FR2547318B1 - Composition d'electrolyte et procede pour le depot electrolytique de cuivre - Google Patents

Composition d'electrolyte et procede pour le depot electrolytique de cuivre

Info

Publication number
FR2547318B1
FR2547318B1 FR848409048A FR8409048A FR2547318B1 FR 2547318 B1 FR2547318 B1 FR 2547318B1 FR 848409048 A FR848409048 A FR 848409048A FR 8409048 A FR8409048 A FR 8409048A FR 2547318 B1 FR2547318 B1 FR 2547318B1
Authority
FR
France
Prior art keywords
copper
electrolyte composition
electrolytic deposition
electrolytic
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR848409048A
Other languages
English (en)
Other versions
FR2547318A1 (fr
Inventor
Daniel J Combs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of FR2547318A1 publication Critical patent/FR2547318A1/fr
Application granted granted Critical
Publication of FR2547318B1 publication Critical patent/FR2547318B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
FR848409048A 1983-06-10 1984-06-08 Composition d'electrolyte et procede pour le depot electrolytique de cuivre Expired - Lifetime FR2547318B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10

Publications (2)

Publication Number Publication Date
FR2547318A1 FR2547318A1 (fr) 1984-12-14
FR2547318B1 true FR2547318B1 (fr) 1990-05-04

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
FR848409048A Expired - Lifetime FR2547318B1 (fr) 1983-06-10 1984-06-08 Composition d'electrolyte et procede pour le depot electrolytique de cuivre

Country Status (10)

Country Link
JP (1) JPS6013090A (fr)
AU (1) AU554236B2 (fr)
BR (1) BR8402811A (fr)
CA (1) CA1255621A (fr)
DE (1) DE3420999A1 (fr)
ES (1) ES533252A0 (fr)
FR (1) FR2547318B1 (fr)
GB (1) GB2141140B (fr)
IT (1) IT1177785B (fr)
NL (1) NL8401841A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (fr) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE520209A (fr) * 1952-05-26
BE520210A (fr) * 1952-05-26
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (fr) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
CA1050924A (fr) * 1975-03-11 1979-03-20 Hans-Gerhard Creutz Electrodeposition du cuivre
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
IT1177785B (it) 1987-08-26
CA1255621A (fr) 1989-06-13
IT8448351A0 (it) 1984-06-08
ES8601336A1 (es) 1985-10-16
DE3420999C2 (fr) 1987-10-15
AU554236B2 (en) 1986-08-14
ES533252A0 (es) 1985-10-16
JPS6013090A (ja) 1985-01-23
AU2903384A (en) 1984-12-13
FR2547318A1 (fr) 1984-12-14
GB8414862D0 (en) 1984-07-18
JPS6112036B2 (fr) 1986-04-05
DE3420999A1 (de) 1984-12-13
GB2141140A (en) 1984-12-12
GB2141140B (en) 1986-12-10
BR8402811A (pt) 1985-05-21
NL8401841A (nl) 1985-01-02

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Legal Events

Date Code Title Description
ST Notification of lapse