FR2534279B1 - Bain pour depot galvanoplastique d'etain, de plomb ou d'alliage d'etain-plomb et procede l'utilisant pour revetir des metaux - Google Patents

Bain pour depot galvanoplastique d'etain, de plomb ou d'alliage d'etain-plomb et procede l'utilisant pour revetir des metaux

Info

Publication number
FR2534279B1
FR2534279B1 FR8316021A FR8316021A FR2534279B1 FR 2534279 B1 FR2534279 B1 FR 2534279B1 FR 8316021 A FR8316021 A FR 8316021A FR 8316021 A FR8316021 A FR 8316021A FR 2534279 B1 FR2534279 B1 FR 2534279B1
Authority
FR
France
Prior art keywords
tin
lead
bath
same
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8316021A
Other languages
English (en)
Other versions
FR2534279A1 (fr
Inventor
Obata Keigo
Dohi Nobuyasu
Okuhama Yoshiaki
Masaki Seishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiwa Fine Chemicals Co Ltd
Original Assignee
Daiwa Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa Fine Chemicals Co Ltd filed Critical Daiwa Fine Chemicals Co Ltd
Publication of FR2534279A1 publication Critical patent/FR2534279A1/fr
Application granted granted Critical
Publication of FR2534279B1 publication Critical patent/FR2534279B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR8316021A 1982-10-08 1983-10-07 Bain pour depot galvanoplastique d'etain, de plomb ou d'alliage d'etain-plomb et procede l'utilisant pour revetir des metaux Expired FR2534279B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57176365A JPS5967387A (ja) 1982-10-08 1982-10-08 すず、鉛及びすず―鉛合金メッキ浴

Publications (2)

Publication Number Publication Date
FR2534279A1 FR2534279A1 (fr) 1984-04-13
FR2534279B1 true FR2534279B1 (fr) 1986-09-19

Family

ID=16012338

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8316021A Expired FR2534279B1 (fr) 1982-10-08 1983-10-07 Bain pour depot galvanoplastique d'etain, de plomb ou d'alliage d'etain-plomb et procede l'utilisant pour revetir des metaux

Country Status (4)

Country Link
US (1) US4459185A (fr)
JP (1) JPS5967387A (fr)
CA (1) CA1222476A (fr)
FR (1) FR2534279B1 (fr)

Families Citing this family (89)

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US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
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US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4565609A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
JPH079076B2 (ja) * 1984-08-16 1995-02-01 兵庫県 すず―鉛合金メッキ浴
DE3464505D1 (en) * 1984-08-22 1987-08-06 Hyogo Prefecture Tin-lead alloy plating bath
US4555314A (en) * 1984-09-10 1985-11-26 Obata, Dohi, Daiwa Fine Chemicals Co. Ltd. Tin-lead alloy plating bath
JPS6173896A (ja) * 1984-09-18 1986-04-16 Nippon Steel Corp 酸性錫メツキ浴用添加剤
DE3440668A1 (de) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
JPS61194194A (ja) * 1985-02-22 1986-08-28 Keigo Obata すず、鉛又ははんだメツキ浴
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4589962A (en) * 1985-06-03 1986-05-20 National Semiconductor Corporation Solder plating process and semiconductor product
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
EP0265588A1 (fr) * 1986-10-01 1988-05-04 Pennwalt Corporation Bain électrolytique à pH moderé pour l'électroplacage
JPS63128194A (ja) * 1986-11-18 1988-05-31 Okuno Seiyaku Kogyo Kk 錫−鉛合金めつき浴
JPS63161185A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−錫めつき材の製造法
JPS63161186A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−処理錫−鉛合金めつき材の製造方法
JPS63161183A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−処理錫めつき材の製造方法
JPS63161184A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−錫めつき材の製造方法
JPS63161187A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−半田めつき材の製造方法
JPS63161188A (ja) * 1986-12-24 1988-07-04 Nippon Mining Co Ltd リフロ−半田めつき材の製造法
JPS63162894A (ja) * 1986-12-26 1988-07-06 Nippon Mining Co Ltd リフロ−錫めつき材の製造方法
JP2763072B2 (ja) * 1987-11-13 1998-06-11 エヌ・イーケムキヤツト 株式会社 錫‐ニツケル合金めつき液
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US4994155A (en) * 1988-12-09 1991-02-19 Learonal, Inc. High speed tin, lead or tin/lead alloy electroplating
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US4923576A (en) * 1988-07-06 1990-05-08 Technic, Inc. Additives for electroplating compositions and methods for their use
US4981564A (en) * 1988-07-06 1991-01-01 Technic Inc. Additives for electroplating compositions and methods for their use
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
DE3934866A1 (de) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten
JPH03146689A (ja) * 1989-10-31 1991-06-21 Nec Kansai Ltd 半田および錫メッキ液
JPH0499888A (ja) * 1990-08-20 1992-03-31 Nikko Kyodo Co Ltd リフローはんだめっき浴
JPH0713299B2 (ja) * 1990-10-22 1995-02-15 株式会社コサク 無電解はんだめっき浴組成物
JP2732947B2 (ja) * 1990-12-26 1998-03-30 日鉱金属 株式会社 リフロー錫及びリフローはんだめっき材の製造方法
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
US5282953A (en) * 1993-06-28 1994-02-01 Technic Incorporated Polyoxyalklene compounds terminated with ketone groups for use as surfactants in alkanesulfonic acid based solder plating baths
US5651873A (en) * 1994-06-30 1997-07-29 Mitsubishi Materials Corporation Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
US5538617A (en) * 1995-03-08 1996-07-23 Bethlehem Steel Corporation Ferrocyanide-free halogen tin plating process and bath
US5562814A (en) * 1995-09-01 1996-10-08 Dale Electronics, Inc. Sludge-limiting tin and/or lead electroplating bath
US6217738B1 (en) 1995-10-17 2001-04-17 Macdermid, Inc. Tin plating electrolyte compositions
CN1064722C (zh) * 1998-12-25 2001-04-18 清华大学 一种用于甲磺酸铅、锡电镀液的光亮整平剂
US6248228B1 (en) 1999-03-19 2001-06-19 Technic, Inc. And Specialty Chemical System, Inc. Metal alloy halide electroplating baths
US6179985B1 (en) 1999-03-19 2001-01-30 Technic, Inc. Metal alloy fluoroborate electroplating baths
US6251253B1 (en) 1999-03-19 2001-06-26 Technic, Inc. Metal alloy sulfate electroplating baths
US6562220B2 (en) 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
US6183619B1 (en) 1999-03-19 2001-02-06 Technic, Inc. Metal alloy sulfonic acid electroplating baths
JP4897187B2 (ja) * 2002-03-05 2012-03-14 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． スズメッキ方法
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
US7195702B2 (en) * 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
US7205352B2 (en) * 2003-12-17 2007-04-17 Ethox Chemicals, Llc Dispersions containing fatty acid esters of styrenated phenol alkoxylates
US7271211B2 (en) * 2003-12-17 2007-09-18 Ethox Chemicals, Llc Dispersions containing fatty acid esters of styrenated phenol alkoxylates
JP2008522030A (ja) * 2004-11-29 2008-06-26 テクニック・インコーポレイテッド ほぼ中性ｐＨのスズ電気めっき用溶液
TW200712254A (en) * 2005-06-24 2007-04-01 Technic Silver barrier layers to minimize whisker growth tin electrodeposits
KR20080024525A (ko) * 2005-07-11 2008-03-18 테크닉,인코포레이티드 주석 위스커 성장을 최소화시키는 성질 또는 특성을 갖는주석 전착물
US7713859B2 (en) * 2005-08-15 2010-05-11 Enthone Inc. Tin-silver solder bumping in electronics manufacture
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
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JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
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US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
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Also Published As

Publication number Publication date
FR2534279A1 (fr) 1984-04-13
JPH034631B2 (fr) 1991-01-23
US4459185A (en) 1984-07-10
JPS5967387A (ja) 1984-04-17
CA1222476A (fr) 1987-06-02

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