FR2665280B1 - Procede de production d'une carte a circuit integre et carte obtenue. - Google Patents
Procede de production d'une carte a circuit integre et carte obtenue.Info
- Publication number
- FR2665280B1 FR2665280B1 FR9109363A FR9109363A FR2665280B1 FR 2665280 B1 FR2665280 B1 FR 2665280B1 FR 9109363 A FR9109363 A FR 9109363A FR 9109363 A FR9109363 A FR 9109363A FR 2665280 B1 FR2665280 B1 FR 2665280B1
- Authority
- FR
- France
- Prior art keywords
- card
- producing
- integrated circuit
- circuit card
- obtained card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2200706A JP2560895B2 (ja) | 1990-07-25 | 1990-07-25 | Icカードの製造方法およびicカード |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2665280A1 FR2665280A1 (fr) | 1992-01-31 |
FR2665280B1 true FR2665280B1 (fr) | 1996-08-09 |
Family
ID=16428876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9109363A Expired - Fee Related FR2665280B1 (fr) | 1990-07-25 | 1991-07-24 | Procede de production d'une carte a circuit integre et carte obtenue. |
Country Status (3)
Country | Link |
---|---|
US (2) | US5272374A (fr) |
JP (1) | JP2560895B2 (fr) |
FR (1) | FR2665280B1 (fr) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2684235B1 (fr) * | 1991-11-25 | 1999-12-10 | Gemplus Card Int | Carte a circuit integre comprenant des moyens de protection du circuit integre. |
JP2774906B2 (ja) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | 薄形半導体装置及びその製造方法 |
JPH06312593A (ja) | 1993-04-28 | 1994-11-08 | Toshiba Corp | 外部記憶装置、外部記憶装置ユニットおよび外部記憶装置の製造方法 |
KR950704758A (ko) * | 1993-10-18 | 1995-11-20 | 가나미야지 준 | IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier) |
FR2716555B1 (fr) * | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5508231A (en) * | 1994-03-07 | 1996-04-16 | National Semiconductor Corporation | Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits |
JP3383398B2 (ja) * | 1994-03-22 | 2003-03-04 | 株式会社東芝 | 半導体パッケージ |
JP2829494B2 (ja) * | 1994-07-15 | 1998-11-25 | 新光ネームプレート株式会社 | メモリカード及びその製造方法 |
DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
JP3388921B2 (ja) * | 1994-11-29 | 2003-03-24 | 株式会社東芝 | 集積回路カードの製造方法 |
US6471130B2 (en) * | 1995-02-03 | 2002-10-29 | Kabushiki Kaisha Toshiba | Information storage apparatus and information processing apparatus using the same |
JP3660382B2 (ja) * | 1995-02-03 | 2005-06-15 | 株式会社東芝 | 情報記憶装置およびそれに用いるコネクタ部 |
USRE38997E1 (en) * | 1995-02-03 | 2006-02-28 | Kabushiki Kaisha Toshiba | Information storage and information processing system utilizing state-designating member provided on supporting card surface which produces write-permitting or write-inhibiting signal |
WO1996034362A1 (fr) * | 1995-04-24 | 1996-10-31 | Elco Corporation | Carte a circuits integres |
TW381236B (en) * | 1995-07-07 | 2000-02-01 | Docusystem Inc | Integrated circuit chip card and the method and system for the manufacture same |
JPH0964240A (ja) | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
US5892213A (en) * | 1995-09-21 | 1999-04-06 | Yamaichi Electronics Co., Ltd. | Memory card |
JP2799310B2 (ja) * | 1996-04-02 | 1998-09-17 | 山一電機株式会社 | メモリーカード稼動電子機器におけるic保護装置 |
KR100209259B1 (ko) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic 카드 및 그 제조방법 |
US5956601A (en) * | 1996-04-25 | 1999-09-21 | Kabushiki Kaisha Toshiba | Method of mounting a plurality of semiconductor devices in corresponding supporters |
US6022763A (en) * | 1996-05-10 | 2000-02-08 | Kabushiki Kaisha Toshiba | Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof |
TW332334B (en) * | 1996-05-31 | 1998-05-21 | Toshiba Co Ltd | The semiconductor substrate and its producing method and semiconductor apparatus |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
US6001672A (en) * | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
JPH10302030A (ja) * | 1997-02-28 | 1998-11-13 | Toshiba Corp | 接続装置、および情報処理装置 |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
US5961909A (en) * | 1997-09-03 | 1999-10-05 | Pmt Corporation | Method of manufacture of tissue-conformable electrodes |
US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
US6091993A (en) * | 1998-02-19 | 2000-07-18 | American Medical Systems, Inc. | Methods and apparatus for an electrode balloon |
EP0942392A3 (fr) * | 1998-03-13 | 2000-10-18 | Kabushiki Kaisha Toshiba | Carte à puce |
US6256873B1 (en) | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
US6241153B1 (en) | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
FR2778817B1 (fr) * | 1998-05-18 | 2000-06-30 | Remy Kirchdoerffer | Procede de fabrication d'un appareil ou d'un instrument par surmoulage et appareil ou instrument ainsi obtenu |
US6040622A (en) * | 1998-06-11 | 2000-03-21 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
JP4470242B2 (ja) * | 1999-04-23 | 2010-06-02 | ソニー株式会社 | 半導体メモリカード |
FR2794059B1 (fr) * | 1999-05-31 | 2001-08-10 | Gemplus Card Int | Dispositif portable a circuit integre et procede de fabrication |
US6634561B1 (en) * | 1999-06-24 | 2003-10-21 | Sandisk Corporation | Memory card electrical contact structure |
FR2805639B1 (fr) * | 2000-02-29 | 2002-05-24 | Schlumberger Systems & Service | Procede de fixation d'un module a un corps de carte |
TWI244708B (en) * | 2000-03-30 | 2005-12-01 | Matsushita Electric Ind Co Ltd | Printed wiring board, IC card module using the same, and method for producing IC card module |
CN1866277A (zh) * | 2001-04-02 | 2006-11-22 | 株式会社日立制作所 | 存储卡 |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
KR20050044323A (ko) * | 2001-11-23 | 2005-05-12 | 나그라아이디 에스.에이. | 적어도 하나의 전자부품을 포함하는 모듈 제조방법 |
US7037455B2 (en) * | 2001-12-21 | 2006-05-02 | Mattel, Inc. | Insert molding method |
JP4094394B2 (ja) * | 2002-09-30 | 2008-06-04 | 株式会社ルネサステクノロジ | Icカードおよびその製造方法 |
DE10340129B4 (de) * | 2003-08-28 | 2006-07-13 | Infineon Technologies Ag | Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben |
US7573048B2 (en) * | 2004-10-08 | 2009-08-11 | Patel Gordhanbhai N | Tamper resistant self indicating instant alert radiation dosimeter |
US7225537B2 (en) * | 2005-01-27 | 2007-06-05 | Cardxx, Inc. | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
US8012809B2 (en) | 2005-03-23 | 2011-09-06 | Cardxx, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
US7237724B2 (en) * | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
US7607249B2 (en) * | 2005-07-15 | 2009-10-27 | Innovatier Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
FR2895548B1 (fr) * | 2005-12-26 | 2008-03-21 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee |
EP2013821B1 (fr) * | 2006-04-10 | 2011-10-12 | Innovatier, Inc. | Module électronique intercalaire pour cartes électroniques et étiquettes, carte électronique et méthode de fabrication de tels modules intercalaires et cartes |
AU2007263131B2 (en) * | 2006-06-19 | 2012-02-16 | Nagravision S.A. | Method of fabricating cards each comprising an electronic module and intermediate products |
JP5395660B2 (ja) * | 2006-06-19 | 2014-01-22 | ナグライデ・エス アー | 少なくとも1つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物 |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
US20080055824A1 (en) * | 2006-08-25 | 2008-03-06 | Innovatier, Inc. | Battery powered device having a protective frame |
US20080160397A1 (en) * | 2006-08-25 | 2008-07-03 | Innovatier, Inc | Battery powered device having a protective frame |
US7736568B2 (en) | 2006-09-19 | 2010-06-15 | Mattel, Inc. | Systems and methods of incorporating preformed items into a molded article |
ES2393884T3 (es) * | 2007-02-09 | 2012-12-28 | Nagraid S.A. | Procedimiento de fabricación de tarjetas electrónicas comprendiendo al menos un motivo impreso |
TW200845844A (en) * | 2007-03-23 | 2008-11-16 | Innovatier Inc | A step card and method for making a step card |
US20080282540A1 (en) * | 2007-05-14 | 2008-11-20 | Innovatier, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
US20090096614A1 (en) * | 2007-10-15 | 2009-04-16 | Innovatier, Inc. | Rfid power bracelet and method for manufacturing a rfid power bracelet |
US20090181215A1 (en) * | 2008-01-15 | 2009-07-16 | Innovatier, Inc. | Plastic card and method for making a plastic card |
US8080444B2 (en) * | 2010-01-14 | 2011-12-20 | Freescale Semiconductor, Inc. | Method for forming a packaged semiconductor device having a ground plane |
RU2564103C2 (ru) | 2010-04-05 | 2015-09-27 | Инноватиер, Инк. | Подлежащая ламинированию основа и способ изготовления подлежащей ламинированию основы для электронных карт и этикеток |
US8950681B2 (en) | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD691610S1 (en) | 2011-11-07 | 2013-10-15 | Blackberry Limited | Device smart card |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
WO2017066464A1 (fr) | 2015-10-14 | 2017-04-20 | Capital One Services, Llc | Poche moulée pendant la fabrication d'une carte de transaction |
US11166363B2 (en) | 2019-01-11 | 2021-11-02 | Tactotek Oy | Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node |
WO2023034642A1 (fr) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulation d'une incrustation métallique avec de la résine thermodurcissable et procédé de fabrication d'une carte de transaction métallique |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1219570A (en) * | 1967-08-04 | 1971-01-20 | Lucas Industries Ltd | Diode units |
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
JPS55120153A (en) * | 1979-03-08 | 1980-09-16 | Toshiba Corp | Resin molded semiconductor device |
US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS60189587A (ja) * | 1984-03-09 | 1985-09-27 | Dainippon Printing Co Ltd | Icカ−ド |
JPS60217492A (ja) * | 1984-04-12 | 1985-10-31 | Sony Corp | カ−ド状小型電子機器 |
JPS60252992A (ja) * | 1984-05-30 | 1985-12-13 | Toshiba Corp | Icカ−ド |
JPS61188871U (fr) * | 1985-05-16 | 1986-11-25 | ||
JPS6232094A (ja) * | 1985-08-05 | 1987-02-12 | カシオ計算機株式会社 | Icカ−ド |
JPS62154868U (fr) * | 1985-08-09 | 1987-10-01 | ||
US4701999A (en) * | 1985-12-17 | 1987-10-27 | Pnc, Inc. | Method of making sealed housings containing delicate structures |
JPS62220397A (ja) * | 1986-03-20 | 1987-09-28 | 新光電気工業株式会社 | Icカ−ド |
JPH074995B2 (ja) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | Icカ−ド及びその製造方法 |
JPS63144095A (ja) * | 1986-12-09 | 1988-06-16 | 株式会社東芝 | Icカ−ド |
JPS63233893A (ja) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Icカ−ドの製造方法 |
FR2617666B1 (fr) * | 1987-07-02 | 1989-10-27 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
US4916522A (en) * | 1988-04-21 | 1990-04-10 | American Telephone And Telegraph Company , At & T Bell Laboratories | Integrated circuit package using plastic encapsulant |
US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
FR2636453B1 (fr) * | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | Procede d'encapsulation de circuits-integres notamment pour cartes a puces |
JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Icカード |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
US5214846A (en) * | 1991-04-24 | 1993-06-01 | Sony Corporation | Packaging of semiconductor chips |
-
1990
- 1990-07-25 JP JP2200706A patent/JP2560895B2/ja not_active Expired - Lifetime
-
1991
- 1991-07-09 US US07/727,448 patent/US5272374A/en not_active Expired - Fee Related
- 1991-07-24 FR FR9109363A patent/FR2665280B1/fr not_active Expired - Fee Related
-
1995
- 1995-02-06 US US08/384,218 patent/US5498388A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5498388A (en) | 1996-03-12 |
JPH0482799A (ja) | 1992-03-16 |
JP2560895B2 (ja) | 1996-12-04 |
FR2665280A1 (fr) | 1992-01-31 |
US5272374A (en) | 1993-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |