-06-28 2005-08-23 Micron Technology, Inc. Methods of forming conductive interconnects, and methods of depositing nickel
US7704307B2 (en) * 2005-07-20 2010-04-27 Nippon Mining & Metals Co., Ltd. Electroless palladium plating liquid
EP1932943A4 (en) * 2005-10-07 2013-06-26 Nippon Mining Co SOLUTION FOR CHEMICAL NICKNESS
JP4645862B2 (ja) * 2008-08-21 2011-03-09 上村工業株式会社 無電解ニッケルめっき浴及びそれを用いためっき方法
JP5379441B2 (ja) * 2008-10-09 2013-12-25 関東化学株式会社 基板処理用アルカリ性水溶液組成物
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
US20110206532A1 (en) * 2010-02-23 2011-08-25 General Electric Company Electroless metal coatings
US20120061698A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
CA2813818A1 (en) * 2010-10-13 2012-04-19 University Of Windsor Process for electroless deposition of metals using highly alkaline plating bath
JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
EP3255176B1 (en) * 2011-01-11 2019-05-01 MacDermid Enthone America LLC Method of plating particulate matter
EP2610366A3 (en) 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
EP2628824B1 (en) * 2012-02-16 2014-09-17 Atotech Deutschland GmbH Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
US8936672B1 (en) * 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
US9376755B2 (en) * 2013-06-04 2016-06-28 Sanchem, Inc. Method and composition for electroless nickel and cobalt deposition
JP6212323B2 (ja) * 2013-08-02 2017-10-11 日本カニゼン株式会社 無電解ニッケルめっき液及びそれを用いた無電解ニッケルめっき方法
US10246778B2 (en) * 2013-08-07 2019-04-02 Macdermid Acumen, Inc. Electroless nickel plating solution and method

Family Cites Families (15)

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DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
DE1242970B (de) * 1961-05-27 1967-06-22 Bayer Ag Verfahren zum Regenerieren eines erschoepften Bades zur chemischen Abscheidung einesborhaltigen Metallueberzugs
US3178311A (en) * 1961-09-25 1965-04-13 Bunker Ramo Electroless plating process
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3531301A (en) * 1968-08-26 1970-09-29 Stauffer Chemical Co Plating process
DE2028950B2 (de) * 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
US3898138A (en) * 1974-10-16 1975-08-05 Oxy Metal Industries Corp Method and bath for the electrodeposition of nickel
CH644295A5 (en) * 1980-02-06 1984-07-31 Vmei Lenin Nis Process for producing a grinding tool
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor
DE3619386A1 (de) * 1986-06-09 1987-12-10 Elektro Brite Gmbh Sulfathaltiges bad zur galvanischen abscheidung einer zink-nickel-legierung auf eisen
US4997686A (en) * 1987-12-23 1991-03-05 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
JPH01222064A (ja) * 1988-03-02 1989-09-05 Hitachi Ltd 化学ニッケルめっき液およびそれを使用する方法
JPH02197580A (ja) * 1989-01-24 1990-08-06 Okuno Seiyaku Kogyo Kk 無電解ハンダめっき浴
JPH02197579A (ja) * 1989-01-25 1990-08-06 Nippon Senka Kogyo Kk ポリアミド系樹脂用無電解めっき前処理剤

Also Published As

Publication number Publication date
GB2266318B (en) 1995-09-13
DE4311764A1 (de) 1993-10-21
FR2690171A1 (fr) 1993-10-22
DE4311764C2 (de) 2002-04-11
JP3115095B2 (ja) 2000-12-04
US5269838A (en) 1993-12-14
JPH05295556A (ja) 1993-11-09
GB2266318A (en) 1993-10-27
GB9305430D0 (en) 1993-05-05

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Legal Events

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ST Notification of lapse

Effective date: 20111230