FR2805639B1 - Procede de fixation d'un module a un corps de carte - Google Patents

Procede de fixation d'un module a un corps de carte

Info

Publication number
FR2805639B1
FR2805639B1 FR0002522A FR0002522A FR2805639B1 FR 2805639 B1 FR2805639 B1 FR 2805639B1 FR 0002522 A FR0002522 A FR 0002522A FR 0002522 A FR0002522 A FR 0002522A FR 2805639 B1 FR2805639 B1 FR 2805639B1
Authority
FR
France
Prior art keywords
attaching
module
card body
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0002522A
Other languages
English (en)
Other versions
FR2805639A1 (fr
Inventor
Jean Noel Audoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes SA filed Critical Schlumberger Systemes SA
Priority to FR0002522A priority Critical patent/FR2805639B1/fr
Priority to PCT/FR2001/000556 priority patent/WO2001065482A1/fr
Publication of FR2805639A1 publication Critical patent/FR2805639A1/fr
Application granted granted Critical
Publication of FR2805639B1 publication Critical patent/FR2805639B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
FR0002522A 2000-02-29 2000-02-29 Procede de fixation d'un module a un corps de carte Expired - Fee Related FR2805639B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0002522A FR2805639B1 (fr) 2000-02-29 2000-02-29 Procede de fixation d'un module a un corps de carte
PCT/FR2001/000556 WO2001065482A1 (fr) 2000-02-29 2001-02-26 Procede de fixation d'un module a un corps de carte a puce

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0002522A FR2805639B1 (fr) 2000-02-29 2000-02-29 Procede de fixation d'un module a un corps de carte

Publications (2)

Publication Number Publication Date
FR2805639A1 FR2805639A1 (fr) 2001-08-31
FR2805639B1 true FR2805639B1 (fr) 2002-05-24

Family

ID=8847514

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0002522A Expired - Fee Related FR2805639B1 (fr) 2000-02-29 2000-02-29 Procede de fixation d'un module a un corps de carte

Country Status (2)

Country Link
FR (1) FR2805639B1 (fr)
WO (1) WO2001065482A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006026032B8 (de) 2006-06-01 2012-09-20 Carl Zeiss Smt Gmbh Beleuchtungssystem zur Ausleuchtung eines vorgegebenen Beleuchtungsfeldes einer Objektoberfläche mit EUV-Strahlung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
DE19828653A1 (de) * 1998-06-26 2000-01-05 Siemens Ag Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
FR2805639A1 (fr) 2001-08-31
WO2001065482A1 (fr) 2001-09-07

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Legal Events

Date Code Title Description
ST Notification of lapse