FR2651373B1 - Dispositif a semi-conducteurs a boitier en resine. - Google Patents

Dispositif a semi-conducteurs a boitier en resine.

Info

Publication number
FR2651373B1
FR2651373B1 FR9010653A FR9010653A FR2651373B1 FR 2651373 B1 FR2651373 B1 FR 2651373B1 FR 9010653 A FR9010653 A FR 9010653A FR 9010653 A FR9010653 A FR 9010653A FR 2651373 B1 FR2651373 B1 FR 2651373B1
Authority
FR
France
Prior art keywords
semiconductor device
resin package
package
resin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9010653A
Other languages
English (en)
Other versions
FR2651373A1 (fr
Inventor
Kazunari Michii
Masataka Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2651373A1 publication Critical patent/FR2651373A1/fr
Application granted granted Critical
Publication of FR2651373B1 publication Critical patent/FR2651373B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
FR9010653A 1989-08-28 1990-08-24 Dispositif a semi-conducteurs a boitier en resine. Expired - Fee Related FR2651373B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1218660A JPH0810744B2 (ja) 1989-08-28 1989-08-28 半導体装置

Publications (2)

Publication Number Publication Date
FR2651373A1 FR2651373A1 (fr) 1991-03-01
FR2651373B1 true FR2651373B1 (fr) 1996-07-19

Family

ID=16723427

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9010653A Expired - Fee Related FR2651373B1 (fr) 1989-08-28 1990-08-24 Dispositif a semi-conducteurs a boitier en resine.

Country Status (4)

Country Link
US (1) US5067005A (fr)
JP (1) JPH0810744B2 (fr)
DE (1) DE4027072C2 (fr)
FR (1) FR2651373B1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196725A (en) * 1990-06-11 1993-03-23 Hitachi Cable Limited High pin count and multi-layer wiring lead frame
JP2501950B2 (ja) * 1990-11-06 1996-05-29 三菱電機株式会社 半導体装置
JPH0828394B2 (ja) * 1990-11-28 1996-03-21 三菱電機株式会社 半導体装置
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
CA2120464A1 (fr) * 1992-02-18 1993-08-19 Bidyut K. Bhattacharyya Emballage en plastique moule multicouches produit par la technologie mesonique
JPH0629428A (ja) * 1992-07-07 1994-02-04 Mitsubishi Electric Corp 半導体装置
JPH06295962A (ja) * 1992-10-20 1994-10-21 Ibiden Co Ltd 電子部品搭載用基板およびその製造方法並びに電子部品搭載装置
US5311057A (en) * 1992-11-27 1994-05-10 Motorola Inc. Lead-on-chip semiconductor device and method for making the same
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
JP2697547B2 (ja) * 1993-03-11 1998-01-14 日本電気株式会社 半導体集積回路装置
US5371403A (en) * 1993-09-24 1994-12-06 Vlsi Technology, Inc. High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines
JP3201187B2 (ja) * 1994-12-08 2001-08-20 富士電機株式会社 半導体装置
US5848082A (en) * 1995-08-11 1998-12-08 Sdl, Inc. Low stress heatsink and optical system
US5770969A (en) * 1995-08-22 1998-06-23 International Business Machines Corporation Controllable decoupling capacitor
US5828259A (en) * 1996-11-18 1998-10-27 International Business Machines Corporation Method and apparatus for reducing disturbances on an integrated circuit
JP2933554B2 (ja) * 1996-11-28 1999-08-16 九州日本電気株式会社 半導体装置およびその製造方法
US6075288A (en) 1998-06-08 2000-06-13 Micron Technology, Inc. Semiconductor package having interlocking heat sinks and method of fabrication
WO2001048820A1 (fr) 1999-12-24 2001-07-05 Fujitsu Limited Dispositif en semi-conducteur comportant une puce nue de semi-conducteur montee par soudage par billes, et element de carte a condensateur en couche mince pour puce nue de semi-conducteur montee par soudage par billes
US6806568B2 (en) * 2001-07-20 2004-10-19 The Board Of Trustees Of The University Of Arkansas Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods
US7038305B1 (en) 2003-07-15 2006-05-02 Altera Corp. Package for integrated circuit die
KR100535181B1 (ko) * 2003-11-18 2005-12-09 삼성전자주식회사 디커플링 커패시터를 갖는 반도체 칩 패키지와 그 제조 방법
US7741706B2 (en) * 2006-09-29 2010-06-22 Microsemi Corporation Plastic surface mount large area power device
CN201011655Y (zh) * 2007-01-10 2008-01-23 上海凯虹科技电子有限公司 一种大功率半导体器件的框架
WO2008108350A1 (fr) * 2007-03-08 2008-09-12 Nec Corporation Élément de condensateur, carte de circuits imprimés, boîtier semi-conducteur et circuit semi-conducteur

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
CA1188010A (fr) * 1981-05-06 1985-05-28 Leonard W. Schaper Boitier pour puce a semiconducteurs
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
CA1238959A (fr) * 1984-08-09 1988-07-05 Robert R. Rohloff Ruban gomme de montage
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法
DE3675321D1 (de) * 1985-08-16 1990-12-06 Dai Ichi Seiko Co Ltd Halbleiteranordnung mit packung vom steckerstifttyp.
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
JPH0758744B2 (ja) * 1987-04-02 1995-06-21 イビデン株式会社 半導体塔載用基板の製造方法
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
JPS63312661A (ja) * 1987-06-15 1988-12-21 Nec Ic Microcomput Syst Ltd 半導体装置用パッケ−ジ
JPH01132142A (ja) * 1987-08-05 1989-05-24 Mitsubishi Electric Corp 半導体装置のパツケージ構造
JPH01208851A (ja) * 1988-02-16 1989-08-22 Nec Corp 電子部品の実装構造

Also Published As

Publication number Publication date
JPH0383368A (ja) 1991-04-09
JPH0810744B2 (ja) 1996-01-31
DE4027072C2 (de) 1998-09-24
FR2651373A1 (fr) 1991-03-01
US5067005A (en) 1991-11-19
DE4027072A1 (de) 1991-03-21

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080430