FR2686475A1 - Composant electrique forme par laser et procede de fabrication. - Google Patents

Composant electrique forme par laser et procede de fabrication. Download PDF

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Publication number
FR2686475A1
FR2686475A1 FR9300609A FR9300609A FR2686475A1 FR 2686475 A1 FR2686475 A1 FR 2686475A1 FR 9300609 A FR9300609 A FR 9300609A FR 9300609 A FR9300609 A FR 9300609A FR 2686475 A1 FR2686475 A1 FR 2686475A1
Authority
FR
France
Prior art keywords
layer
conductive
coil
electrical component
ferrite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9300609A
Other languages
English (en)
French (fr)
Other versions
FR2686475B1 (enExample
Inventor
Herman R Person
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dale Electronics Inc
Original Assignee
Dale Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dale Electronics Inc filed Critical Dale Electronics Inc
Publication of FR2686475A1 publication Critical patent/FR2686475A1/fr
Application granted granted Critical
Publication of FR2686475B1 publication Critical patent/FR2686475B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR9300609A 1992-01-21 1993-01-21 Composant electrique forme par laser et procede de fabrication. Granted FR2686475A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82312692A 1992-01-21 1992-01-21

Publications (2)

Publication Number Publication Date
FR2686475A1 true FR2686475A1 (fr) 1993-07-23
FR2686475B1 FR2686475B1 (enExample) 1995-01-20

Family

ID=25237866

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9300609A Granted FR2686475A1 (fr) 1992-01-21 1993-01-21 Composant electrique forme par laser et procede de fabrication.

Country Status (5)

Country Link
JP (1) JPH07118419B2 (enExample)
CA (1) CA2086138C (enExample)
DE (1) DE4301570B4 (enExample)
FR (1) FR2686475A1 (enExample)
GB (1) GB2263582B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302932A (en) * 1992-05-12 1994-04-12 Dale Electronics, Inc. Monolythic multilayer chip inductor and method for making same
DE4401612A1 (de) * 1994-01-20 1995-07-27 Resma Gmbh Verfahren und Vorrichtung zur Erzeugung elektrisch leitender Bereiche auf Metallverbindungen enthaltenden isolierenden Keramikwerkstücken
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
DE19603971A1 (de) * 1996-01-26 1997-07-31 Emi Tec Elektronische Material Verfahren zur Herstellung einer Dateneingabevorrichtung
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils
US5922514A (en) 1997-09-17 1999-07-13 Dale Electronics, Inc. Thick film low value high frequency inductor, and method of making the same
DE19817852B4 (de) * 1998-04-22 2009-04-16 Theodor Dr. Doll Nutzenfertigung von Induktivitäten mit Mikrotechniken
GB2348321A (en) * 1999-03-23 2000-09-27 Mitel Semiconductor Ltd A laminated transformer and a method of its manufacture
JP2003534657A (ja) 2000-05-19 2003-11-18 フィリップ エイ． ハーディング スロット付きコア変圧器およびインダクタ
CN1261753C (zh) * 2000-09-22 2006-06-28 M-福来克斯多精线电子学公司 电子变压器/电感器器件及其制造方法
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
RU2007120247A (ru) 2004-12-07 2009-01-20 Малти-Файнлайн Электроникс, Инк. (Us) Миниатюрные схемы, индуктивные элементы и способы их производства
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
DE102010052401A1 (de) 2010-11-24 2012-05-24 Giesecke & Devrient Gmbh Leiterbahnanordnung für tragbare Datenträger

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588439A (en) * 1967-05-12 1971-06-28 Rca Corp High resolution laser engraving apparatus
DE2518279A1 (de) * 1975-04-24 1976-11-04 Siemens Ag Verfahren zur herstellung eines induktiven bauelements
DE3245272A1 (de) * 1982-12-07 1984-06-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen
DE3843230C1 (en) * 1988-12-22 1989-09-21 W.C. Heraeus Gmbh, 6450 Hanau, De Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB993265A (en) * 1962-04-10 1965-05-26 Tokyo Denshi Seiki Kabushiki K Electrical coils
GB1239777A (en) * 1968-10-03 1971-07-21 Nat Res Dev Improvements in shaping workpieces
US3848210A (en) * 1972-12-11 1974-11-12 Vanguard Electronics Miniature inductor
JPS5853805A (ja) * 1981-09-25 1983-03-30 Matsushita Electric Ind Co Ltd インダクタンス調整方法およびインダクタ
JPS6373606A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 厚膜インダクタの製造方法
US4909895A (en) * 1989-04-11 1990-03-20 Pacific Bell System and method for providing a conductive circuit pattern utilizing thermal oxidation
US5018164A (en) * 1989-09-12 1991-05-21 Hughes Aircraft Company Excimer laser ablation method and apparatus for microcircuit fabrication
JPH03142091A (ja) * 1989-10-26 1991-06-17 Mitsubishi Electric Corp 銅張りポリイミドフイルムなどのレーザ加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588439A (en) * 1967-05-12 1971-06-28 Rca Corp High resolution laser engraving apparatus
DE2518279A1 (de) * 1975-04-24 1976-11-04 Siemens Ag Verfahren zur herstellung eines induktiven bauelements
DE3245272A1 (de) * 1982-12-07 1984-06-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen
DE3843230C1 (en) * 1988-12-22 1989-09-21 W.C. Heraeus Gmbh, 6450 Hanau, De Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
""Fantastic" yield from laser circuit etch", EDN ELECTRICAL DESIGN NEWS, vol. 14, no. 15, 1 August 1969 (1969-08-01), NEWTON, MASSACHUSETTS US, pages 18 *
ZNOTINS ET AL.: "Excimer lasers: an emerging technology in materials processing", LASER FOCUS. INCL. V NO. 2450 ELECTRO-OPTICS, SINCE 1983, vol. 23, no. 5, May 1987 (1987-05-01), TULSA US, pages 54 - 70 *

Also Published As

Publication number Publication date
GB2263582B (en) 1995-11-01
JPH0620842A (ja) 1994-01-28
FR2686475B1 (enExample) 1995-01-20
DE4301570B4 (de) 2004-03-25
GB2263582A (en) 1993-07-28
DE4301570A1 (enExample) 1993-07-22
GB9226085D0 (en) 1993-02-10
CA2086138C (en) 1999-09-14
CA2086138A1 (en) 1993-07-22
JPH07118419B2 (ja) 1995-12-18

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Effective date: 20091030